IEC TR 61967-4-1:2005
Current
The latest, up-to-date edition.
Integrated circuits - Measurement of electromagnetic emissions, 150 kHz to 1 GHz - Part 4-1: Measurement of conducted emissions - 1 Ω/150 Ω direct coupling method - Application guidance to IEC 61967-4
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English
07-02-2005
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FOREWORD
1 Scope
2 Normative references
3 Terms and definitions
4 Splitting ICs into IC function modules
4.1 Background
4.2 Benefits
4.3 IC function modules
4.4 Example matrix for splitting ICs into IC function
modules
5 Workflow to perform IC EMC emission tests
5.1 Emission test philosophy
5.2 Flowchart of performing emission tests
6 Test configurations for IC function modules
6.1 EMC test recommendations for IC function modules
6.2 Port selection guide
6.3 Test networks at selected ports
6.4 Supply selection guide
6.5 Test networks at selected supplies
6.6 Parameter initialization of IC function modules
for testing
6.7 Test parameter for performing conducted emission
measurements
7 Test board layout recommendations
7.1 Common test board recommendations
7.2 150 ohm network on 2 layer and multi layer PCB
7.3 1 ohm network on 2 layer and multi-layer PCB
8 Test report
Annex A (normative) IEC 61967-4 test network modification
Annex B (informative) Trace impedance calculation
Annex C (informative) Examples for splitting ICs into IC
function modules
Figures
Serves as an application guidance and relates to IEC 61967-4. The division of IC types into -> IC function modules and the software modules for -> cores with CPU can be used for Parts 3, 5 and 6 of IEC 61967. Gives advice for performing test methods described in IEC 61967-4 by classifying types of integrated circuits (ICs) and providing hints for test applications related to the IC type classification.To obtain comparable results of IC emission measurements using IEC 61967-4, definitions are given which are in addition to the general conditions specified in IEC 61967-1 and IEC 61967-4. These definitions concern IC related operating modes, pins and ports to be tested, test set-ups according IEC 61967-4, including description of load circuits and RF path, and IC related emission limits (or limit classes). Parts of the guidance provided by this technical report may be applicable to other parts of IEC 61967.
| DevelopmentNote |
Stability Date: 2019. (09/2017)
|
| DocumentType |
Technical Report
|
| Pages |
47
|
| PublisherName |
International Electrotechnical Committee
|
| Status |
Current
|
| Standards | Relationship |
| NEN NPR IEC/TR 61967-4-1 : 2005 | Identical |
| PD IEC/TR 61967-4-1:2005 | Identical |
| IEC 61967-2:2005 | Integrated circuits - Measurement of electromagnetic emissions, 150 kHz to 1 GHz - Part 2: Measurement of radiated emissions - TEM cell and wideband TEM cell method |
| IEC 61967-1:2002 | Integrated circuits - Measurement of electromagnetic emissions, 150 kHz to 1 GHz - Part 1: General conditions and definitions |
| IEC 61967-5:2003 | Integrated circuits - Measurement of electromagnetic emissions, 150 kHz to 1 GHz - Part 5: Measurement of conducted emissions - Workbench Faraday Cage method |
| IEC 60050-101:1998 | International Electrotechnical Vocabulary (IEV) - Part 101: Mathematics |
| IEC 61967-4:2002+AMD1:2006 CSV | Integrated circuits - Measurement of electromagnetic emissions, 150 kHz to 1 GHz - Part 4: Measurement of conducted emissions - 1 Ω/150 Ω direct coupling method |
| ISO 9141:1989 | Road vehicles Diagnostic systems Requirements for interchange of digital information |
| IEC 61967-6:2002+AMD1:2008 CSV | Integrated circuits - Measurement of electromagnetic emissions, 150 kHz to 1 GHz - Part 6: Measurement of conducted emissions - Magnetic probe method |
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