IPC FLXCSP0706-CD : 2006
Withdrawn
Withdrawn
A Withdrawn Standard is one, which is removed from sale, and its unique number can no longer be used. The Standard can be withdrawn and not replaced, or it can be withdrawn and replaced by a Standard with a different number.
IPC INTERNATIONAL CONFERENCE ON FLEXIBLE CIRCUITS AND CHIP SCALE PACKAGING
Withdrawn date
14-09-2023
Published date
23-11-2012
Publisher
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Describes circuitry and chip scale packaging (CSP) designs, materials and applications.
| DevelopmentNote |
Available in CD-ROM format. (09/2006) Supersedes IPC FLXCSP0605-CD. (08/2008)
|
| DocumentType |
Standard
|
| PublisherName |
Institute of Printed Circuits
|
| Status |
Withdrawn
|
| Supersedes |
| IPC 4202 : A | FLEXIBLE BASE DIELECTRICS FOR USE IN FLEXIBLE PRINTED BOARDS |
| IPC 4203 : A | COVER AND BONDING MATERIAL FOR FLEXIBLE PRINTED CIRCUITRY |
| IPC FLXCSP04-CD : 2004 | FLEX & CHIPS - IPC INTERNATIONAL CONFERENCE ON FLEXIBLE CIRCUITS, CHIP SCALE AND BARE DIE |
| IPC 4204 : A | FLEXIBLE METAL-CLAD DIELECTRICS FOR USE IN FABRICATION OF FLEXIBLE PRINTED CIRCUITRY |
| IPC 6013 : C | QUALIFICATION AND PERFORMANCE SPECIFICATION FOR FLEXIBLE/RIGID-FLEXIBLE PRINTED BOARDS |
| IPC 2223 : C | SECTIONAL DESIGN STANDARD FOR FLEXIBLE/RIGID-FLEXIBLE PRINTED BOARDS |
| IPC FLXCSP0605-CD : 2005 | IPC INTERNATIONAL CONFERENCE ON FLEXIBLE CIRCUITS, CHIP SCALE PACKAGING AND RADIO FREQUENCY IDENTIFICATION |
| IPC FLXCSP03 : 2003 | "FLEX AND CHIPS" - IPC INTERNATIONAL CONFERENCE ON FLEXIBLE CIRCUITS AND CHIPS SCALE PACKAGING - HARD COPY & CD-ROM |
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