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SECTIONAL STANDARD FOR DESIGN OF PWBS FOR PC CARDS
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Withdrawn date: 22-05-2016
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Publisher: Institute of Printed Circuits
1.0 SCOPE 1.1 Purpose 1.2 Documentation Hierarchy 1.3 Presentation 1.4 Interpretation 1.5 Classification of Products2.0 APPLICABLE DOCUMENTS 2.1 Reference Documents3.0 GENERAL REQUIREMENTS 3.1 Test Requirement Considerations4.0 MATERIALS 4.1 Material Selection 4.2 Bonding Material 4.3 Laminate Materials 4.4 Flexible Substrates 4.5 Conductive Materials 4.6 Organic Protective Coatings 4.7 Marking and Legends 4.8 Thickness Class Tolerance 5.0 MECHANICAL/PHYSICAL PROPERTIES 5.1 Fabrication Requirements 5.2 Product/Board Configuration 5.3 Assembly Requirements 5.4 Dimensioning Systems 5.5 Structural Strength6.0 ELECTRICAL PROPERTIES7.0 THERMAL MANAGEMENT 7.1 Convection 7.2 Heat Dissipation Considerations8.0 COMPONENT AND ASSEMBLY ISSUES 8.1 General Placement Requirements 8.2 Plated-Through Hole Requirements 8.3 Mounting Methods for Connectors 8.4 Stiffeners 8.5 Fine Pitch SMT (Peripherals) 8.6 Array SMT (BGA, ?BGA, etc.) 8.7 Bare Die 8.8 Tape Automated Bonding 8.9 Castellations 8.10 Bottom Only Terminations9.0 HOLES/INTERCONNECTIONS 9.1 General Requirements for Lands with Holes 9.2 Holes 9.3 Drill Size Recommendations for Printed Boards10.0 GENERAL CIRCUIT FEATURE REQUIREMENTS 10.1 Conductor Characteristics 10.2 Land Characteristics 11.0 DOCUMENTATION 11.1 Artwork12.0 QUALITY ASSURANCEFiguresTables
Establishes the requirements for the design of printed boards for PC card form factors. The organic materials may be reinforced, homogeneous, or used in combination with inorganic materials; interconnections may be single, double or multilayered.
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