• IEC 61967-4:2002+AMD1:2006 CSV

    Superseded A superseded Standard is one, which is fully replaced by another Standard, which is a new edition of the same Standard.

    Integrated circuits - Measurement of electromagnetic emissions, 150 kHz to 1 GHz - Part 4: Measurement of conducted emissions - 1 Ω/150 Ω direct coupling method

    Available format(s):  Hardcopy, PDF, PDF 3 Users, PDF 5 Users, PDF 9 Users

    Superseded date:  31-12-2021

    Language(s):  English - French

    Published date:  27-07-2006

    Publisher:  International Electrotechnical Committee

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    Table of Contents - (Show below) - (Hide below)

    FOREWORD
    1 Scope
    2 Normative references
    3 Definitions
    4 General
      4.1 Measurement basics
      4.2 RF current measurement
      4.3 RF voltage measurement at IC pins
      4.4 Assessment of the measurement technique
    5 Test conditions
    6 Test equipment
      6.1 Test receiver specification
      6.2 RF current probe specification
      6.3 Test of the RF current probe capability
      6.4 Matching network specification
    7 Test set-up
      7.1 General test configuration
      7.2 Printed circuit test board layout
    8 Test procedure
    9 Test report
    Annex A (normative) Probe calibration procedure
    Annex B (informative) Classification of conducted emission
                          levels
      B.1 Introductory remark
      B.2 General
      B.3 Definition of emission levels
      B.4 Presentation of results
    Annex C (informative) Example of reference levels for
                          automotive applications
      C.1 Introductory remark
      C.2 General
      C.3 Reference levels
    Annex D (informative) EMC requirements and how to use EMC IC
                          measurement techniques
      D.1 Introduction
      D.2 Using EMC measurement procedures
      D.3 Assessment of the IC influence to the EMC behaviour
          of the modules
    Annex E (informative) Example of a test set-up consisting of
                          an EMC main test board and an EME IC
                          test board
      E.1 The EMC main test board
      E.2 EME IC test board
    Annex F (informative) 150 ohm direct coupling networks for
                          common mode emission measurements of
                          differential mode data transfer ICs
                          and similar circuits
      F.1 Basic direct coupling network
      F.2 Example of a common-mode coupling network alternative
          for high speed CAN or LVDS or RS485 or similar systems
      F.3 Example of a common-mode coupling network alternative
          for differential IC outputs to resistive loads (e.g.
          airbag ignition driver)
      F.4 Example of a common-mode coupling network for fault
          tolerant CAN systems
    Figures
    Tables

    Abstract - (Show below) - (Hide below)

    Specifies a method to measure the conducted electromagnetic emission (EME) of integrated circuits by direct radio frequency (RF) current measurement with a 1 Ω resistive probe and RF voltage measurement using a 150 Ω coupling network. These methods guarantee a high degree of repeatability and correlation of EME measurements. IEC 61967-1 specifies general conditions and definitions of the test methods. The contents of the corrigendum 1 of June 2017 have been included in this copy.
    This consolidated version consists of the first edition (2002) and its amendment 1 (2006). Therefore, no need to order amendment in addition to this publication.

    General Product Information - (Show below) - (Hide below)

    Committee TC 47/SC 47A
    Development Note Stability Date: 2018. (09/2017)
    Document Type Standard
    Publisher International Electrotechnical Committee
    Status Superseded
    Superseded By

    Standards Referenced By This Book - (Show below) - (Hide below)

    PD IEC/TR 61967-4-1:2005 INTEGRATED CIRCUITS - MEASUREMENT OF ELECTROMAGNETIC EMISSIONS, 150 KHZ TO 1 GHZ - PART 4-1: MEASUREMENT OF CONDUCTED EMISSIONS - 1 OHM/150 OHM DIRECT COUPLING METHOD - APPLICATION GUIDANCE TO IEC 61967-4
    BS EN 62228-2:2017 (published 2017-02) Integrated circuits. EMC evaluation of transceivers LIN transceivers
    I.S. EN 62132-4:2006 INTEGRATED CIRCUITS - MEASUREMENT OF ELECTROMAGNETIC IMMUNITY 150 KHZ TO 1 GHZ - PART 4: DIRECT RF POWER INJECTION METHOD
    IEC 62433-2:2017 EMC IC modelling - Part 2: Models of integrated circuits for EMI behavioural simulation - Conducted emissions modelling (ICEM-CE)
    EN 62132-4 : 2006 INTEGRATED CIRCUITS - MEASUREMENT OF ELECTROMAGNETIC IMMUNITY 150 KHZ TO 1 GHZ - PART 4: DIRECT RF POWER INJECTION METHOD
    EN 61967-5 : 2003 INTEGRATED CIRCUITS - MEASUREMENT OF ELECTROMAGNETIC EMISSIONS, 150 KHZ TO 1 GHZ - PART 5: MEASUREMENT OF CONDUCTED EMISSIONS - WORKBENCH FARADAY CAGE METHOD
    EN 62433-2:2017 EMC IC MODELLING - PART 2: MODELS OF INTEGRATED CIRCUITS FOR EMI BEHAVIOURAL SIMULATION - CONDUCTED EMISSIONS MODELLING (ICEM-CE) (IEC 62433-2:2017)
    10/30209944 DC : 0 BS EN 62215-3 - INTEGRATED CIRCUITS - MEASUREMENT OF IMPULSE IMMUNITY - PART 3: NON-SYNCHRONOUS TRANSIENT INJECTION METHOD
    BS EN 62433-2:2017 EMC IC modelling Models of integrated circuits for EMI behavioural simulation. Conducted emissions modelling (ICEM-CE)
    I.S. EN 62433-2:2017 EMC IC MODELLING - PART 2: MODELS OF INTEGRATED CIRCUITS FOR EMI BEHAVIOURAL SIMULATION - CONDUCTED EMISSIONS MODELLING (ICEM-CE)
    06/30152634 DC : DRAFT JULY 2006
    CEI EN 62228-2 : 1ED 2017 INTEGRATED CIRCUITS - EMC EVALUATION OF TRANSCEIVERS - PART 2: LIN TRANSCEIVERS
    CEI EN 61967-1 : 2002 INTEGRATED CIRCUITS - MEASUREMENT OF ELECTROMAGNETIC EMISSIONS, 150 KHZ TO 1 GHZ - PART 1: GENERAL CONDITIONS AND DEFINITIONS
    BS EN 61967-6 : 2002 INTEGRATED CIRCUITS - MEASUREMENT OF ELECTROMAGNETIC EMISSIONS, 150 KHZ TO 1 GHZ - PART 6: MEASUREMENT OF CONDUCTED EMISSIONS - MAGNETIC PROBE METHOD
    I.S. EN 62228-2:2017 INTEGRATED CIRCUITS - EMC EVALUATION OF TRANSCEIVERS - PART 2: LIN TRANSCEIVERS
    EN IEC 62969-1 : 2018 SEMICONDUCTOR DEVICES - SEMICONDUCTOR INTERFACE FOR AUTOMOTIVE VEHICLES - PART 1: GENERAL REQUIREMENTS OF POWER INTERFACE FOR AUTOMOTIVE VEHICLE SENSORS (IEC 62969-1:2017)
    17/30350017 DC : 0 BS EN 62228-1 - INTEGRATED CIRCUITS - EMC EVALUATION OF TRANSCEIVERS - PART 1: GENERAL CONDITIONS AND DEFINITIONS
    14/30310470 DC : 0 BS EN 62228-2 - INTEGRATED CIRCUITS - EMC EVALUATION OF LIN TRANSCEIVERS
    CEI EN 62132-4 : 2006 CIRCUITS INTEGRES - MESURE DE L'IMMUNITE ELECTROMAGNETIQUE 150 KHZ A 1 GHZ - PARTIE 4: METHODE D'INJECTION DIRECTE DE PUISSANCE RF
    IEC TS 62215-2:2007 Integrated circuits - Measurement of impulse immunity - Part 2: Synchronous transient injection method
    IEC TS 62228:2007 Integrated circuits - EMC evaluation of CAN transceivers
    I.S. EN 61967-5:2003 INTEGRATED CIRCUITS - MEASUREMENT OF ELECTROMAGNETIC EMISSIONS, 150 KHZ TO 1 GHZ - PART 5: MEASUREMENT OF CONDUCTED EMISSIONS - WORKBENCH FARADAY CAGE METHOD
    IEC 61967-5:2003 Integrated circuits - Measurement of electromagnetic emissions, 150 kHz to 1 GHz - Part 5: Measurement of conducted emissions - Workbench Faraday Cage method
    IEC 62969-1:2017 Semiconductor devices - Semiconductor interface for automotive vehicles - Part 1: General requirements of power interface for automotive vehicle sensors
    15/30320811 DC : 0 BS EN 62433-2 - EMC IC MODELING - PART 2: MODELS OF INTEGRATED CIRCUITS FOR EMI BEHAVIOURAL SIMULATION - CONDUCTED EMISSIONS MODELING (ICEM-CE)
    BS EN 61967-5:2003 INTEGRATED CIRCUITS - MEASUREMENT OF ELECTROMAGNETIC EMISSIONS, 150 KHZ TO 1 GHZ - PART 5: MEASUREMENT OF CONDUCTED EMISSIONS - WORKBENCH FARADAY CAGE METHOD
    DD IEC/TS 62215-2:2007 INTEGRATED CIRCUITS - MEASUREMENT OF IMPULSE IMMUNITY - PART 2: SYNCHRONOUS TRANSIENT INJECTION METHOD
    07/30163156 DC : 0 BS EN 62433-2 - MODELS OF INTEGRATED CIRCUITS FOR EMI BEHAVIOURAL SIMULATION - ICEM-CE, ICEM CONDUCTED EMISSION MODEL
    05/30137850 DC : DRAFT AUG 2005 IEC 62215-2 - INTEGRATED CIRCUITS - MEASUREMENT OF IMPULSE IMMUNITY - PART 2: IMPULSE INJECTION METHOD
    IEEE 802.3-2012 ETHERNET - CORRIGENDUM 1: MULTI-LANE TIMESTAMPING
    IEC 62228-1:2018 Integrated circuits - EMC evaluation of transceivers - Part 1: General conditions and definitions
    EN 61967-6:2002/A1:2008 INTEGRATED CIRCUITS - MEASUREMENT OF ELECTROMAGNETIC EMISSIONS, 150 KHZ TO 1 GHZ - PART 6: MEASUREMENT OF CONDUCTED EMISSIONS - MAGNETIC PROBE METHOD
    IEC 62132-4:2006 Integrated circuits - Measurement of electromagnetic immunity 150 kHz to 1 GHz - Part 4: Direct RF power injection method
    IEC 61967-1:2002 Integrated circuits - Measurement of electromagnetic emissions, 150 kHz to 1 GHz - Part 1: General conditions and definitions
    IEC 61967-6:2002+AMD1:2008 CSV Integrated circuits - Measurement of electromagnetic emissions, 150 kHz to 1 GHz - Part 6: Measurement of conducted emissions - Magnetic probe method
    I.S. EN 61967-6:2003 INTEGRATED CIRCUITS - MEASUREMENT OF ELECTROMAGNETIC EMISSIONS, 150 KHZ TO 1 GHZ - PART 6: MEASUREMENT OF CONDUCTED EMISSIONS - MAGNETIC PROBE METHOD
    BS EN 62132-4:2006 INTEGRATED CIRCUITS - MEASUREMENT OF ELECTROMAGNETIC IMMUNITY 150 KHZ TO 1 GHZ - PART 4: DIRECT RF POWER INJECTION METHOD
    16/30336986 DC : 0 BS EN 62969-1 - SEMICONDUCTOR DEVICES - SEMICONDUCTOR INTERFACE FOR AUTOMOTIVE VEHICLES - PART 1: GENERAL REQUIREMENTS OF POWER INTERFACE FOR AUTOMOTIVE VEHICLE SENSORS
    DD IEC/TS 62228:2007
    ISO/IEC/IEEE 8802-3:2017 Information technology Telecommunications and information exchange between systems Local and metropolitan area networks Specific requirements Part 3: Standard for Ethernet
    IEC TR 61967-4-1:2005 Integrated circuits - Measurement of electromagnetic emissions, 150 kHz to 1 GHz - Part 4-1: Measurement of conducted emissions - 1 Ω/150 Ω direct coupling method - Application guidance to IEC 61967-4
    IEC TR 62014-3:2002 Electronic design automation libraries - Part 3: Models of integrated circuits for EMI behavioural simulation
    IEC 62228-2:2016 Integrated circuits - EMC evaluation of transceivers - Part 2: LIN transceivers
    EN 62228-2 : 2017 INTEGRATED CIRCUITS - EMC EVALUATION OF TRANSCEIVERS - PART 2: LIN TRANSCEIVERS (IEC 62228-2:2016)

    Standards Referencing This Book - (Show below) - (Hide below)

    IEC 61967-1:2002 Integrated circuits - Measurement of electromagnetic emissions, 150 kHz to 1 GHz - Part 1: General conditions and definitions
    CISPR 16-1-4:2010+AMD1:2012+AMD2:2017 CSV Specification for radio disturbance and immunity measuring apparatus and methods - Part 1-4: Radio disturbance and immunity measuring apparatus - Antennas and test sites for radiated disturbance measurements
    CISPR 16-1-1:2015 Specification for radio disturbance and immunity measuring apparatus and methods - Part 1-1: Radio disturbance and immunity measuring apparatus - Measuring apparatus
    CISPR 16-1-3:2004+AMD1:2016 CSV Specification for radio disturbance and immunity measuring apparatus and methods - Part 1-3: Radio disturbance and immunity measuring apparatus - Ancillary equipment - Disturbance power
    CISPR 16-1-5:2014+AMD1:2016 CSV Specification for radio disturbance and immunity measuring apparatus and methods - Part 1-5: Radio disturbance and immunity measuring apparatus - Antenna calibration sites and reference test sites for 5 MHz to 18 GHz
    IEC 61000-4-6 : 4.0 ELECTROMAGNETIC COMPATIBILITY (EMC) - PART 4-6: TESTING AND MEASUREMENT TECHNIQUES - IMMUNITY TO CONDUCTED DISTURBANCES, INDUCED BY RADIO-FREQUENCY FIELDS
    IEC 61000-4-6:2013 Electromagnetic compatibility (EMC) - Part 4-6: Testing and measurement techniques - Immunity to conducted disturbances, induced by radio-frequency fields
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