• IPC 2315 : 0

    Current The latest, up-to-date edition.

    DESIGN GUIDE FOR HIGH DENSITY INTERCONNECTS AND MICROVIAS

    Available format(s):  Hardcopy

    Language(s):  English

    Published date: 

    Publisher:  Institute of Printed Circuits

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    Abstract - (Show below) - (Hide below)

    Published jointly with the Japan Printed Circuit Association, this document gives an easy to follow tutorial on the selection of HDI and microvia design structures and rules. Users are taken through various considerations to be addressed when designing and HDI printed writing board, including: selection of materials, design examples and processes, various microvia technologies and general descriptions. An industry publication (the 1st) offers manufacturers and designers one source of reliable manufacturability and design information for commonly produced HDI boards. Includes over 30 full color illustrations to assist the user.

    General Product Information - (Show below) - (Hide below)

    Document Type Standard
    Publisher Institute of Printed Circuits
    Status Current

    Standards Referenced By This Book - (Show below) - (Hide below)

    IPC 4104 : 1999 SPECIFICATION FOR HIGH DENSITY INTERCONNECT (HDI) AND MICROVIA MATERIALS
    IPC HDI 1 : LATEST HIGH DENSITY INTERCONNECT MICROVIA TECHNOLOGY COMPENDIUM
    BS EN 16602-70-12:2016 Space product assurance. Design rules for printed circuit boards
    EN 16602-70-12:2016 Space product assurance - Design rules for printed circuit boards
    IPC 6801 : 0 IPC/JPCA TERMS & DEFINITIONS, TEST METHODS, AND DESIGN EXAMPLES FOR BUILD-UP/HIGH DENSITY INTERCONNECT (HDI) PRINTED WIRING BOARDS
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