• BS IEC 61182-2 : 2006

    Cancelled Standard has been cancelled.

    PRINTED BOARD ASSEMBLY PRODUCTS - MANUFACTURING DESCRIPTION DATA AND TRANSFER METHODOLOGY - PART 2: GENERIC REQUIREMENTS

    Available format(s):  Hardcopy, PDF

    Cancelled date:  28-02-2017

    Language(s):  English

    Published date:  01-01-2006

    Publisher:  British Standards Institution

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    Table of Contents - (Show below) - (Hide below)

    1 Scope and object
       1.1 Focus and intent
       1.2 Notation
    2 Normative references
    3 Documentation conventions
    4 Requirements
       4.1 Rules concerning the use of XML and
            XML Schema
       4.2 Data organization and identification rules
       4.3 Transformation characteristics (Xform)
       4.4 Substitution groups
    5 Content
       5.1 Content: FunctionMode
       5.2 Function levels
       5.3 Content: StepListRef
       5.4 Content: LayerDescRef
       5.5 Content: BomRef
       5.6 Content: AvlRef
       5.7 Content: DictionaryStandard
       5.8 Content: DictionaryUser
       5.9 Content: DictionaryFont
       5.10 Content: DictionaryLineDesc
       5.11 Content: DictionaryColor
       5.12 Content: DictionaryFirmware
    6 Logistic header
       6.1 LogisticHeader
       6.2 Role
       6.3 Enterprise
       6.4 Person
    7 History record
       7.1 HistoryRecord
       7.2 FileRevision
       7.3 SoftwarePackage
       7.4 ChangeRec
    8 BOM (Material List)
       8.1 BOM Header
       8.2 BomItem
    9 Electronic computer aided design (ecad)
       9.1 CadHeader
       9.2 CadData/LayerDesc
       9.3 CadData/StepList
    10 Approved vendor list (AVL)
       10.1 AvlHeader
       10.2 AvlItem
    11 Glossary
    Annexe A (informative) IPC-7351 Naming Convention
            for Land Patterns
    Annexe B - Informative references

    Abstract - (Show below) - (Hide below)

    Describes the XML Schema that represents the intelligent data file format used to describe printed board and printed board assembly products with details sufficient for tooling, manufacturing, assembly, and inspection requirements.

    General Product Information - (Show below) - (Hide below)

    Committee GEL/93
    Development Note Supersedes 03/318225 DC. (05/2007)
    Document Type Standard
    Publisher British Standards Institution
    Status Cancelled

    Standards Referencing This Book - (Show below) - (Hide below)

    ANSI Y14.5 : 1973 DIMENSIONING AND TOLERANCING FOR ENGINEERING DRAWINGS
    IEC 61188-5-3:2007 Printed boards and printed board assemblies - Design and use - Part 5-3: Attachment (land/joint) considerations - Components with gull-wing leads on two sides
    IEC 61188-5-2:2003 Printed boards and printed board assemblies - Design and use - Part 5-2: Attachment (land/joint) considerations - Discrete components
    IPC 2220 : LATEST IPC 2220 FAMILY OF DESIGN DOCUMENTS
    IEC 61188-5-8:2007 Printed board and printed board assemblies - Design and use - Part 5-8: Attachment (land/joint) considerations - Area array components (BGA, FBGA, CGA, LGA)
    DOD STD 100 : C NOTICE 6 ENGINEERING DRAWING PRACTICES
    IPC 2578 : 0 SECTIONAL REQUIREMENTS FOR SUPPLY CHAIN COMMUNICATION OF BILL OF MATERIAL AND PRODUCT DESIGN CONFIGURATION DATA - PRODUCT DATA EXCHANGE
    IPC D 325 : A DOCUMENTATION REQUIREMENTS FOR PRINTED BOARDS
    ISO 10303-212:2001 Industrial automation systems and integration Product data representation and exchange Part 212: Application protocol: Electrotechnical design and installation
    ANSI Z210.1 : LATEST METRIC PRACTICE GUIDE
    IPC 4101 : D SPECIFICATION FOR BASE MATERIALS FOR RIGID AND MULTILAYER PRINTED BOARDS
    IPC 7351 : B GENERIC REQUIREMENTS FOR SURFACE MOUNT DESIGN AND LAND PATTERN STANDARD
    IPC 2615 : 0 PRINTED BOARD DIMENSIONS AND TOLERANCES
    IPC 2524 : 0 PWB FABRICATION DATA QUALITY RATING SYSTEM
    IPC 2576 : 0 SECTIONAL REQUIREMENTS FOR ELECTRONICS MANUFACTURING SUPPLY CHAIN COMMUNICATION OF AS-BUILT PRODUCT DATA - PRODUCT DATA EXCHANGE (PDX)
    IPC 2511 : B GENERIC REQUIREMENTS FOR IMPLEMENTATION OF PRODUCT MANUFACTURING DESCRIPTION DATA AND TRANSFER METHODOLOGY
    IPC 4104 : 1999 SPECIFICATION FOR HIGH DENSITY INTERCONNECT (HDI) AND MICROVIA MATERIALS
    IPC 2571 : 0 GENERIC REQUIREMENTS FOR ELECTRONIC MANUFACTURING SUPPLY CHAIN COMMUNICATION - PRODUCT DATA EXCHANGE (PDX)
    IPC D 310 : C GUIDELINES FOR PHOTOTOOL GENERATION AND MEASUREMENT TECHNIQUES
    IEC 61188-5-6:2003 Printed boards and printed board assemblies - Design and use - Part 5-6: Attachment (land/joint) considerations - Chip carriers with J-leads on four sides
    IEC 61188-5-1:2002 Printed boards and printed board assemblies - Design and use - Part 5-1: Attachment (land/joint) considerations - Generic requirements
    IEC 60194:2015 Printed board design, manufacture and assembly - Terms and definitions
    IEC 61188-5-5:2007 Printed boards and printed board assemblies - Design and use - Part 5-5: Attachment (land/joint) considerations - Components with gull-wing leads on four sides
    IPC 2501 : 0 DEFINITION FOR WEB-BASED EXCHANGE OF XML DATA
    ISO 10303-210:2011 Industrial automation systems and integration Product data representation and exchange Part 210: Application protocol: Electronic assembly, interconnect, and packaging design
    IEC 61188-5-4:2007 PRINTED BOARDS AND PRINTED BOARD ASSEMBLIES - DESIGN AND USE - PART 5-4: ATTACHMENT (LAND/JOINT) CONSIDERATIONS - COMPONENTS WITH J LEADS ON TWO SIDES
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