IPC MC 790 : 0
Current
Current
The latest, up-to-date edition.
GUIDELINES FOR MULTICHIP MODULE TECHNOLOGY UTILIZATION
Available format(s)
PDF
Language(s)
English
Published date
01-07-1992
Publisher
Excluding VAT
Provides information on Multichip Module Technology including parametric data, design and manufacturing information, and a proposed categorization of the various approaches to multichip interconnect substrate technologies based on dielectric 'family'. Additional descriptive information regarding many of the issues and tradeoffs surrounding this technology may be obtained from the references in the Bibliography.
| DevelopmentNote |
Included in IPC C 103 & IPC C 1000. (08/2008)
|
| DocumentType |
Standard
|
| Pages |
12
|
| PublisherName |
IPC by Global Electronics Association
|
| Status |
Current
|
| IPC SM 780 : 0 | COMPONENT PACKAGING AND INTERCONNECTING WITH EMPHASIS ON SURFACE MOUNTING |
| IPC DD 135 : 0 | QUALIFICATION TESTING FOR DEPOSITED ORGANIC INTERLAYER DIELECTRIC MATERIALS FOR MULTICHIP MODULES |
| IPC 6015 : 0 | QUALIFICATION AND PERFORMANCE SPECIFICATION FOR ORGANIC MULTICHIP MODULE MOUNTING AND INTERCONNECTING STRUCTURES |
| IPC 2221B:2012 | GENERIC STANDARD ON PRINTED BOARD DESIGN |
Summarise