IPC 2225 : 0

1.0 SCOPE
     1.1 Purpose
     1.2 Documentation Hierarchy
     1.3 Presentation
     1.4 Interpretation
     1.5 Classification of Products
     1.6 Terms and Definitions
2.0 APPLICABLE DOCUMENTS
     2.1 Institute for Interconnecting and Packaging
          Electronic Circuits (IPC)
     2.2 Department of Defense
     2.3 Other Documents
3.0 GENERAL REQUIREMENTS
     3.1 Design Layout
     3.2 Test Requirement Considerations
4.0 MATERIALS
     4.1 Material Selection
     4.2 Dielectric Base Materials (Including
          Prepregs and Adhesives)
     4.3 Laminate Materials
     4.4 Conductive Materials
     4.5 Electronic Component Materials (Buried
          Resistors and Capacitors)
     4.6 Encapsulants, Underfill Materials, and Die
          Adhesives
     4.7 Markings and Legends
5.0 MECHANICAL/PHYSICAL PROPERTIES
6.0 ELECTRICAL PROPERTIES
7.0 THERMAL MANAGEMENT
     7.1 Heat Dissipation Considerations
     7.2 Comparison with Ceramic
8.0 COMPONENT AND ASSEMBLY ISSUES
     8.1 General Placement Requirements
     8.2 Attachment Processes
     8.3 Cleaning
     8.4 Attachment Inspection
     8.5 Electrical Test
     8.6 Tape Automated Bonding
9.0 HOLES/INTERCONNECTIONS
     9.1 Microvia Fabrication Methods
     9.2 Types of Holes
10.0 GENERAL CIRCUIT FEATURE REQUIREMENTS
     10.1 Conductor Characteristics
     10.2 Land Characteristics
11.0 DOCUMENTATION
     11.1 Procurement Documentation Requirements
     11.2 Multichip Module (MCM-L) Interconnecting
          Structure
     11.3 Multichip Module (MCM-L) Construction
     11.4 Multichip Module (MCM-L) Materials
          and Specifications
     11.5 Hole Formation
     11.6 Conductor Definition
     11.7 Marking
     11.8 Processing Conditions
     11.9 Special Electrical Performance Requirements
     11.10 Configuration and Revision Control
     11.11 Parts List(s)
     11.12 Assembly Drawing
     11.13 Electrical Test Requirements
     11.14 Schematic/Logic Diagram
     11.16 Automated Documentation Package
12.0 QUALITY ASSURANCE
Figures
Tables

Establishes the requirements and other considerations (thermal, electrical, mechanical and electromechanical) for the design of organic mounting structure used to interconnect chip components, which in combination form the completed functional Single Chip Module (SCM-L), MCM, or MCM-L assemblies.