IPC 7711 : 1998
Superseded
A superseded Standard is one, which is fully replaced by another Standard, which is a new edition of the same Standard.
View Superseded by
REWORK OF ELECTRONIC ASSEMBLIES
01-10-2003
12-01-2013
1 General
2 Handling/Cleaning
2.1 Handling Electronic Assemblies
2.2 Cleaning
2.3 Conditioning
2.4 Coating
3 Removal
3.1 Through-Hole Removal
3.2 PGA and Connector Removal
3.3 Chip Component Removal
3.4 Leadless Component removal
3.5 SOT Removal
3.6 Gull Wing Removal (two sided)
3.7 Gull Wing Removal (four sided)
3.8 J-Lead Removal
3.9 BGA/CSP Removal
3.10 PLCC Socket Removal
4 Pad/Land Preparation
5 Installation
5.1 Through-Hole Installation
5.2 PGA and Connector Installation
5.3 Chip Installation
5.4 Leadless Component Installation
5.5 Gull Wing Installation
5.6 J-Lead Installation
5.7 BGA-CSP Installation
6 Removing Shorts
7 Bonding/Coating
8 Wires
8.1 Splicing
Gives procedures for reworking electronic assemblies, either once the assemblies have been in the field or as part of the manufacturing process. The procedural requirements for materials, tools and methods used in replacing and removing conformal coatings, through-hole components and surface mounts are prescribed.
| DevelopmentNote |
Supersedes IPC R 700. (08/1998) This document is included in IPC 7711/21 (7711 AND 7721 PACKAGE) (06/2002) Included in the E-500 Collection. (09/2003)
|
| DocumentType |
Standard
|
| PublisherName |
Institute of Printed Circuits
|
| Status |
Superseded
|
| SupersededBy | |
| Supersedes |
| IPC D 326 : A | INFORMATION REQUIREMENTS FOR MANUFACTURING PRINTED CIRCUIT BOARDS AND OTHER ELECTRONIC ASSEMBLIES |
| IPC J STD 033 RUSSIAN : B | HANDLING, PACKING, SHIPPING AND USE OF MOISTURE/REFLOW SENSITIVE SURFACE MOUNT DEVICES |
| IPC J STD 033 CHINESE : B-1 | HANDLING, PACKING, SHIPPING AND USE OF MOISTURE/REFLOW SENSITIVE SURFACE MOUNT DEVICES |
| IPC J STD 033 GERMAN : C | HANDLING, PACKING, SHIPPING, AND USE OF MOISTURE/REFLOW AND/OR PROCESS SENSITIVE COMPONENTS |
| IPC J STD 033 ITALIAN : B | HANDLING, PACKING, SHIPPING AND USE OF MOISTURE/REFLOW SENSITIVE SURFACE MOUNT DEVICES |
| ARINC 669 : 2004 | GUIDANCE FOR LEAD-BASED SOLDERING, REPAIR AND REWORK |
| GEIA HB 0005-3 : 2008 | REWORK/REPAIR HANDBOOK TO ADDRESS THE IMPLICATIONS OF LEAD-FREE ELECTRONICS AND MIXED ASSEMBLIES IN AEROSPACE AND HIGH PERFORMANCE ELECTRONIC SYSTEMS |
| ARINC 671 : 2006 | GUIDANCE FOR THE TRANSITION TO LEAD-FREE SOLDERING, MAINTENANCE, AND REPAIR |
| IEC 61192-5:2007 | Workmanship requirements for soldered electronic assemblies - Part 5: Rework, modification and repair of soldered electronic assemblies |
| IEC PAS 62249:2001 | Qualification and performance specification for flexible printed boards |
| BS EN 61192-5:2007 | Workmanship requirements for soldered electric assemblies Rework, modification and repair of soldered electronic assemblies |
| I.S. EN 61192-5:2007 | WORKMANSHIP REQUIREMENTS FOR SOLDERED ELECTRONIC ASSEMBLIES - PART 5: REWORK, MODIFICATION AND REPAIR OF SOLDERED ELECTRONIC ASSEMBLIES |
| EN 61192-5 : 2007 | WORKMANSHIP REQUIREMENTS FOR SOLDERED ELECTRONIC ASSEMBLIES - PART 5: REWORK, MODIFICATION AND REPAIR OF SOLDERED ELECTRONIC ASSEMBLIES |
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