• IPC 4821 : 0

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    SPECIFICATION FOR EMBEDDED PASSIVE DEVICE CAPACITOR MATERIALS FOR RIGID AND MULTILAYER PRINTED BOARDS

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    Published date:  01-05-2006

    Publisher:  Institute of Printed Circuits

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    Table of Contents - (Show below) - (Hide below)

    1 SCOPE
      1.1 General
      1.2 Designation System
           1.2.1 Embedded Capacitor Passive Device
                  Designations
    2 APPLICABLE DOCUMENTS
      2.1 IPC
      2.2 American Society for Testing and Materials
           (ASTM)
      2.3 Underwriters Laboratories (UL)
      2.4 National Conference of Standards Laboratories
           (NCSL)
      2.5 International Organization for Standardization
      2.6 International Electrotechnical Commission
    3 REQUIREMENTS
      3.1 Terms and Definitions
           3.1.1 Embedded Planar Capacitor
           3.1.2 Embedded Discrete Capacitor
      3.2 Specification Sheets
      3.3 Supplier's Quality Profile
      3.4 Qualification (Characterization) Testing
           3.4.1 Material Qualification
      3.5 Conformance Testing
           3.5.1 Samples
           3.5.2 Frequency
      3.6 Verification of Supplier's Quality System
      3.7 Conflict
      3.8 Materials
           3.8.1 Capacitor Materials in Laminate-Like Form
           3.8.2 Capacitor Materials in Nonlaminate-Like
                  Form
           3.8.3 Encapsulant Materials in Nonlaminate-Like
                  Form
           3.8.4 Conductor/Termination Materials
      3.9 General Acceptability
           3.9.1 General Acceptability of Dielectric Materials
           3.9.2 General Acceptability of Conductive Materials
           3.9.3 Inspection
      3.10 Visual Requirements
           3.10.1 Visual Requirements of Laminate-Like
                  Capacitor Materials
           3.10.2 Visual Requirements of Nonlaminate-Like
                  Capacitor Materials
      3.11 Dimensional Requirements
           3.11.1 Dimensional Requirements of Laminate-Like
                  Capacitor Materials
      3.12 Mechanical Requirements
           3.12.1 Mechanical Requirements of Laminate-Like
                  Capacitor Materials
           3.12.2 Mechanical Requirements of Nonlaminate-Like
                  Capacitor Materials
      3.13 Thermal Requirements
           3.13.1 Thermal Requirements of Laminate-Like
                  Capacitor Materials
           3.13.2 Thermal Requirements of Nonlaminate-Like
                  Capacitor Materials
      3.14 Electrical Requirements
           3.14.1 Electrical Requirements of Laminate-Like
                  Capacitor Materials Capacitance (TCC)
           3.14.2 Electrical Requirements of Nonlaminate-Like
                  Capacitor Materials
      3.15 Environmental Requirements
           3.15.1 Environmental Requirements of Laminate-Like
                  Capacitor Materials
           3.15.2 Environmental Requirements of Nonlaminate-like
                  Capacitor Materials
      3.16 Workmanship
      3.17 Material Safety Data Sheets
      3.18 Shelf Life
      3.19 Marking
    4 QUALITY ASSURANCE PROVISIONS
      4.1 Quality System
      4.2 Responsibility for Inspection
           4.2.1 Test Equipment and Inspection Facilities
           4.2.2 Standard Laboratory Conditions
      4.3 Qualification (Characterization) Testing
           4.3.1 Samples
           4.3.2 Structurally Similar Construction
           4.3.3 Laboratory Equipment Tolerances
      4.4 Quality Conformance Inspection
           4.4.1 Frequency
           4.4.2 Inspection of Product for Delivery
           4.4.3 Acceptance Criteria
           4.4.4 Rejected Lots
      4.5 Statistical Process Control (SPC)
    5 PREPARATION FOR DELIVERY
      5.1 Packing
    6 NOTES
      6.1 Ordering Data
      6.2 Electrostatic Discharge (ESD) Testing
      6.3 HiPot Test Method
    Figures
    Tables

    Abstract - (Show below) - (Hide below)

    Describes materials that can be used for the fabrication of embedded passive capacitor devices within the finished printed circuit board substrate. Also provides information on general designations and associated characteristics of embedded passive device (EPD) capacitor materials.

    General Product Information - (Show below) - (Hide below)

    Committee D-52
    Development Note Included in IPC C 107. (06/2008) Included in IPC C 105 & IPC C 1000. (07/2008)
    Document Type Standard
    Publisher Institute of Printed Circuits
    Status Current

    Standards Referenced By This Book - (Show below) - (Hide below)

    IPC 6012 RUSSIAN : C QUALIFICATION AND PERFORMANCE SPECIFICATION FOR RIGID PRINTED BOARDS
    IPC 6012 POLISH : C QUALIFICATION AND PERFORMANCE SPECIFICATION FOR RIGID PRINTED BOARDS
    IPC 7092 : 0 DESIGN AND ASSEMBLY PROCESS IMPLEMENTATION FOR EMBEDDED COMPONENTS
    IPC 2316 : 0 DESIGN GUIDE FOR EMBEDDED PASSIVE DEVICE PRINTED BOARDS
    IPC 6012 FRENCH : C QUALIFICATION AND PERFORMANCE SPECIFICATION FOR RIGID PRINTED BOARDS
    IPC 6018 CHINESE : B QUALIFICATION AND PERFORMANCE SPECIFICATION FOR HIGH FREQUENCY (MICROWAVE) PRINTED BOARD

    Standards Referencing This Book - (Show below) - (Hide below)

    IPC 6010 SERIES : LATEST IPC-6010 QUALIFICATION AND PERFORMANCE SERIES
    IPC S 100 : LATEST STANDARDS AND SPECIFICATIONS MANUAL
    IPC 4101 : D SPECIFICATION FOR BASE MATERIALS FOR RIGID AND MULTILAYER PRINTED BOARDS
    IPC M 107 : LATEST STANDARDS FOR PRINTED BOARD MATERIALS MANUAL
    IPC E 500 : LATEST IPC ELECTRONIC DOCUMENT COLLECTION
    IPC 2221B:2012 GENERIC STANDARD ON PRINTED BOARD DESIGN
    IPC M 105 : LATEST RIGID PRINTED BOARD MANUAL
    IPC 2222 : A SECTIONAL DESIGN STANDARD FOR RIGID ORGANIC PRINTED BOARDS
    IPC 6012 : C QUALIFICATION AND PERFORMANCE SPECIFICATION FOR RIGID PRINTED BOARDS
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