IEC 62047-6:2009
Current
The latest, up-to-date edition.
Semiconductor devices - Micro-electromechanical devices - Part 6: Axial fatigue testing methods of thin film materials
Hardcopy , PDF , PDF 3 Users , PDF 5 Users , PDF 9 Users
English - French
07-04-2009
FOREWORD
1 Scope
2 Normative references
3 Terms and definitions
4 Test piece
4.1 Design of test piece
4.2 Preparation of test piece
4.3 Test piece thickness
4.4 Storage prior to testing
5 Testing method and test apparatus
5.1 General
5.2 Method of gripping (mounting of test piece)
5.3 Static loading test
5.4 Method of loading
5.5 Speed of testing
5.6 Environment control
6 Endurances (test termination)
7 Test report
Annex A (informative) Technical background of this standard
Annex B (informative) Test piece
Annex C (informative) Displacement measurement
Annex D (informative) Testing environment
Annex E (informative) Number of test pieces
Bibliography
IEC 62047-6:2009 specifies the method for axial tensile-tensile force fatigue testing of thin film materials with a length and width under 1 mm and a thickness in the range between 0,1 µm and 10 µm under constant force range or constant displacement range. Thin films are used as main structural materials for MEMS and micromachines. The main structural materials for MEMS, micromachines, etc., have special features, such as typical dimensions of a few microns, material fabrication by deposition, andtest piece fabrication by means of non-mechanical machining, including photolithography. This International Standard specifies the axial force fatigue testing methods for micro-sized smooth specimens, which enables a guarantee of accuracy corresponding to the special features. The tests are carried out at room temperatures, in air, with loading applied to the test piece along the longitudinal axis.
DevelopmentNote |
Stability Date: 2018. (09/2017)
|
DocumentType |
Standard
|
Pages |
30
|
PublisherName |
International Electrotechnical Committee
|
Status |
Current
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Standards | Relationship |
JIS C 5630-6:2011 | Identical |
NEN EN IEC 62047-6 : 2010 | Identical |
DIN EN 62047-6:2010-07 | Identical |
EN 62047-6:2010 | Identical |
PN EN 62047-6 : 2010 | Identical |
NF EN 62047-6 : 2010 | Identical |
CEI EN 62047-6 : 2011 | Identical |
BS EN 62047-6:2010 | Identical |
I.S. EN 62047-6:2010 | Identical |
UNE-EN 62047-6:2010 | Identical |
PNE-prEN 62047-6 | Identical |
EN 62047-18:2013 | Semiconductor devices - Micro-electromechanical devices - Part 18: Bend testing methods of thin film materials |
11/30230316 DC : 0 | BS EN 62047-18 - SEMICONDUCTOR DEVICES - MICRO-ELECTROMECHANICAL DEVICES - PART 18: BENDING TEST METHODS OF THIN FILM MATERIALS |
BS EN 62047-18:2013 | Semiconductor devices. Micro-electromechanical devices Bend testing methods of thin film materials |
CEI EN 62047-18 : 2014 | SEMICONDUCTOR DEVICES - MICRO-ELECTROMECHANICAL DEVICES - PART 18: BEND TESTING METHODS OF THIN FILM MATERIALS |
I.S. EN 62047-18:2013 | SEMICONDUCTOR DEVICES - MICRO-ELECTROMECHANICAL DEVICES - PART 18: BEND TESTING METHODS OF THIN FILM MATERIALS (IEC 62047-18:2013 (EQV)) |
NF EN 62047-18 : 2014 | SEMICONDUCTOR DEVICES - MICRO-ELECTROMECHANICAL DEVICES - PART 18: BEND TESTING METHODS OF THIN FILM MATERIALS |
IEC 62047-18:2013 | Semiconductor devices - Micro-electromechanical devices - Part 18: Bend testing methods of thin film materials |
ASTM E 466 : 2015 : REDLINE | Standard Practice for Conducting Force Controlled Constant Amplitude Axial Fatigue Tests of Metallic Materials |
ISO 6892:1998 | Metallic materials Tensile testing at ambient temperature |
IEC 62047-2:2006 | Semiconductor devices - Micro-electromechanical devices - Part 2: Tensile testing method of thin film materials |
ASTM E 1823 : 2013-07 | TERMINOLOGY RELATING TO FATIGUE AND FRACTURE TESTING |
ISO 1099:2017 | Metallic materials — Fatigue testing — Axial force-controlled method |
ISO 12107:2012 | Metallic materials — Fatigue testing — Statistical planning and analysis of data |
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