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IPC/JPCA TERMS & DEFINITIONS, TEST METHODS, AND DESIGN EXAMPLES FOR BUILD-UP/HIGH DENSITY INTERCONNECT (HDI) PRINTED WIRING BOARDS
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Withdrawn date: 12-09-2023
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Publisher: Institute of Printed Circuits
1 SCOPE2 APPLICABLE DOCUMENTS3 DEFINITIONS OF STRUCTURES AND TERMS 3.1 Structures 3.2 Terms and Definitions 3.3 Design 3.4 Manufacturing 3.5 Testing and Inspection4 TEST METHODS FOR BUILD-UP/HDI MATERIALS 4.1 Coefficient of Thermal Expansion - Thermomechanical Analyzer 4.2 Mechanical Properties 4.3 Water Absorption Property 4.4 Drying Property 4.5 Ionic Impurity 4.6 Flexibility 4.7 Dielectric Constant5 TEST METHOD FOR BUILD-UP PRINTED BOARDS 5.1 Coefficient of Thermal Expansion (CTE) 5.2 Water Absorption Property 5.3 Drying Property 5.4 Ionic Impurity 5.5 Characteristic Impedance 5.6 Flatness6 TEST METHOD FOR G BUILD-UP PRINTED BOARD 6.1 Peel Strength of Conductor Layer 6.2 Pull-Off Strength of Pads 6.3 Thermal Resistance Test for Packaging Build-Up Printed Boards7 RELIABILITY TEST METHODS 7.1 Thermal Shock Test (in Air) 7.2 Bias Test at High Temperature and High Humidity 7.3 High Temperature Shelf Test8 DESIGN EXAMPLE9 DESCRIPTION (CONTINUED DISCUSSION ITEMS/BACKGROUND OF DEVELOPING JPCA STANDARD FOR BUILD-UP PRINTED BOARDS 9.1 Test Pattern 9.2 Description of Accelerated Test
Lists terms specific to HDI and test methods for CTE for materials and HDI PWBs, peel strength and thermal shock. Also includes a design criteria table and background information for the development of a standard HDI PWBs.
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