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IEC 63055:2016

Superseded

Superseded

A superseded Standard is one, which is fully replaced by another Standard, which is a new edition of the same Standard.

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Format for LSI-Package-Board Interoperable design

Available format(s)

Hardcopy , PDF , PDF 3 Users , PDF 5 Users , PDF 9 Users

Superseded date

11-10-2023

Superseded by

IEC 63055:2023

Language(s)

English

Published date

08-11-2016

€441.85
Excluding VAT

IEC 63055:2016(E) defines a common interoperable format that will be used for the design of
a) large-scale integration (LSI),
b) packages for such LSI, and
c) printed circuit boards on which the packaged LSI are interconnected. Collectively, such designs are referred to as "LSI-Package-Board" (LPB) designs. The format provides a common way to specify information/data about the project management, netlists, components, design rules, and geometries used in LPB designs. This standard is published as a double logo IEC-IEEE standard.

Committee
TC 91
DevelopmentNote
Also numbered as IEEE 2401. Stability Date: 2021. (11/2016)
DocumentType
Standard
Pages
194
PublisherName
International Electrotechnical Committee
Status
Superseded
SupersededBy

Standards Relationship
BS IEC 63055:2016 Identical

IEEE 1364-2005 IEEE Standard for Verilog Hardware Description Language
IEC 62433-2:2017 EMC IC modelling - Part 2: Models of integrated circuits for EMI behavioural simulation - Conducted emissions modelling (ICEM-CE)
IEC 62433-4:2016 EMC IC modelling - Part 4: Models of integrated circuits for RF immunity behavioural simulation - Conducted immunity modelling (ICIM-CI)
IEEE 1076-2008 REDLINE IEEE Standard VHDL Language Reference Manual
IEC 62433-3:2017 EMC IC modelling - Part 3: Models of integrated circuits for EMI behavioural simulation - Radiated emissions modelling (ICEM-RE)

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