• IPC 2224 : 0

    Withdrawn A Withdrawn Standard is one, which is removed from sale, and its unique number can no longer be used. The Standard can be withdrawn and not replaced, or it can be withdrawn and replaced by a Standard with a different number.

    SECTIONAL STANDARD FOR DESIGN OF PWBS FOR PC CARDS

    Available format(s): 

    Withdrawn date:  22-05-2016

    Language(s): 

    Published date: 

    Publisher:  Institute of Printed Circuits

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    Table of Contents - (Show below) - (Hide below)

    1.0 SCOPE
         1.1 Purpose
         1.2 Documentation Hierarchy
         1.3 Presentation
         1.4 Interpretation
         1.5 Classification of Products
    2.0 APPLICABLE DOCUMENTS
         2.1 Reference Documents
    3.0 GENERAL REQUIREMENTS
         3.1 Test Requirement Considerations
    4.0 MATERIALS
         4.1 Material Selection
         4.2 Bonding Material
         4.3 Laminate Materials
         4.4 Flexible Substrates
         4.5 Conductive Materials
         4.6 Organic Protective Coatings
         4.7 Marking and Legends
         4.8 Thickness Class Tolerance
    5.0 MECHANICAL/PHYSICAL PROPERTIES
         5.1 Fabrication Requirements
         5.2 Product/Board Configuration
         5.3 Assembly Requirements
         5.4 Dimensioning Systems
         5.5 Structural Strength
    6.0 ELECTRICAL PROPERTIES
    7.0 THERMAL MANAGEMENT
         7.1 Convection
         7.2 Heat Dissipation Considerations
    8.0 COMPONENT AND ASSEMBLY ISSUES
         8.1 General Placement Requirements
         8.2 Plated-Through Hole Requirements
         8.3 Mounting Methods for Connectors
         8.4 Stiffeners
         8.5 Fine Pitch SMT (Peripherals)
         8.6 Array SMT (BGA, ?BGA, etc.)
         8.7 Bare Die
         8.8 Tape Automated Bonding
         8.9 Castellations
         8.10 Bottom Only Terminations
    9.0 HOLES/INTERCONNECTIONS
         9.1 General Requirements for Lands with Holes
         9.2 Holes
         9.3 Drill Size Recommendations for Printed
              Boards
    10.0 GENERAL CIRCUIT FEATURE REQUIREMENTS
         10.1 Conductor Characteristics
         10.2 Land Characteristics
    11.0 DOCUMENTATION
         11.1 Artwork
    12.0 QUALITY ASSURANCE
    Figures
    Tables

    Abstract - (Show below) - (Hide below)

    Establishes the requirements for the design of printed boards for PC card form factors. The organic materials may be reinforced, homogeneous, or used in combination with inorganic materials; interconnections may be single, double or multilayered.

    General Product Information - (Show below) - (Hide below)

    Development Note To be used in conjunction with IPC 2221. (06/2002) Included in IPC 2220 Series. Also available in CD-ROM format. (09/2005)
    Document Type Standard
    Publisher Institute of Printed Circuits
    Status Withdrawn

    Standards Referenced By This Book - (Show below) - (Hide below)

    ASME Y14.24 : 2012 TYPES AND APPLICATIONS OF ENGINEERING DRAWINGS - ENGINEERING DRAWING AND RELATED DOCUMENTATION PRACTICES

    Standards Referencing This Book - (Show below) - (Hide below)

    IPC A 600 : H ACCEPTABILITY OF PRINTED BOARDS
    IPC 2220 : LATEST IPC 2220 FAMILY OF DESIGN DOCUMENTS
    IPC 2141 : A DESIGN GUIDE FOR HIGH-SPEED CONTROLLED IMPEDANCE CIRCUIT BOARDS
    IPC CM 770 : E COMPONENT MOUNTING GUIDELINES FOR PRINTED BOARDS
    IPC S 100 : LATEST STANDARDS AND SPECIFICATIONS MANUAL
    IPC 4101 : D SPECIFICATION FOR BASE MATERIALS FOR RIGID AND MULTILAYER PRINTED BOARDS
    IPC 2221B:2012 GENERIC STANDARD ON PRINTED BOARD DESIGN
    IPC 2222 : A SECTIONAL DESIGN STANDARD FOR RIGID ORGANIC PRINTED BOARDS
    IPC M 106 : LATEST TECHNOLOGY REFERENCE FOR DESIGN MANUAL
    IPC D 317 : A1995 DESIGN GUIDELINES FOR ELECTRONIC PACKAGING UTILIZING HIGH SPEED TECHNIQUES
    IPC D 316 : 1995 HIGH FREQUENCY DESIGN GUIDE
    IPC SM 782 : A1993 AMD 2 1999 SURFACE MOUNT DESIGN AND LAND PATTERN STANDARD
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