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  • IEC 61967-6:2002+AMD1:2008 CSV

    Current The latest, up-to-date edition.

    Integrated circuits - Measurement of electromagnetic emissions, 150 kHz to 1 GHz - Part 6: Measurement of conducted emissions - Magnetic probe method

    Available format(s):  Hardcopy, PDF, PDF 3 Users, PDF 5 Users, PDF 9 Users

    Language(s):  English - French

    Published date:  24-06-2008

    Publisher:  International Electrotechnical Committee

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    Table of Contents - (Show below) - (Hide below)

    FOREWORD
    1 Scope
    2 Normative references
    3 Definitions
    4 General
      4.1 Measurement philosophy
      4.2 Measurement principle
    5 Test conditions
      5.1 General
      5.2 Frequency range
    6 Test equipment
      6.1 General
      6.2 Magnetic probe
      6.3 Probe spacing fixture and placement
    7 Test set-up
      7.1 General
      7.2 Probe calibration
      7.3 Modifications to standardized IC test board
          7.3.1 Layer arrangement
          7.3.2 Layer thickness
          7.3.3 Decoupling capacitors
          7.3.4 I/O pin loading
    8 Test procedure
      8.1 General
      8.2 Test technique
    9 Test report
      9.1 General
      9.2 Documentation
    Annex A (normative) Probe calibration procedure - Microstrip
            line method
    Annex B (informative) Measurement principle and calibration
            factor
    Annex C (informative) Spatial resolution of magnetic probe
    Annex D (informative) Angle pattern of probe placement
    Annex E (informative) Advanced magnetic probe
    Bibliography

    Abstract - (Show below) - (Hide below)

    IEC 61967-6 Ed 1.1:2008 specifies a method for evaluating RF currents on the pins of an integrated circuit (IC) by means of non-contact current measurement using a miniature magnetic probe. This method is capable of measuring the RF currents generated by the IC over a frequency range of 0,15 MHz to 1 000 MHz. This method is applicable to the measurement of a single IC or a chip set of ICs on the standardized test board for characterization and comparison purposes. It is also usable to evaluate the electromagnetic characteristics of an IC or group of ICs on an actual application PCB for emission reduction purposes. This method is called the "magnetic probe method". This consolidated version consists of the first edition (2002) and its amendment 1 (2008). Therefore, no need to order amendment in addition to this publication.

    General Product Information - (Show below) - (Hide below)

    Committee TC 47/SC 47A
    Development Note To be used in conjunction with IEC 61967-1. (06/2002) Stability Date: 2023. (09/2017)
    Document Type Standard
    Publisher International Electrotechnical Committee
    Status Current

    Standards Referenced By This Book - (Show below) - (Hide below)

    PD IEC/TR 61967-4-1:2005 INTEGRATED CIRCUITS - MEASUREMENT OF ELECTROMAGNETIC EMISSIONS, 150 KHZ TO 1 GHZ - PART 4-1: MEASUREMENT OF CONDUCTED EMISSIONS - 1 OHM/150 OHM DIRECT COUPLING METHOD - APPLICATION GUIDANCE TO IEC 61967-4
    03/112147 DC : DRAFT JULY 2003 IEC 61967-3 ED.1 - INTEGRATED CIRCUITS - MEASUREMENT OF ELECTROMAGNETIC EMISSIONS, 150 KHZ TO 1 GHZ - PART 3: MEASUREMENT OF RADIATED EMISSIONS - SURFACE SCAN METHOD
    BS EN 61967-5:2003 Integrated circuits. Measurement of electromagnetic emissions, 150 kHz to 1 GHz Measurement of conducted emissions. Workbench Faraday Cage method
    PD IEC/TS 61967-3:2014 Integrated circuits. Measurement of electromagnetic emissions Measurement of radiated emissions. Surface scan method
    EN 61967-5:2003 Integrated circuits - Measurement of electromagnetic emissions, 150 kHz to 1 GHz - Part 5: Measurement of conducted emissions - Workbench Faraday Cage method
    02/203838 DC : DRAFT MAR 2002
    06/30152634 DC : DRAFT JULY 2006
    DD IEC TS 61967-3 : DRAFT JAN 2006 INTEGRATED CIRCUITS - MEASUREMENT OF ELECTROMAGNETIC EMISSIONS, 150 KHZ TO 1 GHZ - MEASUREMENT OF RADIATED EMISSIONS - SURFACE SCAN METHOD
    CEI EN 61967-1 : 2002 INTEGRATED CIRCUITS - MEASUREMENT OF ELECTROMAGNETIC EMISSIONS, 150 KHZ TO 1 GHZ - PART 1: GENERAL CONDITIONS AND DEFINITIONS
    ECMA/TR 93 : 1ED 2007 MEASURING EMISSIONS FROM MODULES
    IEC TS 62239:2008 Process management for avionics - Preparation of an electronic components management plan
    EN IEC 62969-1:2018 Semiconductor devices - Semiconductor interface for automotive vehicles - Part 1: General requirements of power interface for automotive vehicle sensors
    IEC 62969-1:2017 Semiconductor devices - Semiconductor interface for automotive vehicles - Part 1: General requirements of power interface for automotive vehicle sensors
    IEC 61967-5:2003 Integrated circuits - Measurement of electromagnetic emissions, 150 kHz to 1 GHz - Part 5: Measurement of conducted emissions - Workbench Faraday Cage method
    PD IEC/TS 62132-9:2014 Integrated circuits. Measurement of electromagnetic immunity Measurement of radiated immunity. Surface scan method
    DD IEC/TS 62239:2003 Process management for avionics. Preparation of an electronic components management plan
    07/30163156 DC : 0 BS EN 62433-2 - MODELS OF INTEGRATED CIRCUITS FOR EMI BEHAVIOURAL SIMULATION - ICEM-CE, ICEM CONDUCTED EMISSION MODEL
    IEC TS 61967-3:2014 Integrated circuits - Measurement of electromagnetic emissions - Part 3: Measurement of radiated emissions - Surface scan method
    I.S. EN 61967-5:2003 INTEGRATED CIRCUITS - MEASUREMENT OF ELECTROMAGNETIC EMISSIONS, 150 KHZ TO 1 GHZ - PART 5: MEASUREMENT OF CONDUCTED EMISSIONS - WORKBENCH FARADAY CAGE METHOD
    IEC TS 62132-9:2014 Integrated circuits - Measurement of electromagnetic immunity - Part 9: Measurement of radiated immunity - Surface scan method
    IEC 61967-1:2002 Integrated circuits - Measurement of electromagnetic emissions, 150 kHz to 1 GHz - Part 1: General conditions and definitions
    16/30336986 DC : 0 BS EN 62969-1 - SEMICONDUCTOR DEVICES - SEMICONDUCTOR INTERFACE FOR AUTOMOTIVE VEHICLES - PART 1: GENERAL REQUIREMENTS OF POWER INTERFACE FOR AUTOMOTIVE VEHICLE SENSORS
    IEC TR 61967-4-1:2005 Integrated circuits - Measurement of electromagnetic emissions, 150 kHz to 1 GHz - Part 4-1: Measurement of conducted emissions - 1 Ω/150 Ω direct coupling method - Application guidance to IEC 61967-4
    IEC TR 62014-3:2002 Electronic design automation libraries - Part 3: Models of integrated circuits for EMI behavioural simulation

    Standards Referencing This Book - (Show below) - (Hide below)

    IEC 61967-1:2002 Integrated circuits - Measurement of electromagnetic emissions, 150 kHz to 1 GHz - Part 1: General conditions and definitions
    IEC 61967-4:2002+AMD1:2006 CSV Integrated circuits - Measurement of electromagnetic emissions, 150 kHz to 1 GHz - Part 4: Measurement of conducted emissions - 1 Ω/150 Ω direct coupling method
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