IPC 2224 : 0

1.0 SCOPE
     1.1 Purpose
     1.2 Documentation Hierarchy
     1.3 Presentation
     1.4 Interpretation
     1.5 Classification of Products
2.0 APPLICABLE DOCUMENTS
     2.1 Reference Documents
3.0 GENERAL REQUIREMENTS
     3.1 Test Requirement Considerations
4.0 MATERIALS
     4.1 Material Selection
     4.2 Bonding Material
     4.3 Laminate Materials
     4.4 Flexible Substrates
     4.5 Conductive Materials
     4.6 Organic Protective Coatings
     4.7 Marking and Legends
     4.8 Thickness Class Tolerance
5.0 MECHANICAL/PHYSICAL PROPERTIES
     5.1 Fabrication Requirements
     5.2 Product/Board Configuration
     5.3 Assembly Requirements
     5.4 Dimensioning Systems
     5.5 Structural Strength
6.0 ELECTRICAL PROPERTIES
7.0 THERMAL MANAGEMENT
     7.1 Convection
     7.2 Heat Dissipation Considerations
8.0 COMPONENT AND ASSEMBLY ISSUES
     8.1 General Placement Requirements
     8.2 Plated-Through Hole Requirements
     8.3 Mounting Methods for Connectors
     8.4 Stiffeners
     8.5 Fine Pitch SMT (Peripherals)
     8.6 Array SMT (BGA, ?BGA, etc.)
     8.7 Bare Die
     8.8 Tape Automated Bonding
     8.9 Castellations
     8.10 Bottom Only Terminations
9.0 HOLES/INTERCONNECTIONS
     9.1 General Requirements for Lands with Holes
     9.2 Holes
     9.3 Drill Size Recommendations for Printed
          Boards
10.0 GENERAL CIRCUIT FEATURE REQUIREMENTS
     10.1 Conductor Characteristics
     10.2 Land Characteristics
11.0 DOCUMENTATION
     11.1 Artwork
12.0 QUALITY ASSURANCE
Figures
Tables

Establishes the requirements for the design of printed boards for PC card form factors. The organic materials may be reinforced, homogeneous, or used in combination with inorganic materials; interconnections may be single, double or multilayered.