IPC D 316 : 1995

1 General
  1.1 Purpose
  1.2 Scope
  1.3 Terms and Definitions
  1.4 Interpretation
2 Applicable/Reference Documents
  2.1 IPC
  2.2 ANSI
  2.3 Military Standards and Specifications
  2.5 Reference Information
3 Design Considerations
  3.1 Initial Input
  3.2 Design Options
  3.3 Line Type, Materials and Components
  3.4 Electrical Design
  3.5 Mechanical Design
  3.6 Preliminary Design Review
  3.7 Brassboard
  3.8 Prototype
  3.9 Documentation
  3.10 Final Design Review
4 Documentation Requirements
  4.1 Design Features Printed
  4.2 Master Drawing
  4.3 Master Pattern
5 Materials
  5.1 Microwave Printed Circuit Board Materials
  5.2 Bonding Films
  5.3 Metals
  5.4 Conformal Coating
6 Electrical Characteristics
  6.1 Stripline
  6.2 Microstrip
7 Detailed Board Requirements
  7.1 Machined Features
  7.2 Imaging
  7.3 PTFE Activation
  7.4 Metallization
  7.5 Etching
  7.6 Bonding
  7.7 Testing
8 Device Attachments and Packaging
  8.2 Connector Attachment
  8.3 Device Attachment
9 Quality Assurance
  9.1 Quality Conformance Evaluations
  9.2 Reliability

Addresses microwave circuitry. For the purpose of this document microwaves apply to radio waves in the frequency range of 100 MHz and to 30 GHz. Also applies to operations in the region where distributed constant circuits enclosed by conducting lumped-constant circuit elements.