IEC 61182-2-2:2012
Withdrawn
A Withdrawn Standard is one, which is removed from sale, and its unique number can no longer be used. The Standard can be withdrawn and not replaced, or it can be withdrawn and replaced by a Standard with a different number.
Printed board assembly products - Manufacturing description data and transfer methodology - Part 2-2: Sectional requirements for implementation of printed board fabrication data description
Hardcopy , PDF
English, English - French
27-04-2012
31-12-2021
FOREWORD
1 Scope
2 Normative references
3 Terms and definitions
4 General principles
5 General rules
6 Modeling
7 Report generators
8 Glossary
Annex A (normative) - Printed board
fabrication schema
Bibliography
IEC 61182-2-2:2012 provides the information on the manufacturing requirements used for fabricating printed boards. This standard determines the XML schema details, defined in the generic standard IEC 61182-2 and some of the sectional standards that are required to accomplish the focused tasks. When other standards are invoked, their requirements become a mandatory part of the fabrication details as defined in the IEC 61182-2.
| Committee |
TC 91
|
| DocumentType |
Standard
|
| Pages |
94
|
| PublisherName |
International Electrotechnical Committee
|
| Status |
Withdrawn
|
| Standards | Relationship |
| NF EN 61182-2-2 : 2012 | Identical |
| NBN EN 61182-2-2 : 2012 | Identical |
| NEN EN IEC 61182-2-2 : 2012 | Identical |
| PN EN 61182-2-2 : 2012 | Identical |
| BS EN 61182-2-2:2012 | Identical |
| CEI EN 61182-2-2 : 2013 | Identical |
| EN 61182-2-2:2012 | Identical |
| DIN EN 61182-2-2:2013-08 | Identical |
| UNE-EN 61182-2-2:2012 | Identical |
| ANSI Y14.5 : 1973 | DIMENSIONING AND TOLERANCING FOR ENGINEERING DRAWINGS |
| IEC 61182-2:2006 | Printed board assembly products - Manufacturing description data and transfer methodology - Part 2: Generic requirements |
| IEC 61188-5-3:2007 | Printed boards and printed board assemblies - Design and use - Part 5-3: Attachment (land/joint) considerations - Components with gull-wing leads on two sides |
| IEC 61188-5-2:2003 | Printed boards and printed board assemblies - Design and use - Part 5-2: Attachment (land/joint) considerations - Discrete components |
| IEC 61188-5-8:2007 | Printed board and printed board assemblies - Design and use - Part 5-8: Attachment (land/joint) considerations - Area array components (BGA, FBGA, CGA, LGA) |
| DOD STD 100 : C NOTICE 6 | ENGINEERING DRAWING PRACTICES |
| ISO 10303-212:2001 | Industrial automation systems and integration — Product data representation and exchange — Part 212: Application protocol: Electrotechnical design and installation |
| ANSI Z210.1 : LATEST | METRIC PRACTICE GUIDE |
| IEC 61188-5-6:2003 | Printed boards and printed board assemblies - Design and use - Part 5-6: Attachment (land/joint) considerations - Chip carriers with J-leads on four sides |
| IEC 61188-5-1:2002 | Printed boards and printed board assemblies - Design and use - Part 5-1: Attachment (land/joint) considerations - Generic requirements |
| IEC 60194:2015 | Printed board design, manufacture and assembly - Terms and definitions |
| IEC 61188-5-5:2007 | Printed boards and printed board assemblies - Design and use - Part 5-5: Attachment (land/joint) considerations - Components with gull-wing leads on four sides |
| ISO 10303-210:2011 | Industrial automation systems and integration — Product data representation and exchange — Part 210: Application protocol: Electronic assembly, interconnect, and packaging design |
| IEC 61188-5-4:2007 | Printed boards and printed board assemblies - Design and use - Part 5-4: Attachment (land/joint) considerations - Components with J leads on two sides |
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