IPC 6016 : 0
Superseded
A superseded Standard is one, which is fully replaced by another Standard, which is a new edition of the same Standard.
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QUALIFICATION AND PERFORMANCE SPECIFICATION FOR HIGH DENSITY INTERCONNECT (HDI) LAYERS OR BOARDS
English
01-09-2015
1 SCOPE
1.1 Purpose
1.2 Performance Classification
1.3 Slash Sheet Categories
1.4 Documentation Hierarchy
2 APPLICABLE DOCUMENTS
2.1 IPC
2.2 Joint Industry Standards
3 REQUIREMENTS
3.1 General
3.2 Materials
3.3 Visual Examination
3.4 Dimensional Requirements
3.5 Conductor Definition
3.6 Structural Integrity
3.7 Other Tests
3.8 Solder Resist (Solder Mask) Requirements
3.9 Electrical Properties
3.10 Environmental
3.11 Special Requirements
3.12 Repair
4 QUALITY ASSURANCE
4.1 General
Appendix A
Gives specific electrical, mechanical and environmental requirements for organic HDI layers with microvia technology. The acceptance criteria of the HDI layers are organized into specification sheets that reflect typical end-use applications, such as cellular phones, avionics, automotive and personal computers.
| DevelopmentNote |
To be used with IPC 6011 and IPC 6012. (03/2002) Included in IPC 6010 SERIES. (09/2003) Also available in CD-ROM format. (09/2005)
|
| DocumentType |
Standard
|
| Pages |
24
|
| PublisherName |
IPC by Global Electronics Association
|
| Status |
Superseded
|
| SupersededBy |
| IPC 6012 RUSSIAN : C | QUALIFICATION AND PERFORMANCE SPECIFICATION FOR RIGID PRINTED BOARDS |
| IPC 6012 POLISH : C | QUALIFICATION AND PERFORMANCE SPECIFICATION FOR RIGID PRINTED BOARDS |
| IPC 4553 : A | SPECIFICATION FOR IMMERSION SILVER PLATING FOR PRINTED BOARDS |
| IPC 6010 SERIES : LATEST | IPC-6010 QUALIFICATION AND PERFORMANCE SERIES |
| IPC 4553 CHINESE : A | SPECIFICATION FOR IMMERSION SILVER PLATING FOR PRINTED BOARDS |
| IPC 6012 FRENCH : C | QUALIFICATION AND PERFORMANCE SPECIFICATION FOR RIGID PRINTED BOARDS |
| IPC 6018 CHINESE : B | QUALIFICATION AND PERFORMANCE SPECIFICATION FOR HIGH FREQUENCY (MICROWAVE) PRINTED BOARD |
| IPC HDI 1 : LATEST | HIGH DENSITY INTERCONNECT MICROVIA TECHNOLOGY COMPENDIUM |
| IPC 6801 : 0 | IPC/JPCA TERMS & DEFINITIONS, TEST METHODS, AND DESIGN EXAMPLES FOR BUILD-UP/HIGH DENSITY INTERCONNECT (HDI) PRINTED WIRING BOARDS |
| IPC 6011 : 0 | GENERIC PERFORMANCE SPECIFICATION FOR PRINTED BOARDS |
| IPC 2220 : LATEST | IPC 2220 FAMILY OF DESIGN DOCUMENTS |
| IPC 2315 : 0 | DESIGN GUIDE FOR HIGH DENSITY INTERCONNECTS AND MICROVIAS |
| IPC SM 840 : E | QUALIFICATION AND PERFORMANCE SPECIFICATION OF PERMANENT SOLDER MASK AND FLEXIBLE COVER MATERIALS |
| IPC S 100 : LATEST | STANDARDS AND SPECIFICATIONS MANUAL |
| IPC PE 740 : 0 | TROUBLESHOOTING FOR PRINTED BOARD MANUFACTURE AND ASSEMBLY |
| IPC HDI 1 : LATEST | HIGH DENSITY INTERCONNECT MICROVIA TECHNOLOGY COMPENDIUM |