IPC L 115 : B
Superseded
A superseded Standard is one, which is fully replaced by another Standard, which is a new edition of the same Standard.
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SPECIFICATION FOR RIGID METAL-CLAD BASE MATERIALS FOR PRINTED BOARDS
01-12-1997
12-01-2013
Covers the requirements for high-temperature performance, metal-clad, fully-cured, laminated plastic sheets, to be used primarily for the fabrication of printed wiring boards for electrical and electronic circuits. Applies to sheets when the laminate is 0.79mm (0.031 inch) or greater in nominal overall thickness.
| DocumentType |
Standard
|
| PublisherName |
Institute of Printed Circuits
|
| Status |
Superseded
|
| SupersededBy | |
| Supersedes |
| IPC L 108 : B | SPECIFICATION FOR THIN METAL CLAD BASE MATERIALS FOR MULTILAYER PRINTED BOARDS |
| IPC ML 950 : C1980 | RIGID MULTILAYER PRINTED BOARDS, PERFORMANCE SPECIFICATION FOR, |
| IPC D 949 : 1987 | RIGID MULTILAYER PRINTED BOARDS, DESIGN STANDARD FOR, |
| IPC CC 110 : A 1997 | GUIDELINES FOR SELECTING CORE CONSTRUCTIONS FOR MULTILAYER PRINTED WIRING BOARD APPLICATIONS |
| IPC A 600 : H | ACCEPTABILITY OF PRINTED BOARDS |
| IPC T 50 : M | TERMS AND DEFINITIONS FOR INTERCONNECTING AND PACKAGING ELECTRONIC CIRCUITS |
| IPC FC 150 : E | COPPER FOIL FOR PRINTED WIRING APPLICATIONS |
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