IEC 62047-1:2016
Current
Current
The latest, up-to-date edition.
Semiconductor devices - Micro-electromechanical devices - Part 1: Terms and definitions
Available format(s)
Hardcopy , PDF , PDF 3 Users , PDF 5 Users , PDF 9 Users
Language(s)
English - French
Published date
06-01-2016
Publisher
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IEC 62047-1:2016 defines terms for micro-electromechanical devices including the process of production of such devices. This edition includes the following significant technical changes with respect to the previous edition:
a) removal of ten terms;
b) revision of twelve terms;
c) addition of sixteen new terms.
| Committee |
TC 47/SC 47F
|
| DevelopmentNote |
Stability Date: 2019. (01/2016)
|
| DocumentType |
Standard
|
| Pages |
66
|
| PublisherName |
International Electrotechnical Committee
|
| Status |
Current
|
| Supersedes |
| Standards | Relationship |
| NF EN 62047-1 : 2016 | Identical |
| NBN EN 62047-1 : 2016 | Identical |
| NEN EN IEC 62047-1 : 2016 | Identical |
| SN EN 62047-1:2016 | Identical |
| CEI EN 62047-1 : 2016 | Identical |
| EN 62047-1:2016 | Identical |
| BS EN 62047-1:2016 | Identical |
| UNE-EN 62047-1:2016 | Identical |
| PN EN 62047-1 : 2016 | Identical |
| PNE-FprEN 62047-1 | Identical |
| 10/30211446 DC : 0 | BS EN 62047-11 - SEMICONDUCTOR DEVICES - MICRO-ELECTROMECHANICAL DEVICES - PART 11: TEST METHOD FOR LINEAR THERMAL EXPANSION COEFFICIENTS OF MEMS MATERIALS |
| BS EN 62047-25:2016 | Semiconductor devices. Micro-electromechanical devices Silicon based MEMS fabrication technology. Measurement method of pull-press and shearing strength of micro bonding area |
| I.S. EN 62047-4:2010 | SEMICONDUCTOR DEVICES - MICRO-ELECTROMECHANICAL DEVICES - PART 4: GENERIC SPECIFICATION FOR MEMS |
| 08/30172398 DC : DRAFT FEB 2008 | BS EN 62047-8 - SEMICONDUCTOR DEVICES - MICRO - ELECTROMECHANICAL DEVICES - PART 8: STRIP BENDING TEST METHOD FOR TENSILE PROPERTY MEASUREMENT OF THIN FILMS |
| CEI EN 60876-1 : 2015 | FIBRE OPTIC INTERCONNECTING DEVICES AND PASSIVE COMPONENTS - FIBRE OPTIC SPATIAL SWITCHES - PART 1: GENERIC SPECIFICATION |
| BS EN 62047-4:2010 | Semiconductor devices. Micro-electromechanical devices Generic specification for MEMS |
| BS IEC 60747-14.1 : 2010 | SEMICONDUCTOR DEVICES - PART 14-1: SEMICONDUCTOR SENSORS - GENERIC SPECIFICATION FOR SENSORS |
| 10/30211442 DC : 0 | BS EN 62047-10 - SEMICONDUCTOR DEVICES - MICRO-ELECTROMECHANICAL DEVICES - PART 10: MICROPILLAR COMPRESSION TEST FOR MEMS MATERIALS |
| I.S. EN 62047-14:2012 | SEMICONDUCTOR DEVICES - MICRO-ELECTROMECHANICAL DEVICES - PART 14: FORMING LIMIT MEASURING METHOD OF METALLIC FILM MATERIALS (IEC 62047-14:2012 (EQV)) |
| BS EN 60876-1:2014 | Fibre optic interconnecting devices and passive components. Fibre optic spatial switches Generic specification |
| BS EN 62047-14:2012 | Semiconductor devices. Micro-electromechanical devices Forming limit measuring method of metallic film materials |
| 05/30104054 DC : DRAFT APR 2005 | IEC 62047-3 - SEMICONDUCTOR DEVICES - PART 3: MICRO ELECTROMECHANICAL DEVICES - THIN FILM STANDARD TEST PIECE |
| 13/30288636 DC : 0 | BS EN 60876-1 - FIBRE OPTIC INTERCONNECTING DEVICES AND PASSIVE COMPONENTS - FIBRE OPTIC SPATIAL SWITCHES - PART 1: GENERIC SPECIFICATION |
| I.S. EN 62047-25:2016 | SEMICONDUCTOR DEVICES - MICRO-ELECTROMECHANICAL DEVICES - PART 25: SILICON BASED MEMS FABRICATION TECHNOLOGY - MEASUREMENT METHOD OF PULL-PRESS AND SHEARING STRENGTH OF MICRO BONDING AREA |
| CEI EN 62047-14 : 2013 | SEMICONDUCTOR DEVICES - MICRO-ELECTROMECHANICAL DEVICES - PART 14: FORMING LIMIT MEASURING METHOD OF METALLIC FILM MATERIALS |
| BS EN 62047-1:2016 | Semiconductor devices. Micro-electromechanical devices Terms and definitions |
| 08/30181401 DC : DRAFT APR 2008 | BS IEC 60747-14-1 - SEMICONDUCTOR DEVICES - PART 14-1: SEMICONDUCTOR SENSORS - GENERIC SPECIFICATION FOR SENSORS |
| 17/30355768 DC : 0 | BS IEC 62047-32 ED.1.0 - SEMICONDUCTOR DEVICES - MICRO-ELECTROMECHANICAL DEVICES - PART 32: TEST METHOD FOR THE NONLIEAR VIBRATION OF THE MEMS RESONATORS |
| NF EN 62047-14 : 2012 | SEMICONDUCTOR DEVICES - MICRO-ELECTROMECHANICAL DEVICES - PART 14: FORMING LIMIT MEASURING METHOD OF METALLIC FILM MATERIALS |
| I.S. EN 62047-1:2016 | SEMICONDUCTOR DEVICES - MICRO-ELECTROMECHANICAL DEVICES - PART 1: TERMS AND DEFINITIONS |
| IEC 62047-25:2016 | Semiconductor devices - Micro-electromechanical devices - Part 25: Silicon based MEMS fabrication technology - Measurement method of pull-press and shearing strength of micro bonding area |
| 09/30199223 DC : DRAFT JAN 2009 | BS EN 60876-1 - FIBRE OPTIC INTERCONNECTING DEVICES AND PASSIVE COMPONENTS - FIBRE OPTIC SPATIAL SWITCHES - PART 1: GENERIC SPECIFICATION |
| IEC 60876-1:2014 | Fibre optic interconnecting devices and passive components - Fibre optic spatial switches - Part 1: Generic specification |
| IEC 62047-14:2012 | Semiconductor devices - Micro-electromechanical devices - Part 14: Forming limit measuring method of metallic film materials |
| IEC 62047-4:2008 | Semiconductor devices - Micro-electromechanical devices - Part 4: Generic specification for MEMS |
| EN 62047-14:2012 | Semiconductor devices - Micro-electromechanical devices - Part 14: Forming limit measuring method of metallic film materials |
| EN 62047-4:2010 | Semiconductor devices - Micro-electromechanical devices - Part 4: Generic specification for MEMS |
| CEI EN 62047-4 : 2011 | SEMICONDUCTOR DEVICES - MICRO-ELECTROMECHANICAL DEVICES - PART 4: GENERIC SPECIFICATION FOR MEMS |
| 14/30296140 DC : 0 | BS EN 62047-25 - SEMICONDUCTOR DEVICES - MICRO-ELECTROMECHANICAL DEVICES - PART 25: SILICON-BASED MEMS FABRICATION TECHNOLOGY - MEASUREMENT METHOD OF PULL-PRESS AND SHEARING STRENGTH OF MICRO BONDING AREA |
| CEI EN 62047-25 : 1ED 2017 | SEMICONDUCTOR DEVICES - MICRO-ELECTROMECHANICAL DEVICES - PART 25: SILICON BASED MEMS FABRICATION TECHNOLOGY - MEASUREMENT METHOD OF PULL-PRESS AND SHEARING STRENGTH OF MICRO BONDING AREA |
| 07/30148822 DC : 0 | BS IEC 62047-4 - SEMICONDUCTOR DEVICES - MICRO-ELECTROMECHANICAL DEVICES - PART 4: GENERIC SPECIFICATIONS FOR MEMS |
| IEC 60747-14-1:2010 | Semiconductor devices - Part 14-1: Semiconductor sensors - Generic specification for sensors |
| I.S. EN 60876-1:2014 | FIBRE OPTIC INTERCONNECTING DEVICES AND PASSIVE COMPONENTS - FIBRE OPTIC SPATIAL SWITCHES - PART 1: GENERIC SPECIFICATION |
| EN 60876-1:2014 | Fibre optic interconnecting devices and passive components - Fibre optic spatial switches - Part 1: Generic specification |
| IEC 60050-815:2015 | International Electrotechnical Vocabulary (IEV) - Part 815: Superconductivity |
| ISO 2041:2009 | Mechanical vibration, shock and condition monitoring Vocabulary |
| IEC 60050-521:2002 | International Electrotechnical Vocabulary (IEV) - Part 521: Semiconductor devices and integrated circuits |
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