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IPC 6016 : 0

Superseded

Superseded

A superseded Standard is one, which is fully replaced by another Standard, which is a new edition of the same Standard.

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superseded

A superseded Standard is one, which is fully replaced by another Standard, which is a new edition of the same Standard.

QUALIFICATION AND PERFORMANCE SPECIFICATION FOR HIGH DENSITY INTERCONNECT (HDI) LAYERS OR BOARDS

Available format(s)

Hardcopy

Superseded date

01-09-2015

Language(s)

English

1 SCOPE
  1.1 Purpose
  1.2 Performance Classification
  1.3 Slash Sheet Categories
  1.4 Documentation Hierarchy
2 APPLICABLE DOCUMENTS
  2.1 IPC
  2.2 Joint Industry Standards
3 REQUIREMENTS
  3.1 General
  3.2 Materials
  3.3 Visual Examination
  3.4 Dimensional Requirements
  3.5 Conductor Definition
  3.6 Structural Integrity
  3.7 Other Tests
  3.8 Solder Resist (Solder Mask) Requirements
  3.9 Electrical Properties
  3.10 Environmental
  3.11 Special Requirements
  3.12 Repair
4 QUALITY ASSURANCE
  4.1 General
Appendix A

Gives specific electrical, mechanical and environmental requirements for organic HDI layers with microvia technology. The acceptance criteria of the HDI layers are organized into specification sheets that reflect typical end-use applications, such as cellular phones, avionics, automotive and personal computers.

DevelopmentNote
To be used with IPC 6011 and IPC 6012. (03/2002) Included in IPC 6010 SERIES. (09/2003) Also available in CD-ROM format. (09/2005)
DocumentType
Standard
Pages
28
PublisherName
Institute of Printed Circuits
Status
Superseded
SupersededBy

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IPC 4553 : A SPECIFICATION FOR IMMERSION SILVER PLATING FOR PRINTED BOARDS
IPC 6010 SERIES : LATEST IPC-6010 QUALIFICATION AND PERFORMANCE SERIES
IPC 4553 CHINESE : A SPECIFICATION FOR IMMERSION SILVER PLATING FOR PRINTED BOARDS
IPC 6012 FRENCH : C QUALIFICATION AND PERFORMANCE SPECIFICATION FOR RIGID PRINTED BOARDS
IPC 6018 CHINESE : B QUALIFICATION AND PERFORMANCE SPECIFICATION FOR HIGH FREQUENCY (MICROWAVE) PRINTED BOARD
IPC HDI 1 : LATEST HIGH DENSITY INTERCONNECT MICROVIA TECHNOLOGY COMPENDIUM
IPC 6801 : 0 IPC/JPCA TERMS & DEFINITIONS, TEST METHODS, AND DESIGN EXAMPLES FOR BUILD-UP/HIGH DENSITY INTERCONNECT (HDI) PRINTED WIRING BOARDS

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