• There are no items in your cart

IPC 9702 : 0

Superseded

Superseded

A superseded Standard is one, which is fully replaced by another Standard, which is a new edition of the same Standard.

View Superseded by

MONOTONIC BEND CHARACTERIZATION OF BOARD-LEVEL INTERCONNECTS

Superseded date

14-09-2023

Superseded by

IPC 9703 : 0

Published date

16-12-2021

Sorry this product is not available in your region.

1 FOREWORD
2 INTRODUCTION
3 SCOPE
4 TERMS AND DEFINITIONS
5 SYMBOLS AND ABBREVIATED TERMS
6 SAMPLING
7 APPARATUS
  7.1 Universal Tester
  7.2 Strain Measurement Equipment
  7.3 Continuity Monitoring Equipment
8 PROCEDURE
  8.1 Component Sample
  8.2 Test Board Material
  8.3 Test Board Thickness and Metal Layer
  8.4 Test Board Surface Finish
  8.5 Test Board Land Pads
  8.6 Test Board Layout
  8.7 Test Board Daisy-Chain Links
  8.8 Board Assembly
  8.9 Storage
  8.10 Strain Gages
  8.11 Set-Up Test Board
  8.12 Four-Point Bend Test
9 FAILURE CRITERIA AND ANALYSIS
ANNEX A
ANNEX B

Describes a common method of establishing the fracture resistance of board-level device interconnects to flexural loading during non-cyclic board assembly and test operations.

DevelopmentNote
Included in IPC C 103 & IPC C 1000. (07/2008) Also available in Chinese langugae, See IPC 9702 CHINESE. (09/2011) Also available in Hardcopy format. (01/2018)
DocumentType
Standard
PublisherName
Institute of Printed Circuits
Status
Superseded
SupersededBy

IPC 9704 CHINESE : - PRINTED WIRING BOARD STRAIN GAGE TEST GUIDELINE
IPC 9707 : 0 SPHERICAL BEND TEST METHOD FOR CHARACTERIZATION OF BOARD LEVEL INTERCONNECTS
IPC 9709 : 0 TEST GUIDELINES FOR ACOUSTIC EMISSION MEASUREMENT DURING MECHANICAL TESTING
IPC 9701 : A PERFORMANCE TEST METHODS AND QUALIFICATION REQUIREMENTS FOR SURFACE MOUNT SOLDER ATTACHMENTS
IPC 9701 CHINESE : A PERFORMANCE TEST METHODS AND QUALIFICATION REQUIREMENTS FOR SURFACE MOUNT SOLDER ATTACHMENTS
IPC 9704 : A PRINTED CIRCUIT ASSEMBLY STRAIN GAGE TEST GUIDELINE

IPC 9501 : 0 PWB ASSEMBLY PROCESS SIMULATION FOR EVALUATION OF ELECTRONIC COMPONENTS (PRECONDITIONING IC COMPONENTS)
IPC D 279 : 0 DESIGN GUIDELINES FOR RELIABLE SURFACE MOUNT TECHNOLOGY PRINTED BOARD ASSEMBLIES
IPC 9701 : A PERFORMANCE TEST METHODS AND QUALIFICATION REQUIREMENTS FOR SURFACE MOUNT SOLDER ATTACHMENTS

Access your standards online with a subscription

Features

  • Simple online access to standards, technical information and regulations.

  • Critical updates of standards and customisable alerts and notifications.

  • Multi-user online standards collection: secure, flexible and cost effective.