IPC 2588 : 2007
Current
The latest, up-to-date edition.
SECTIONAL REQUIREMENTS FOR IMPLEMENTATION OF PART LIST PRODUCT DATA DESCRIPTION
Hardcopy
English
26-06-2007
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1 SCOPE
1.1 Intent
1.2 Interpretation
2 APPLICABLE DOCUMENTS
3 REQUIREMENTS
3.1 Terms and Definitions
3.2 Categories and Content
4 GENERAL RULES
4.1 Parts List/Bill of Material
4.2 Content Elements
4.3 Logistic Header Elements
4.4 History Record Elements
4.5 Bill of Material Elements
4.5.1 BomHeader
4.5.2 BomItem
4.5.3 BomItem RefDesc
4.5.4 BomItem Characteristics
4.6 Approved Vendor List (AVL)
4.6.1 AVL Header
4.6.2 AVL Item
5 MODELING
6 REPORT GENERATORS
7 REFERENCE INFORMATION
7.1 IPC
7.2 American National Standards Institute
7.3 Department of Defense
7.4 Electronic Industries Association
7.5 International Electrotechnical Commission (IEC)
7.6 International Organization for Standards (ISO)
Appendix A - Parts List Product Data Schema
This standard specifies the XML schema that represents the intelligent data file format used to describe part list product data.
| DevelopmentNote |
IPC 2581 is a mandatory part of this standard. (07/2007)
|
| DocumentType |
Standard
|
| Pages |
0
|
| PublisherName |
Institute of Printed Circuits
|
| Status |
Current
|
| BS EN 61182-2-2:2012 | Printed board assembly products. Manufacturing description data and transfer methodology Sectional requirements for implementation of printed board fabrication data description |
| I.S. EN 61182-2-2:2012 | PRINTED BOARD ASSEMBLY PRODUCTS - MANUFACTURING DESCRIPTION DATA AND TRANSFER METHODOLOGY - PART 2-2: SECTIONAL REQUIREMENTS FOR IMPLEMENTATION OF PRINTED BOARD FABRICATION DATA DESCRIPTION (IEC 61182-2-2:2012 (EQV)) |
| EN 61182-2-2:2012 | Printed board assembly products - Manufacturing description data and transfer methodology - Part 2-2: Sectional requirements for implementation of printed board fabrication data description |
| IPC 2584 : 2007 | SECTIONAL REQUIREMENTS FOR IMPLEMENTATION OF PRINTED BOARD FABRICATION DATA DESCRIPTION |
| IEC 61182-2-2:2012 | Printed board assembly products - Manufacturing description data and transfer methodology - Part 2-2: Sectional requirements for implementation of printed board fabrication data description |
| ANSI Y14.5 : 1973 | DIMENSIONING AND TOLERANCING FOR ENGINEERING DRAWINGS |
| IPC T 50 : M | TERMS AND DEFINITIONS FOR INTERCONNECTING AND PACKAGING ELECTRONIC CIRCUITS |
| IEC 61182-2:2006 | Printed board assembly products - Manufacturing description data and transfer methodology - Part 2: Generic requirements |
| IPC 2582 : 2007 | SECTIONAL REQUIREMENTS FOR IMPLEMENTATION OF ADMINISTRATIVE METHODS FOR MANUFACTURING DATA DESCRIPTION |
| IPC 2611 : 0 | GENERIC REQUIREMENTS FOR ELECTRONIC PRODUCT DOCUMENTATION |
| DOD STD 100 : C NOTICE 6 | ENGINEERING DRAWING PRACTICES |
| IPC D 325 : A | DOCUMENTATION REQUIREMENTS FOR PRINTED BOARDS |
| ANSI Z210.1 : LATEST | METRIC PRACTICE GUIDE |
| IPC 2615 : 0 | PRINTED BOARD DIMENSIONS AND TOLERANCES |
| IPC 2221B:2012 | GENERIC STANDARD ON PRINTED BOARD DESIGN |
| IPC D 310 : C | GUIDELINES FOR PHOTOTOOL GENERATION AND MEASUREMENT TECHNIQUES |
| IPC 2581 : B | GENERIC REQUIREMENTS FOR PRINTED BOARD ASSEMBLY PRODUCTS MANUFACTURING DESCRIPTION DATA AND TRANSFER METHODOLOGY |
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