IPC 9702 : 0
Superseded
A superseded Standard is one, which is fully replaced by another Standard, which is a new edition of the same Standard.
View Superseded by
MONOTONIC BEND CHARACTERIZATION OF BOARD-LEVEL INTERCONNECTS
English
16-12-2021
14-09-2023
1 FOREWORD
2 INTRODUCTION
3 SCOPE
4 TERMS AND DEFINITIONS
5 SYMBOLS AND ABBREVIATED TERMS
6 SAMPLING
7 APPARATUS
7.1 Universal Tester
7.2 Strain Measurement Equipment
7.3 Continuity Monitoring Equipment
8 PROCEDURE
8.1 Component Sample
8.2 Test Board Material
8.3 Test Board Thickness and Metal Layer
8.4 Test Board Surface Finish
8.5 Test Board Land Pads
8.6 Test Board Layout
8.7 Test Board Daisy-Chain Links
8.8 Board Assembly
8.9 Storage
8.10 Strain Gages
8.11 Set-Up Test Board
8.12 Four-Point Bend Test
9 FAILURE CRITERIA AND ANALYSIS
ANNEX A
ANNEX B
Describes a common method of establishing the fracture resistance of board-level device interconnects to flexural loading during non-cyclic board assembly and test operations.
| DevelopmentNote |
Included in IPC C 103 & IPC C 1000. (07/2008) Also available in Chinese langugae, See IPC 9702 CHINESE. (09/2011) Also available in Hardcopy format. (01/2018)
|
| DocumentType |
Standard
|
| ISBN |
978-1-63816-034-2
|
| Pages |
28
|
| ProductNote |
New child AMD 1 2015 is now added
|
| PublisherName |
IPC by Global Electronics Association
|
| Status |
Superseded
|
| SupersededBy |
| IPC 9704 CHINESE : - | PRINTED WIRING BOARD STRAIN GAGE TEST GUIDELINE |
| IPC 9707 : 0 | SPHERICAL BEND TEST METHOD FOR CHARACTERIZATION OF BOARD LEVEL INTERCONNECTS |
| IPC 9709 : 0 | TEST GUIDELINES FOR ACOUSTIC EMISSION MEASUREMENT DURING MECHANICAL TESTING |
| IPC 9701 : A | PERFORMANCE TEST METHODS AND QUALIFICATION REQUIREMENTS FOR SURFACE MOUNT SOLDER ATTACHMENTS |
| IPC 9701 CHINESE : A | PERFORMANCE TEST METHODS AND QUALIFICATION REQUIREMENTS FOR SURFACE MOUNT SOLDER ATTACHMENTS |
| IPC 9704 : A | PRINTED CIRCUIT ASSEMBLY STRAIN GAGE TEST GUIDELINE |
| IPC 9501 : 0 | PWB ASSEMBLY PROCESS SIMULATION FOR EVALUATION OF ELECTRONIC COMPONENTS (PRECONDITIONING IC COMPONENTS) |
| IPC D 279 : 0 | DESIGN GUIDELINES FOR RELIABLE SURFACE MOUNT TECHNOLOGY PRINTED BOARD ASSEMBLIES |
| IPC 9701 : A | PERFORMANCE TEST METHODS AND QUALIFICATION REQUIREMENTS FOR SURFACE MOUNT SOLDER ATTACHMENTS |