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  • IPC 9701 CHINESE : A

    Withdrawn A Withdrawn Standard is one, which is removed from sale, and its unique number can no longer be used. The Standard can be withdrawn and not replaced, or it can be withdrawn and replaced by a Standard with a different number.

    PERFORMANCE TEST METHODS AND QUALIFICATION REQUIREMENTS FOR SURFACE MOUNT SOLDER ATTACHMENTS

    Available format(s): 

    Withdrawn date:  23-07-2013

    Language(s): 

    Published date: 

    Publisher:  Institute of Printed Circuits

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    Development Note Also available in CD-ROM format. (10/2010)
    Document Type Standard
    Publisher Institute of Printed Circuits
    Status Withdrawn

    Standards Referencing This Book - (Show below) - (Hide below)

    IPC 9704 : A PRINTED CIRCUIT ASSEMBLY STRAIN GAGE TEST GUIDELINE
    IPC 9501 : 0 PWB ASSEMBLY PROCESS SIMULATION FOR EVALUATION OF ELECTRONIC COMPONENTS (PRECONDITIONING IC COMPONENTS)
    IPC S 100 : LATEST STANDARDS AND SPECIFICATIONS MANUAL
    IPC 7351 : B GENERIC REQUIREMENTS FOR SURFACE MOUNT DESIGN AND LAND PATTERN STANDARD
    IPC E 500 : LATEST IPC ELECTRONIC DOCUMENT COLLECTION
    IPC 9504 : 0 ASSEMBLY PROCESS SIMULATION FOR EVALUATION OF NON-IC COMPONENTS (PRECONDITIONING NON-IC COMPONENTS)
    IPC 9502 : 0 PWB ASSEMBLY SOLDERING PROCESS GUIDELINE FOR ELECTRONIC COMPONENTS
    IPC D 279 : 0 DESIGN GUIDELINES FOR RELIABLE SURFACE MOUNT TECHNOLOGY PRINTED BOARD ASSEMBLIES
    IPC 9702 : 0 MONOTONIC BEND CHARACTERIZATION OF BOARD-LEVEL INTERCONNECTS
    IPC M 103 : LATEST STANDARDS FOR SURFACE MOUNT ASSEMBLIES MANUAL
    IPC SM 785 : 0 GUIDELINES FOR ACCELERATED RELIABILITY TESTING OF SURFACE MOUNT ATTACHMENTS
    IPC 9500 : 2003 ASSEMBLY PROCESS COMPONENT SIMULATIONS, GUIDELINES & CLASSIFICATIONS PACKAGE
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