IPC L 108 : B
Superseded
A superseded Standard is one, which is fully replaced by another Standard, which is a new edition of the same Standard.
SPECIFICATION FOR THIN METAL CLAD BASE MATERIALS FOR MULTILAYER PRINTED BOARDS
Hardcopy , PDF
English
01-06-1990
01-03-1998
Covers the requirement for high-temperature, fully-cured, metal-clad, thin laminated plastic sheets, to be used primarily for high-temperature multilayered and thin printed boards for electrical and electronic circuits. This specification applies to sheets when the base laminate does not exceed 0.79mm (0.031 inch) in nominal thickness. Recognizes that printed boards are subject to classifications by intended end-item usage. Thus, where applicable, for ordering purposes the multilayer printed board laminate material is specified.
| DocumentType |
Standard
|
| Pages |
76
|
| PublisherName |
IPC by Global Electronics Association
|
| Status |
Superseded
|
| RC.AERO 54407 : 1981 | MATERIALS FOR SINGLE AND DOUBLE SIDED PRINTED CIRCUIT BOARDS |
| IPC CC 110 : A 1997 | GUIDELINES FOR SELECTING CORE CONSTRUCTIONS FOR MULTILAYER PRINTED WIRING BOARD APPLICATIONS |
| IPC RF 245 : 1987 | RIGID-FLEX PRINTED BOARDS, PERFORMANCE SPECIFICATION FOR, |
| IPC MC 324 : 1988 | PERFORMANCE SPECIFICATIONS FOR METAL CORE BOARDS |
| IPC L 115 : B | SPECIFICATION FOR RIGID METAL-CLAD BASE MATERIALS FOR PRINTED BOARDS |