IPC MC 790 : 0
Current
The latest, up-to-date edition.
GUIDELINES FOR MULTICHIP MODULE TECHNOLOGY UTILIZATION
Hardcopy
English
01-07-1992
Important note : Users cannot be edited or removed once added to your Multi user PDF.Provides information on Multichip Module Technology including parametric data, design and manufacturing information, and a proposed categorization of the various approaches to multichip interconnect substrate technologies based on dielectric 'family'. Additional descriptive information regarding many of the issues and tradeoffs surrounding this technology may be obtained from the references in the Bibliography.
| DevelopmentNote |
Included in IPC C 103 & IPC C 1000. (08/2008)
|
| DocumentType |
Standard
|
| Pages |
12
|
| PublisherName |
Institute of Printed Circuits
|
| Status |
Current
|
| IPC 2221 GERMAN : B | GENERIC STANDARD ON PRINTED BOARD DESIGN |
| IPC SM 780 : 0 | COMPONENT PACKAGING AND INTERCONNECTING WITH EMPHASIS ON SURFACE MOUNTING |
| IPC DD 135 : 0 | QUALIFICATION TESTING FOR DEPOSITED ORGANIC INTERLAYER DIELECTRIC MATERIALS FOR MULTICHIP MODULES |
| IPC 6015 : 0 | QUALIFICATION AND PERFORMANCE SPECIFICATION FOR ORGANIC MULTICHIP MODULE MOUNTING AND INTERCONNECTING STRUCTURES |
| IPC 2221B:2012 | GENERIC STANDARD ON PRINTED BOARD DESIGN |
| IPC 2221 FRENCH : B2012 | GENERIC STANDARD ON PRINTED BOARD DESIGN |
| IPC 2220 : LATEST | IPC 2220 FAMILY OF DESIGN DOCUMENTS |
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