IPC 6801 : 0
Withdrawn
A Withdrawn Standard is one, which is removed from sale, and its unique number can no longer be used. The Standard can be withdrawn and not replaced, or it can be withdrawn and replaced by a Standard with a different number.
IPC/JPCA TERMS & DEFINITIONS, TEST METHODS, AND DESIGN EXAMPLES FOR BUILD-UP/HIGH DENSITY INTERCONNECT (HDI) PRINTED WIRING BOARDS
12-09-2023
1 SCOPE
2 APPLICABLE DOCUMENTS
3 DEFINITIONS OF STRUCTURES AND TERMS
3.1 Structures
3.2 Terms and Definitions
3.3 Design
3.4 Manufacturing
3.5 Testing and Inspection
4 TEST METHODS FOR BUILD-UP/HDI MATERIALS
4.1 Coefficient of Thermal Expansion - Thermomechanical
Analyzer
4.2 Mechanical Properties
4.3 Water Absorption Property
4.4 Drying Property
4.5 Ionic Impurity
4.6 Flexibility
4.7 Dielectric Constant
5 TEST METHOD FOR BUILD-UP PRINTED BOARDS
5.1 Coefficient of Thermal Expansion (CTE)
5.2 Water Absorption Property
5.3 Drying Property
5.4 Ionic Impurity
5.5 Characteristic Impedance
5.6 Flatness
6 TEST METHOD FOR G BUILD-UP PRINTED BOARD
6.1 Peel Strength of Conductor Layer
6.2 Pull-Off Strength of Pads
6.3 Thermal Resistance Test for Packaging Build-Up
Printed Boards
7 RELIABILITY TEST METHODS
7.1 Thermal Shock Test (in Air)
7.2 Bias Test at High Temperature and High Humidity
7.3 High Temperature Shelf Test
8 DESIGN EXAMPLE
9 DESCRIPTION (CONTINUED DISCUSSION ITEMS/BACKGROUND OF
DEVELOPING JPCA STANDARD FOR BUILD-UP PRINTED BOARDS
9.1 Test Pattern
9.2 Description of Accelerated Test
Lists terms specific to HDI and test methods for CTE for materials and HDI PWBs, peel strength and thermal shock. Also includes a design criteria table and background information for the development of a standard HDI PWBs.
| DocumentType |
Standard
|
| PublisherName |
Institute of Printed Circuits
|
| Status |
Withdrawn
|
| IPC HDI 1 : LATEST | HIGH DENSITY INTERCONNECT MICROVIA TECHNOLOGY COMPENDIUM |
| IPC T 50 : M | TERMS AND DEFINITIONS FOR INTERCONNECTING AND PACKAGING ELECTRONIC CIRCUITS |
| IPC 2315 : 0 | DESIGN GUIDE FOR HIGH DENSITY INTERCONNECTS AND MICROVIAS |
| IPC TM 650 : 0 | TEST METHODS MANUAL |
| IPC 4104 : 1999 | SPECIFICATION FOR HIGH DENSITY INTERCONNECT (HDI) AND MICROVIA MATERIALS |
| IPC HDI 1 : LATEST | HIGH DENSITY INTERCONNECT MICROVIA TECHNOLOGY COMPENDIUM |
| IPC 6016 : 0 | QUALIFICATION AND PERFORMANCE SPECIFICATION FOR HIGH DENSITY INTERCONNECT (HDI) LAYERS OR BOARDS |
Access your standards online with a subscription
Features
-
Simple online access to standards, technical information and regulations.
-
Critical updates of standards and customisable alerts and notifications.
-
Multi-user online standards collection: secure, flexible and cost effective.