• IPC 1756 : 2010

    Current The latest, up-to-date edition.

    MANUFACTURING PROCESS DATA MANAGEMENT

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    Published date:  04-05-2010

    Publisher:  Institute of Printed Circuits

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    Table of Contents - (Show below) - (Hide below)

    1 SCOPE
    2 APPLICABLE DOCUMENTS
    3 GENERAL REQUIREMENTS
    4 DESCRIPTION OF THE MANUFACTURING DATA FIELDS
    Appendix A - Manufacturing Field Data
    Appendix B - Examples of PSL Conditions
    Appendix C - Package Plating XML Schema

    Abstract - (Show below) - (Hide below)

    Sets up the requirements for exchanging manufacturing data between suppliers and their customers for electrical and electronic product. Also applies to products, components, subproducts and materials that are supplied to producers of electrical and electronic components for incorporation into their products.

    General Product Information - (Show below) - (Hide below)

    Document Type Standard
    Publisher Institute of Printed Circuits
    Status Current

    Standards Referenced By This Book - (Show below) - (Hide below)

    IPC 7093 CHINESE : - DESIGN AND ASSEMBLY PROCESS IMPLEMENTATION FOR BOTTOM TERMINATION COMPONENTS
    IPC 7093 : 0 DESIGN AND ASSEMBLY PROCESS IMPLEMENTATION FOR BOTTOM TERMINATION COMPONENTS

    Standards Referencing This Book - (Show below) - (Hide below)

    IPC T 50 : M TERMS AND DEFINITIONS FOR INTERCONNECTING AND PACKAGING ELECTRONIC CIRCUITS
    IPC JP002 : 0 JEDEC/IPC CURRENT TIN WHISKERS THEORY AND MITIGATION PRACTICES GUIDELINE
    IPC 7351 : B GENERIC REQUIREMENTS FOR SURFACE MOUNT DESIGN AND LAND PATTERN STANDARD
    IEC 60194:2015 Printed board design, manufacture and assembly - Terms and definitions
    IPC J STD 075 : 0 CLASSIFICATION OF NON-IC ELECTRONIC COMPONENTS FOR ASSEMBLY PROCESSES
    IPC 1751 : A2010 + A1 2012 GENERIC REQUIREMENTS FOR DECLARATION PROCESS MANAGEMENT
    IPC 1752 : A-2 MATERIALS DECLARATION MANAGEMENT
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