IEC 60749-9:2017
Current
The latest, up-to-date edition.
Semiconductor devices - Mechanical and climatic test methods - Part 9: Permanence of marking
Hardcopy , PDF , PDF 3 Users , PDF 5 Users , PDF 9 Users
English - French, English
03-03-2017
FOREWORD
1 Scope
2 Normative references
3 Terms and definitions
4 Equipment
5 Safety precautions
6 Procedure
7 Failure criteria
8 Summary
Bibliography
IEC 60749-9:2017 is to determine whether the marks on solid state semiconductor devices will remain legible when subjected to the application and removal of labels or the use of solvents and cleaning solutions commonly used during the removal of solder flux residue from the printed circuit board manufacturing process.
This test is applicable for all package types. It is suitable for use in qualification and/or process monitor testing. The test is considered non-destructive. Electrical or mechanical rejects can be used for the purpose of this test.
This edition includes the following significant technical changes with respect to the previous edition:
a) revision to Clause 4 Equipment by a complete rewriting of Clause 3 Terms and definitions;
b) additional variant – ‘adhesive tape pull test’.
Committee |
TC 47
|
DevelopmentNote |
Supersedes IEC PAS 62175 (08/2002) Supersedes IEC 60749. (03/2008) Stability Date: 2022. (03/2017)
|
DocumentType |
Standard
|
ISBN |
978-2-8322-7383-8
|
Pages |
17
|
PublisherName |
International Electrotechnical Committee
|
Status |
Current
|
Supersedes |
Standards | Relationship |
NF EN 60749-9:2017 | Identical |
EN 60749-9:2017 | Identical |
CEI EN 60749-9 : 2004 | Identical |
PN EN 60749-9 : 2017 | Identical |
BS EN 60749-9:2002 | Identical |
NEN EN IEC 60749-9 : 2017 | Identical |
DIN EN 60749-9:2016-09 (Draft) | Identical |
UNE-EN 60749-9:2017 | Identical |
PNE-prEN 60749-9:2016 | Identical |
NF EN 60749-9 : 2002 | Identical |
BS EN 60749-9:2017 | Identical |
UNE-EN 60749-9:2003 | Identical |
13/30264591 DC : 0 | BS EN 60747-14-6 ED 1.0 - SEMICONDUCTOR DEVICES - PART 14-6: SEMICONDUCTOR SENSORS - HUMIDITY SENSOR |
EN 60749-3:2017 | Semiconductor devices - Mechanical and climatic test methods - Part 3: External visual examination |
IEC TS 62686-1:2015 | Process management for avionics - Electronic components for aerospace, defence and high performance (ADHP) applications - Part 1: General requirements for high reliability integrated circuits and discrete semiconductors |
BS EN 60749-3:2017 | Semiconductor devices. Mechanical and climatic test methods External visual examination |
13/30264600 DC : 0 | BS EN 60747-14-8 ED 1.0 - SEMICONDUCTOR DEVICES - PART 14-8: SEMICONDUCTOR SENSORS - CAPACITIVE DEGRADATION SENSOR OF LIQUID |
I.S. EN 60749-3:2017 | SEMICONDUCTOR DEVICES - MECHANICAL AND CLIMATIC TEST METHODS - PART 3: EXTERNAL VISUAL EXAMINATION |
IEC 60749-3:2017 | Semiconductor devices - Mechanical and climatic test methods - Part 3: External visual examination |
PD IEC/TS 62686-1:2015 | Process management for avionics. Electronic components for aerospace, defence and high performance (ADHP) applications General requirements for high reliability integrated circuits and discrete semiconductors |
13/30264596 DC : 0 | BS EN 60747-14-7 ED 1.0 - SEMICONDUCTOR DEVICES - PART 14-7: SEMICONDUCTOR SENSORS - FLOW METER |
IEC 61340-2-3:2016 | Electrostatics - Part 2-3: Methods of test for determining the resistance and resistivity of solid materials used to avoid electrostatic charge accumulation |
FED-STD-101 Revision C:1980 | TEST PROCEDURES FOR PACKAGING MATERIALS |
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