IPC 2582 : 2007
Withdrawn
A Withdrawn Standard is one, which is removed from sale, and its unique number can no longer be used. The Standard can be withdrawn and not replaced, or it can be withdrawn and replaced by a Standard with a different number.
SECTIONAL REQUIREMENTS FOR IMPLEMENTATION OF ADMINISTRATIVE METHODS FOR MANUFACTURING DATA DESCRIPTION
23-08-2007
26-06-2007
1 SCOPE
1.1 Intent
1.2 Interpretation
2 APPLICABLE DOCUMENTS
3 REQUIREMENTS
3.1 Terms and Definitions
3.2 Categories and Content
4 GENERAL RULES
4.1 Administration
4.2 Content Element
4.2.1 FunctionMode
4.2.2 StepRef
4.2.3 LayerRef
4.2.4 BomRef
4.2.5 AvlRef
4.2.6 DictionaryStandard
4.2.7 DictionaryUser
4.2.8 DictionaryFont
4.2.9 DictionaryLineDesc
4.2.10 DictionaryColor
4.2.11 DictionaryFirmware
4.3 Logistic Header Elements
4.3.1 Role
4.3.2 Enterprise
4.3.3 Person
4.4 History Record Elements
4.4.1 HistoryRecord
5 MODELING
6 REPORT GENERATORS
7 REFERENCE INFORMATION
7.1 IPC
7.2 American National Standards Institute
7.3 Department of Defense
7.4 Electronic Industries Association
7.5 International Electrotechnical Commission (IEC)
7.6 International Organization for Standards (ISO)
APPENDIX A - ADMINISTRATIVE SCHEMA
Describes the XML schema that represents the intelligent data file format used to describe administration information related to ordering and specifying printed boards, printed board assemblies, fixtures, and components.
| DevelopmentNote |
IPC 2581 is a mandatory part of this standard. (07/2007)
|
| DocumentType |
Standard
|
| PublisherName |
Institute of Printed Circuits
|
| Status |
Withdrawn
|
| BS EN 61182-2-2:2012 | Printed board assembly products. Manufacturing description data and transfer methodology Sectional requirements for implementation of printed board fabrication data description |
| I.S. EN 61182-2-2:2012 | PRINTED BOARD ASSEMBLY PRODUCTS - MANUFACTURING DESCRIPTION DATA AND TRANSFER METHODOLOGY - PART 2-2: SECTIONAL REQUIREMENTS FOR IMPLEMENTATION OF PRINTED BOARD FABRICATION DATA DESCRIPTION (IEC 61182-2-2:2012 (EQV)) |
| EN 61182-2-2:2012 | Printed board assembly products - Manufacturing description data and transfer methodology - Part 2-2: Sectional requirements for implementation of printed board fabrication data description |
| IPC 2588 : 2007 | SECTIONAL REQUIREMENTS FOR IMPLEMENTATION OF PART LIST PRODUCT DATA DESCRIPTION |
| IPC 2583 : 2007 | SECTIONAL REQUIREMENTS FOR IMPLEMENTATION OF DESIGN CHARACTERISTICS FOR MANUFACTURING DATA DESCRIPTION |
| IPC 2584 : 2007 | SECTIONAL REQUIREMENTS FOR IMPLEMENTATION OF PRINTED BOARD FABRICATION DATA DESCRIPTION |
| IEC 61182-2-2:2012 | Printed board assembly products - Manufacturing description data and transfer methodology - Part 2-2: Sectional requirements for implementation of printed board fabrication data description |
| ANSI Y14.5 : 1973 | DIMENSIONING AND TOLERANCING FOR ENGINEERING DRAWINGS |
| IPC T 50 : M | TERMS AND DEFINITIONS FOR INTERCONNECTING AND PACKAGING ELECTRONIC CIRCUITS |
| IEC 61182-2:2006 | Printed board assembly products - Manufacturing description data and transfer methodology - Part 2: Generic requirements |
| IPC 2611 : 0 | GENERIC REQUIREMENTS FOR ELECTRONIC PRODUCT DOCUMENTATION |
| DOD STD 100 : C NOTICE 6 | ENGINEERING DRAWING PRACTICES |
| IPC D 325 : A | DOCUMENTATION REQUIREMENTS FOR PRINTED BOARDS |
| ANSI Z210.1 : LATEST | METRIC PRACTICE GUIDE |
| IPC 2615 : 0 | PRINTED BOARD DIMENSIONS AND TOLERANCES |
| IPC 2221B:2012 | GENERIC STANDARD ON PRINTED BOARD DESIGN |
| IPC D 310 : C | GUIDELINES FOR PHOTOTOOL GENERATION AND MEASUREMENT TECHNIQUES |
| IPC 2581 : B | GENERIC REQUIREMENTS FOR PRINTED BOARD ASSEMBLY PRODUCTS MANUFACTURING DESCRIPTION DATA AND TRANSFER METHODOLOGY |
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