IPC 2511 : B
Current
Current
The latest, up-to-date edition.
GENERIC REQUIREMENTS FOR IMPLEMENTATION OF PRODUCT MANUFACTURING DESCRIPTION DATA AND TRANSFER METHODOLOGY
Available format(s)
Hardcopy
Language(s)
English
Published date
28-02-2002
Publisher
Identifies the generic requirements for implementation of product manufacturing description data and transfer. It helps users transfer design requirements and manufacturing expectations from computer-aided design systems to computer-aided manufacturing systems for printed board fabrication, assembly and test. Establishes the rules and protocol of describing data for electronic transfer in a neutral format. Specifies the XML schema that represents the data file format used to describe printed board and printed board assembly products with details sufficient for tooling, manufacturing, assembly, inspection and testing requirements.
| DevelopmentNote |
Earlier was withdrawn, now confirmed valid by the publisher. (01/2018)
|
| DocumentType |
Standard
|
| Pages |
182
|
| PublisherName |
Institute of Printed Circuits
|
| Status |
Current
|
| Supersedes |
| DSCC 11001 : 0 | PRINTED WIRING BOARD, FLEXIBLE, TYPE 1 (SINGLE-SIDED ) WITH UNSUPPORTED HOLES, WITH OR WITHOUT STIFFENER |
| IPC 2517 : A | SECTIONAL REQUIREMENTS FOR IMPLEMENTATION OF ASSEMBLY IN-CIRCUIT TEST DATA DESCRIPTION |
| IPC 2512 : A | SECTIONAL REQUIREMENTS FOR IMPLEMENTATION OF ADMINISTRATIVE METHODS FOR MANUFACTURING DATA DESCRIPTION |
| BS EN 61182-2-2:2012 | Printed board assembly products. Manufacturing description data and transfer methodology Sectional requirements for implementation of printed board fabrication data description |
| DSCC 11004 : 0 | PRINTED WIRING BOARD, RIGID FLEX, TYPE 4 (MULTILAYERED) WITH SUPPORTED HOLES, WITH STIFFENER |
| IPC 2516 : A | SECTIONAL REQUIREMENTS FOR IMPLEMENTATION OF ASSEMBLED BOARD PRODUCT MANUFACTURING DATA DESCRIPTION |
| DSCC 11005 : 0 | PRINTED WIRING BOARD, RIGID FLEX, TYPE 5 (MULTILAYER) WITH UNSUPPORTED HOLES, WITH OR WITHOUT STIFFENER |
| PD IEC/PAS 61182-12:2014 | Generic requirements for printed board assembly products manufacturing description data and transfer methodology |
| IEC 61182-2:2006 | Printed board assembly products - Manufacturing description data and transfer methodology - Part 2: Generic requirements |
| EN 61182-2-2:2012 | Printed board assembly products - Manufacturing description data and transfer methodology - Part 2-2: Sectional requirements for implementation of printed board fabrication data description |
| IPC 2221 GERMAN : B | GENERIC STANDARD ON PRINTED BOARD DESIGN |
| DSCC 11002 : 0 | PRINTED WIRING BOARD, FLEXIBLE, TYPE 2 (DOUBLE-SIDED) WITH PLATED THROUGH HOLES, WITH OR WITHOUT STIFFENER |
| IPC 2581 : B | GENERIC REQUIREMENTS FOR PRINTED BOARD ASSEMBLY PRODUCTS MANUFACTURING DESCRIPTION DATA AND TRANSFER METHODOLOGY |
| IPC 2518 : A | SECTIONAL REQUIREMENTS FOR IMPLEMENTATION OF PARTS LIST PRODUCT MANUFACTURING DATA DESCRIPTION |
| IEC PAS 61182-12:2014 | Generic requirements for printed board assembly products manufacturing description data and transfer methodology |
| DSCC 11003 : 0 | PRINTED WIRING BOARD, FLEXIBLE, TYPE 3 (MULTILAYER) WITH PLATED THROUGH HOLES, WITH OR WITHOUT STIFFENER |
| IPC 2514 : A | SECTIONAL REQUIREMENTS FOR IMPLEMENTATION OF PRINTED BOARD FABRICATION DATA DESCRIPTION |
| IEC 61182-2-2:2012 | Printed board assembly products - Manufacturing description data and transfer methodology - Part 2-2: Sectional requirements for implementation of printed board fabrication data description |
| BS IEC 61182-2:2006 | Printed board assembly products. Manufacturing description data and transfer methodology Generic requirements |
| IPC 2515 : A | SECTIONAL REQUIREMENTS FOR IMPLEMENTATION OF BARE-BOARD PRODUCT TESTING DATA DESCRIPTION |
| I.S. EN 61182-2-2:2012 | PRINTED BOARD ASSEMBLY PRODUCTS - MANUFACTURING DESCRIPTION DATA AND TRANSFER METHODOLOGY - PART 2-2: SECTIONAL REQUIREMENTS FOR IMPLEMENTATION OF PRINTED BOARD FABRICATION DATA DESCRIPTION (IEC 61182-2-2:2012 (EQV)) |
| IPC 2547 : 0 | SECTIONAL REQUIREMENTS FOR SHOP-FLOOR EQUIPMENT COMMUNICATION MESSAGES (CAMX) FOR PRINTED CIRCUIT BOARD TEST, INSPECTION AND REWORK |
| IPC 2513 : A | SECTIONAL REQUIREMENTS FOR IMPLEMENTATION OF DRAWING METHODS FOR MANUFACTURING DATA DESCRIPTION |
| IPC 2221B:2012 | GENERIC STANDARD ON PRINTED BOARD DESIGN |
| IPC 2221 FRENCH : B2012 | GENERIC STANDARD ON PRINTED BOARD DESIGN |
| DSCC 10013 : 0 | PRINTED WIRING BOARD, RIGID, MULTILAYERED, TYPE 3 WITH PLATED-THROUGH HOLES |
| DSCC 10014:2012 | PRINTED WIRING BOARD, RIGID, MULTILAYERED, TYPE 4 WITH BLIND AND BURIED VIAS |
| IPC 2513 : A | SECTIONAL REQUIREMENTS FOR IMPLEMENTATION OF DRAWING METHODS FOR MANUFACTURING DATA DESCRIPTION |
| IPC 2515 : A | SECTIONAL REQUIREMENTS FOR IMPLEMENTATION OF BARE-BOARD PRODUCT TESTING DATA DESCRIPTION |
| IPC 2514 : A | SECTIONAL REQUIREMENTS FOR IMPLEMENTATION OF PRINTED BOARD FABRICATION DATA DESCRIPTION |
| IPC 2517 : A | SECTIONAL REQUIREMENTS FOR IMPLEMENTATION OF ASSEMBLY IN-CIRCUIT TEST DATA DESCRIPTION |
| IPC 2518 : A | SECTIONAL REQUIREMENTS FOR IMPLEMENTATION OF PARTS LIST PRODUCT MANUFACTURING DATA DESCRIPTION |
| IPC 2516 : A | SECTIONAL REQUIREMENTS FOR IMPLEMENTATION OF ASSEMBLED BOARD PRODUCT MANUFACTURING DATA DESCRIPTION |
| IPC 2512 : A | SECTIONAL REQUIREMENTS FOR IMPLEMENTATION OF ADMINISTRATIVE METHODS FOR MANUFACTURING DATA DESCRIPTION |
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