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IPC M 107 : LATEST

Superseded

Superseded

A superseded Standard is one, which is fully replaced by another Standard, which is a new edition of the same Standard.

View Superseded by

STANDARDS FOR PRINTED BOARD MATERIALS MANUAL

Superseded date

01-06-2008

Superseded by

IPC C 107 : 2008

Published date

12-01-2013

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Includes requirements for various reinforcements and foils, laminates, prepreg, and HDI materials for adding to the final product.

DevelopmentNote
Includes IPC T 50, IPC L 125, IPC EG 140, IPC SG 141, IPC A 142, IPC QF 143, IPC CF 148, IPC CF 152, IPC 4101, IPC 4110, IPC 4130, IPC 4411, IPC 4104, IPC 4121, IPC 4130, IPC 4562, IPC 4821 & IPC WP/TR 584. (09/2007) Includes IPC 4563. (02/2008) Includes IPC 4811. (06/2008)
DocumentType
Standard
PublisherName
Institute of Printed Circuits
Status
Superseded
SupersededBy

IPC 4121 : 0 GUIDELINES FOR SELECTING CORE CONSTRUCTIONS FOR MULTILAYER PRINTED WIRING BOARD APPLICATIONS
IPC 4821 : 0 SPECIFICATION FOR EMBEDDED PASSIVE DEVICE CAPACITOR MATERIALS FOR RIGID AND MULTILAYER PRINTED BOARDS
IPC 4130 : 0 SPECIFICATION AND CHARACTERIZATION METHODS FOR NONWOVEN 'E' GLASS MATERIALS
IPC CF 152 : B COMPOSITE METALLIC MATERIAL SPECIFICATION FOR PRINTED WIRING BOARDS
IPC 4110 : 0 SPECIFICATION AND CHARACTERIZATION METHODS FOR NONWOVEN CELLULOSE BASED PAPER FOR PRINTED BOARDS
IPC A 142 : 0 SPECIFICATION FOR FINISHED FABRIC WOVEN FROM ARAMID FOR PRINTED BOARDS
IPC SG 141 : 0 SPECIFICATION FOR FINISHED FABRIC WOVEN FROM 'S' GLASS FOR PRINTED BOARDS
IPC 4104 : 1999 SPECIFICATION FOR HIGH DENSITY INTERCONNECT (HDI) AND MICROVIA MATERIALS
IPC QF 143 : 0 SPECIFICATION FOR FINISHED FABRIC WOVEN FROM QUARTZ (PURE FUSED SILICA) FOR PRINTED BOARDS

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