IPC 7093 : 0
Superseded
A superseded Standard is one, which is fully replaced by another Standard, which is a new edition of the same Standard.
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DESIGN AND ASSEMBLY PROCESS IMPLEMENTATION FOR BOTTOM TERMINATION COMPONENTS
Hardcopy , PDF
Chinese, English
28-03-2011
05-02-2021
1 SCOPE
2 APPLICABLE DOCUMENTS
3 SELECTION CRITERIA AND MANAGING BTC IMPLEMENTATION
4 COMPONENT CONSIDERATIONS
5 MOUNTING STRUCTURES
6 PRINTED CIRCUIT ASSEMBLY DESIGN CONSIDERATIONS
7 ASSEMBLY OF BTCs ON PRINTED BOARDS
8 RELIABILITY
9 DEFECT AND FAILURE ANALYSIS CASE STUDIES
10 GLOSSARY AND ACRONYMS
11 BIBLIOGRAPHY AND REFERENCES
APPENDIX A - Metallographic Preparation
APPENDIX B - Dye Penetrant
Specifies the design and assembly challenges for implementing Bottom Termination surface mount Components (BTCs) whose external connections consist of metallized terminations that are an integral part of the component body.
| DevelopmentNote |
Also available in German Language, See IPC 7093 GERMAN. (01/2014) Also available in Chinese Language, See IPC 7093 CHINESE. (11/2014)
|
| DocumentType |
Standard
|
| Pages |
124
|
| PublisherName |
IPC by Global Electronics Association
|
| Status |
Superseded
|
| SupersededBy |
| IPC 4761 : 0 | DESIGN GUIDE FOR PROTECTION OF PRINTED BOARD VIA STRUCTURES |
| IPC 1756 : 2010 | MANUFACTURING PROCESS DATA MANAGEMENT |
| IPC 9701 : A | PERFORMANCE TEST METHODS AND QUALIFICATION REQUIREMENTS FOR SURFACE MOUNT SOLDER ATTACHMENTS |
| IPC 6012 : C | QUALIFICATION AND PERFORMANCE SPECIFICATION FOR RIGID PRINTED BOARDS |