1. Scope
2. Referenced Documents
2.1 Japan Printed Circuits Association 1
2.2 International Electrotechnical Commision
2.3 IPC
3. Definition of Terms
4. Test Methods
5. Performance Levels
6. Base Materials
7. Visual Inspection
7.1 Test Environment
7.2 Test Specimens
7.3 Tools for Testing
7.4 Preparation of Limit Samples
7.5 Description of Inspections
7.5.1 Visual Inspection of Conductors
7.5.2 Visual Inspection of Base Film
7.5.3 Visual Inspection of Coverlay and Covercoat
7.5.4 Visual Inspection of Plating
7.5.5 Visual Inspection of Edges of Outline and Holes
7.5.6 Visual Imperfections Related to Stiffener Bonding
7.5.7 Other Visual Inspection
8. Dimensional Inspections
8.1 Measurement of Dimensions
8.2 External dimensions
8.3 Thickness
8.4 Holes
8.4.1 Component Holes
8.4.2 Vias
8.4.3 Mounting Holes
8.5 Conductor Widths
8.6 Clearances Between Hole Centers
8.8 Minimum Distance Between Board Edges and Conductors
8.9 Positional Accuracy
8.9.1 Positional Accuracy of Holes
8.9.2 Registration of Hole to Land
8.9.3 Registration of Coverlay (or Covercoat) to Land
8.9.4 Registration of Stiffener to IPC
8.9.5 Registration of Punched Outline to Conductor Patterns
8.10 Registration of Pressure Sensitive or Heat Activated Adhesive
(Including Adhesive Squeeze-Out) to Flexible Printed Board
and Stiffener
8.11 Plating Thickness of Copper Plated- Through Holes
9. Testing of Electrical Performance
10 Testing of Mechanical Performance
11 Environmental Performance
12 Migration
13 Chemical Resistance
14 Cleanliness
15 Flame Resistance
16 Marking, Packaging, and Storage
16.1 Marking on Products
16.2 Marking on Package
16.3 Packaging and Storage
16.3.1 Packaging
16.3.2 Storage
16.3.3 Handling
Appendix I
Appendix II
Appendix III
Figures 1-31
Tables 1-38