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  • PD IEC/PAS 61182-12:2014

    Current The latest, up-to-date edition.

    Generic requirements for printed board assembly products manufacturing description data and transfer methodology

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    Published date:  31-10-2014

    Publisher:  British Standards Institution

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    IEC PAS 61182-2:2014(E) specifies the XML schema that represents the intelligent data file format used to describe printed board and printed board assembly products with details sufficient for tooling, manufacturing, assembly, and inspection requirements. This format may be used for transmitting information between a printed board designer and a manufacturing or assembly facility. The data is most useful when the manufacturing cycle includes computer-aided processes and numerical control machines.

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    Committee EPL/501
    Document Type Standard
    Publisher British Standards Institution
    Status Current

    Standards Referencing This Book - (Show below) - (Hide below)

    ANSI Y14.5 : 1973 DIMENSIONING AND TOLERANCING FOR ENGINEERING DRAWINGS
    IPC T 50 : M TERMS AND DEFINITIONS FOR INTERCONNECTING AND PACKAGING ELECTRONIC CIRCUITS
    ASTM E 380 : 1993 Standard Practice for Use of the Internation System of Units (SI) (the Modernized Metric System) (Withdrawn 1997)
    IPC 2220 : LATEST IPC 2220 FAMILY OF DESIGN DOCUMENTS
    IPC 2611 : 0 GENERIC REQUIREMENTS FOR ELECTRONIC PRODUCT DOCUMENTATION
    DOD STD 100 : C NOTICE 6 ENGINEERING DRAWING PRACTICES
    IPC 2578 : 0 SECTIONAL REQUIREMENTS FOR SUPPLY CHAIN COMMUNICATION OF BILL OF MATERIAL AND PRODUCT DESIGN CONFIGURATION DATA - PRODUCT DATA EXCHANGE
    IPC D 325 : A DOCUMENTATION REQUIREMENTS FOR PRINTED BOARDS
    ISO 10303-212:2001 Industrial automation systems and integration — Product data representation and exchange — Part 212: Application protocol: Electrotechnical design and installation
    IPC 2614 : 0 SECTIONAL REQUIREMENTS FOR BOARD FABRICATION DOCUMENTATION
    ANSI Z210.1 : LATEST METRIC PRACTICE GUIDE
    IPC 4101 : D SPECIFICATION FOR BASE MATERIALS FOR RIGID AND MULTILAYER PRINTED BOARDS
    IPC 7351 : B GENERIC REQUIREMENTS FOR SURFACE MOUNT DESIGN AND LAND PATTERN STANDARD
    IPC 2615 : 0 PRINTED BOARD DIMENSIONS AND TOLERANCES
    IPC 2524 : 0 PWB FABRICATION DATA QUALITY RATING SYSTEM
    ISO 10303-221:2007 Industrial automation systems and integration — Product data representation and exchange — Part 221: Application protocol: Functional data and their schematic representation for process plants
    IPC 2576 : 0 SECTIONAL REQUIREMENTS FOR ELECTRONICS MANUFACTURING SUPPLY CHAIN COMMUNICATION OF AS-BUILT PRODUCT DATA - PRODUCT DATA EXCHANGE (PDX)
    IPC 2511 : B GENERIC REQUIREMENTS FOR IMPLEMENTATION OF PRODUCT MANUFACTURING DESCRIPTION DATA AND TRANSFER METHODOLOGY
    IPC 4104 : 1999 SPECIFICATION FOR HIGH DENSITY INTERCONNECT (HDI) AND MICROVIA MATERIALS
    IPC 2571 : 2001 GENERIC REQUIREMENTS FOR ELECTRONIC MANUFACTURING SUPPLY CHAIN COMMUNICATION - PRODUCT DATA EXCHANGE (PDX)
    IPC D 310 : C GUIDELINES FOR PHOTOTOOL GENERATION AND MEASUREMENT TECHNIQUES
    IPC 2501 : 0 DEFINITION FOR WEB-BASED EXCHANGE OF XML DATA
    ISO 10303-210:2011 Industrial automation systems and integration Product data representation and exchange Part 210: Application protocol: Electronic assembly, interconnect, and packaging design
    IPC 4103 : A SPECIFICATION FOR BASE MATERIALS FOR HIGH SPEED/HIGH FREQUENCY APPLICATIONS
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