IPC 6801 : 0

1 SCOPE
2 APPLICABLE DOCUMENTS
3 DEFINITIONS OF STRUCTURES AND TERMS
  3.1 Structures
  3.2 Terms and Definitions
  3.3 Design
  3.4 Manufacturing
  3.5 Testing and Inspection
4 TEST METHODS FOR BUILD-UP/HDI MATERIALS
  4.1 Coefficient of Thermal Expansion - Thermomechanical
      Analyzer
  4.2 Mechanical Properties
  4.3 Water Absorption Property
  4.4 Drying Property
  4.5 Ionic Impurity
  4.6 Flexibility
  4.7 Dielectric Constant
5 TEST METHOD FOR BUILD-UP PRINTED BOARDS
  5.1 Coefficient of Thermal Expansion (CTE)
  5.2 Water Absorption Property
  5.3 Drying Property
  5.4 Ionic Impurity
  5.5 Characteristic Impedance
  5.6 Flatness
6 TEST METHOD FOR G BUILD-UP PRINTED BOARD
  6.1 Peel Strength of Conductor Layer
  6.2 Pull-Off Strength of Pads
  6.3 Thermal Resistance Test for Packaging Build-Up
      Printed Boards
7 RELIABILITY TEST METHODS
  7.1 Thermal Shock Test (in Air)
  7.2 Bias Test at High Temperature and High Humidity
  7.3 High Temperature Shelf Test
8 DESIGN EXAMPLE
9 DESCRIPTION (CONTINUED DISCUSSION ITEMS/BACKGROUND OF
  DEVELOPING JPCA STANDARD FOR BUILD-UP PRINTED BOARDS
  9.1 Test Pattern
  9.2 Description of Accelerated Test

Lists terms specific to HDI and test methods for CTE for materials and HDI PWBs, peel strength and thermal shock. Also includes a design criteria table and background information for the development of a standard HDI PWBs.