IPC 2226 : 0
Superseded
A superseded Standard is one, which is fully replaced by another Standard, which is a new edition of the same Standard.
View Superseded by
SECTIONAL DESIGN STANDARD FOR HIGH DENSITY INTERCONNECT (HDI) PRINTED BOARDS
Hardcopy
11-08-2023
English
Important note : Users cannot be edited or removed once added to your Multi user PDF.
1 SCOPE
2 APPLICABLE DOCUMENTS
3 GENERAL REQUIREMENTS
4 MATERIALS
5 MECHANICAL/PHYSICAL PROPERTIES
6 ELECTRICAL PROPERTIES
7 THERMAL MANAGEMENT
8 COMPONENT AND ASSEMBLY ISSUES
9 HOLES/INTERCONNECTIONS
10 GENERAL CIRCUIT FEATURE
REQUIREMENTS
11 DOCUMENTATION
12 QUALITY ASSURANCE
Sets up requirements and considerations for the design of organic and inorganic high density interconnect (HDI) printed boards and structures for component mounting and interconnections.
| Committee |
D-30
|
| DevelopmentNote |
To be used in conjunction with IPC 2221. (09/2005) Also available in Hardcopy format. (01/2018)
|
| DocumentType |
Standard
|
| Pages |
60
|
| PublisherName |
Institute of Printed Circuits
|
| Status |
Superseded
|
| SupersededBy |
| IPC 7093 CHINESE : - | DESIGN AND ASSEMBLY PROCESS IMPLEMENTATION FOR BOTTOM TERMINATION COMPONENTS |
| IPC 7351 GERMAN : B | Basic requirements for SMT design and SMD patch guideline |
| IPC 7351 : B | GENERIC REQUIREMENTS FOR SURFACE MOUNT DESIGN AND LAND PATTERN STANDARD |
| IPC 7093 : 0 | DESIGN AND ASSEMBLY PROCESS IMPLEMENTATION FOR BOTTOM TERMINATION COMPONENTS |
| IEC PAS 62293:2001 | Qualification and performance specification for high density interconnect (HDI) layers or boards (IPC 6016) |
| BS EN 16602-70-12:2016 | Space product assurance. Design rules for printed circuit boards |
| EN 16602-70-12:2016 | Space product assurance - Design rules for printed circuit boards |
| MIL-HDBK-1861 Revision B:2013 | Selection and Use1 of Electrical and Electronic Assemblies, Boards, Cards, and Associated Hardware |
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