Skip to content
Please enter a keyword to search

  • IPC 6016 : 0

    View superseded by
    Superseded A superseded Standard is one, which is fully replaced by another Standard, which is a new edition of the same Standard.
    View superseded by

    QUALIFICATION AND PERFORMANCE SPECIFICATION FOR HIGH DENSITY INTERCONNECT (HDI) LAYERS OR BOARDS

    Available format(s):  Hardcopy

    Superseded date:  01-09-2015

    Language(s):  English

    Published date: 

    Publisher:  Institute of Printed Circuits

    Add To Cart

    Table of Contents - (Show below) - (Hide below)

    1 SCOPE
      1.1 Purpose
      1.2 Performance Classification
      1.3 Slash Sheet Categories
      1.4 Documentation Hierarchy
    2 APPLICABLE DOCUMENTS
      2.1 IPC
      2.2 Joint Industry Standards
    3 REQUIREMENTS
      3.1 General
      3.2 Materials
      3.3 Visual Examination
      3.4 Dimensional Requirements
      3.5 Conductor Definition
      3.6 Structural Integrity
      3.7 Other Tests
      3.8 Solder Resist (Solder Mask) Requirements
      3.9 Electrical Properties
      3.10 Environmental
      3.11 Special Requirements
      3.12 Repair
    4 QUALITY ASSURANCE
      4.1 General
    Appendix A

    Abstract - (Show below) - (Hide below)

    Gives specific electrical, mechanical and environmental requirements for organic HDI layers with microvia technology. The acceptance criteria of the HDI layers are organized into specification sheets that reflect typical end-use applications, such as cellular phones, avionics, automotive and personal computers.

    General Product Information - (Show below) - (Hide below)

    Development Note To be used with IPC 6011 and IPC 6012. (03/2002) Included in IPC 6010 SERIES. (09/2003) Also available in CD-ROM format. (09/2005)
    Document Type Standard
    Publisher Institute of Printed Circuits
    Status Superseded
    Superseded By

    Standards Referenced By This Book - (Show below) - (Hide below)

    IPC 6012 RUSSIAN : C QUALIFICATION AND PERFORMANCE SPECIFICATION FOR RIGID PRINTED BOARDS
    IPC 6012 POLISH : C QUALIFICATION AND PERFORMANCE SPECIFICATION FOR RIGID PRINTED BOARDS
    IPC 4553 : A SPECIFICATION FOR IMMERSION SILVER PLATING FOR PRINTED BOARDS
    IPC 6010 SERIES : LATEST IPC-6010 QUALIFICATION AND PERFORMANCE SERIES
    IPC 4553 CHINESE : A SPECIFICATION FOR IMMERSION SILVER PLATING FOR PRINTED BOARDS
    IPC 6012 FRENCH : C QUALIFICATION AND PERFORMANCE SPECIFICATION FOR RIGID PRINTED BOARDS
    IPC 6018 CHINESE : B QUALIFICATION AND PERFORMANCE SPECIFICATION FOR HIGH FREQUENCY (MICROWAVE) PRINTED BOARD
    IPC HDI 1 : LATEST HIGH DENSITY INTERCONNECT MICROVIA TECHNOLOGY COMPENDIUM
    IPC 6801 : 0 IPC/JPCA TERMS & DEFINITIONS, TEST METHODS, AND DESIGN EXAMPLES FOR BUILD-UP/HIGH DENSITY INTERCONNECT (HDI) PRINTED WIRING BOARDS
    View more information

    • Access your standards online with a subscription

      Features

      • Simple online access to standards, technical information and regulations
      • Critical updates of standards and customisable alerts and notifications
      • Multi - user online standards collection: secure, flexibile and cost effective