IPC 9691 : A
Superseded
A superseded Standard is one, which is fully replaced by another Standard, which is a new edition of the same Standard.
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USER GUIDE FOR THE IPC-TM-650, METHOD 2.6.25, CONDUCTIVE ANODIC FILAMENT (CAF) RESISTANCE AND OTHER INTERNAL ELECTROCHEMICAL MIGRATION TESTING
Chinese, German, English
05-10-2023
1 SCOPE
2 BACKGROUND
3 PURPOSE
4 INTRODUCTION
5 WHAT IS CONDUCTIVE ANODIC FILAMENT
GROWTH?
6 OTHER INTERNAL ECM MODES
7 INCREASING INTERNAL ECM RISK TRENDS
8 ADJUSTED CALCE CAF FAILURE MODEL
9 INTERNAL ECM TEST VEHICLE DESIGN
10 INTERNAL ECM TEST BOARD SAMPLE
PREPARATION & TESTING
11 INTERNAL ECM TEST DATA FORMAT
12 INTERNAL ECM TEST SPACING DATA
ANALYSIS
13 SAMPLE SIZES
14 RELATING CAF RESISTANCE TEST
RESULTS TO EXPECTED FIELD LIFE
15 SPECIFYING INTERNAL ECM RESISTANCE
16 LOCATION OF TESTING
17 LOCATING INTERNAL ECM FAILURES
18 FACTORS AFFECTING INTERNAL ECM
RESISTANCE
19 CONCLUSIONS
20 SUMMARY
APPENDIX A - Other Internal ECM or CAF
Resistance Test Boards/Coupons
Gives guidance regarding implementation of the User Guide for the IPC-TM-650, Method 2.6.25, Conductive Anodic Filament (CAF) Resistance and Other Internal Electrochemical Migration Testing to evaluate the effects of mechanical stress, laminate material fracturing, ionic contamination, moisture content prior to press lamination, and other material processing characteristics on formation of conductive paths within laminate material such as conductive anodic filaments (CAF), one specific type of ECM failure mode.
| Committee |
5-30
|
| DevelopmentNote |
Included in IPC C 107. (06/2008) Included in IPC C 105 & IPC C 1000. (07/2008) A2007 Edition is still available in German & Chinese languages, See separate records. (09/2016) Also available in Hardcopy format. (01/2018)
|
| DocumentType |
Standard
|
| Pages |
28
|
| PublisherName |
IPC by Global Electronics Association
|
| Status |
Superseded
|
| SupersededBy | |
| Supersedes |
| 15/30331587 DC : 0 | BS EN 61189-5-503 - TEST METHODS FOR ELECTRICAL MATERIALS, PRINTED BOARDS AND OTHER INTERCONNECTION STRUCTURES AND ASSEMBLIES - PART 5-503: GENERAL TEST METHODS FOR MATERIALS AND ASSEMBLIES - CONDUCTIVE ANODIC FILAMENTS (CAF) TESTING OF CIRCUIT BOARDS |
| BS EN IEC 61189-5-503:2017 | Test methods for electrical materials, printed board and other interconnection structures and assemblies General test method for materials and assemblies. Conductive anodic filaments (CAF) testing of circuit boards |
| IEC 61189-5-503:2017 | Test methods for electrical materials, printed board and other interconnection structures and assemblies - Part 5-503: General test method for materials and assemblies - Conductive anodic filaments (CAF) testing of circuit boards |
| EN 61189-5-1:2016 | Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 5-1: General test methods for materials and assemblies - Guidance for printed board assemblies |
| EN 61189-5-503:2017 | Test methods for electrical materials, printed board and other interconnection structures and assemblies - Part 5-503: General test method for materials and assemblies - Conductive anodic filaments (CAF) testing of circuit boards |
| IPC 5702 : 0 | GUIDELINES FOR OEMS IN DETERMINING ACCEPTABLE LEVELS OF CLEANLINESS OF UNPOPULATED PRINTED BOARDS |
| IPC HDBK 840 : 0 | SOLDER MASK HANDBOOK |
| IPC J STD 001 DANISH : E | REQUIREMENTS FOR SOLDERED ELECTRICAL AND ELECTRONIC ASSEMBLIES |
| BS EN 61189-5-1:2016 | Test methods for electrical materials, printed boards and other interconnection structures and assemblies General test methods for materials and assemblies. Guidance for printed board assemblies |
| CEI EN 61189-5-503 : 1ED 2017 | TEST METHODS FOR ELECTRICAL MATERIALS, PRINTED BOARD AND OTHER INTERCONNECTION STRUCTURES AND ASSEMBLIES - PART 5-503: GENERAL TEST METHOD FOR MATERIALS AND ASSEMBLIES - CONDUCTIVE ANODIC FILAMENTS (CAF) TESTING OF CIRCUIT BOARDS |
| IEC 61189-5-1:2016 | Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 5-1: General test methods for materials and assemblies - Guidance for printed board assemblies |
| I.S. EN 61189-5-503:2017 | TEST METHODS FOR ELECTRICAL MATERIALS, PRINTED BOARD AND OTHER INTERCONNECTION STRUCTURES AND ASSEMBLIES - PART 5-503: GENERAL TEST METHOD FOR MATERIALS AND ASSEMBLIES - CONDUCTIVE ANODIC FILAMENTS (CAF) TESTING OF CIRCUIT BOARDS |