DSCC 11001 : 0
|
PRINTED WIRING BOARD, FLEXIBLE, TYPE 1 (SINGLE-SIDED ) WITH UNSUPPORTED HOLES, WITH OR WITHOUT STIFFENER
|
IPC 2517 : A
|
SECTIONAL REQUIREMENTS FOR IMPLEMENTATION OF ASSEMBLY IN-CIRCUIT TEST DATA DESCRIPTION
|
IPC 2512 : A
|
SECTIONAL REQUIREMENTS FOR IMPLEMENTATION OF ADMINISTRATIVE METHODS FOR MANUFACTURING DATA DESCRIPTION
|
BS EN 61182-2-2:2012
|
Printed board assembly products. Manufacturing description data and transfer methodology Sectional requirements for implementation of printed board fabrication data description
|
DSCC 11004 : 0
|
PRINTED WIRING BOARD, RIGID FLEX, TYPE 4 (MULTILAYERED) WITH SUPPORTED HOLES, WITH STIFFENER
|
IPC 2516 : A
|
SECTIONAL REQUIREMENTS FOR IMPLEMENTATION OF ASSEMBLED BOARD PRODUCT MANUFACTURING DATA DESCRIPTION
|
DSCC 11005 : 0
|
PRINTED WIRING BOARD, RIGID FLEX, TYPE 5 (MULTILAYER) WITH UNSUPPORTED HOLES, WITH OR WITHOUT STIFFENER
|
PD IEC/PAS 61182-12:2014
|
Generic requirements for printed board assembly products manufacturing description data and transfer methodology
|
IEC 61182-2:2006
|
Printed board assembly products - Manufacturing description data and transfer methodology - Part 2: Generic requirements
|
EN 61182-2-2:2012
|
Printed board assembly products - Manufacturing description data and transfer methodology - Part 2-2: Sectional requirements for implementation of printed board fabrication data description
|
IPC 2221 GERMAN : B
|
GENERIC STANDARD ON PRINTED BOARD DESIGN
|
DSCC 11002 : 0
|
PRINTED WIRING BOARD, FLEXIBLE, TYPE 2 (DOUBLE-SIDED) WITH PLATED THROUGH HOLES, WITH OR WITHOUT STIFFENER
|
IPC 2581 : B
|
GENERIC REQUIREMENTS FOR PRINTED BOARD ASSEMBLY PRODUCTS MANUFACTURING DESCRIPTION DATA AND TRANSFER METHODOLOGY
|
IPC 2518 : A
|
SECTIONAL REQUIREMENTS FOR IMPLEMENTATION OF PARTS LIST PRODUCT MANUFACTURING DATA DESCRIPTION
|
IEC PAS 61182-12:2014
|
Generic requirements for printed board assembly products manufacturing description data and transfer methodology
|
DSCC 11003 : 0
|
PRINTED WIRING BOARD, FLEXIBLE, TYPE 3 (MULTILAYER) WITH PLATED THROUGH HOLES, WITH OR WITHOUT STIFFENER
|
IPC 2514 : A
|
SECTIONAL REQUIREMENTS FOR IMPLEMENTATION OF PRINTED BOARD FABRICATION DATA DESCRIPTION
|
IEC 61182-2-2:2012
|
Printed board assembly products - Manufacturing description data and transfer methodology - Part 2-2: Sectional requirements for implementation of printed board fabrication data description
|
BS IEC 61182-2:2006
|
Printed board assembly products. Manufacturing description data and transfer methodology Generic requirements
|
IPC 2515 : A
|
SECTIONAL REQUIREMENTS FOR IMPLEMENTATION OF BARE-BOARD PRODUCT TESTING DATA DESCRIPTION
|
I.S. EN 61182-2-2:2012
|
PRINTED BOARD ASSEMBLY PRODUCTS - MANUFACTURING DESCRIPTION DATA AND TRANSFER METHODOLOGY - PART 2-2: SECTIONAL REQUIREMENTS FOR IMPLEMENTATION OF PRINTED BOARD FABRICATION DATA DESCRIPTION (IEC 61182-2-2:2012 (EQV))
|
IPC 2547 : 0
|
SECTIONAL REQUIREMENTS FOR SHOP-FLOOR EQUIPMENT COMMUNICATION MESSAGES (CAMX) FOR PRINTED CIRCUIT BOARD TEST, INSPECTION AND REWORK
|
IPC 2513 : A
|
SECTIONAL REQUIREMENTS FOR IMPLEMENTATION OF DRAWING METHODS FOR MANUFACTURING DATA DESCRIPTION
|
IPC 2221B:2012
|
GENERIC STANDARD ON PRINTED BOARD DESIGN
|
IPC 2221 FRENCH : B2012
|
GENERIC STANDARD ON PRINTED BOARD DESIGN
|
DSCC 10013 : 0
|
PRINTED WIRING BOARD, RIGID, MULTILAYERED, TYPE 3 WITH PLATED-THROUGH HOLES
|
DSCC 10014:2012
|
PRINTED WIRING BOARD, RIGID, MULTILAYERED, TYPE 4 WITH BLIND AND BURIED VIAS
|