IPC 2316 : 0

1 SCOPE
  1.1 Statement of Scope
  1.2 Purpose
  1.3 Terms and Definitions
2 APPLICABLE DOCUMENTS
  2.1 IPC
  2.2 National Conference of Standards Laboratories (NCSL)
  2.3 International Standards
  2.4 International Electrotechnical Commission (IEC)
      Standards
3 GENERAL INTRODUCTION
  3.1 History of Embedded Passive Technologies
      3.1.1 History of Additive Polymer Thick-Film Resistor
            Technology
      3.1.2 History of Additive Thin-Film Resistor Technology
      3.1.3 History of Subtractive Planar Thin-Film Resistor
            Technology
      3.1.4 History of Distributed Planar Capacitor Technology
      3.1.5 History of Polymer Thick-Film Capacitor Technology
      3.1.6 History of Ceramic Thick-Film and Thin-Film
            Capacitor Technology
      3.1.7 History of Ceramic Filled Photodielectric Capacitor
            Technology
  3.2 Embedded Passive Component Selection Criteria
  3.3 Cost Analysis
      3.3.1 Fabrication and Manufacturing Cost Modeling
      3.3.2 Embedded Resistor Trimming and Rework Economics
      3.3.3 Life Cycle Costs Impacted by Embedded Passives [22]
  3.4 Product Safety Design Considerations
4 EMBEDDED RESISTORS
  4.1 Physical Characteristics
      4.1.1 Resistivity
      4.1.2 Tolerances
      4.1.3 Temperature Coefficient of Resistance
      4.1.4 Power
      4.1.5 Short-Time Overload Voltage (STOL)
      4.1.6 Standard Working Voltage
      4.1.7 ESD
  4.2 General Process Design Guidelines
  4.3 Material Process Guidelines
      4.3.1 Additive Techniques - PTF Processing
      4.3.2 Additive Techniques - Thin-Film
      4.3.3 Additive Techniques - Inkjet Printing
      4.3.4 Subtractive Techniques - Thin-Film Processing
  4.4 Test and Trim
      4.4.1 Electrical Testing Tools
      4.4.2 Laser Trim [Subtractive]
      4.4.3 Ink Jet [Additive]
5 EMBEDDED CAPACITORS
  5.1 Capacitance
      5.1.1 Dielectric Constant
      5.1.2 Capacitance Density
      5.1.3 Dissipation Factor (Df)
      5.1.4 Temperature Coefficient of Capacitance
      5.1.5 Frequency and Voltage Effects
      5.1.6 Leakage Current and Dielectric Breakdown
      5.1.7 Aging
  5.2 Matching Dielectric Materials to Embedded Capacitor
      Applications
  5.3 Materials and Processes
      5.3.1 Planar Capacitance Laminate Materials for
            Distributed and Discrete Applications
      5.3.2 PTF Capacitance Materials
      5.3.3 Ceramic Thick-Film Capacitor Systems
      5.3.4 Ceramic Thin-Film Capacitor System
      5.3.5 Ceramic-Filled Photodielectric (CFP)
6 INDUCTORS
7 REFERENCES
8 IPC PUBLISHED PAPERS
  8.1 IPC Printed Circuits Expo - March 2003
  8.2 IPC First International Conference on Embedded
      Passives - June 2003
  8.3 IPC Annual Meeting - September 2003
  8.4 IPC Printed Circuits Expo, APEX and Designers
      Summit Conference - February 2004
  8.5 IPC 2nd International Conference on Embedded
      Passives - June 2004
  8.6 IPC/FED International Conference: Embedded Passive
      Components - November 2004
  8.7 Electronics Circuits World Convention (ECWC)
      10 - February 2005
  8.8 IPCWorks 2005 - October 2005

Offers printed board users and designers the necessary information for incorporating formed and placed embedded passive components into their applications.