Skip to content
Please enter a keyword to search

  • MIL-STD-2000 Revision A:1991

    Withdrawn A Withdrawn Standard is one, which is removed from sale, and its unique number can no longer be used. The Standard can be withdrawn and not replaced, or it can be withdrawn and replaced by a Standard with a different number.

    STANDARD REQUIREMENTS FOR SOLDERED ELECTRICAL AND ELECTRONIC ASSEMBLIES

    Available format(s):  PDF

    Withdrawn date:  07-06-1995

    Language(s): 

    Published date: 

    Publisher:  US Military Specs/Standards/Handbooks

    Add To Cart

    Table of Contents - (Show below) - (Hide below)

    1. SCOPE
    1.1 Scope
    1.2 Discrete device exclusion
    1.3 Other applications
    2. APPLICABLE DOCUMENTS
    2.1 Government documents
    2.2 Non-Government publications
    2.3 Order of precedence
    3. TERMS AND DEFINITIONS
    3.1 Terms and definitions
    4. GENERAL REQUIREMENTS
    4.1 Interrelation of applicable documents
    4.2 Visual aids
    4.3 Workmanship
    4.4 Disposition of defects
    4.5 Harness and cable assemblies
    4.6 Materials
    4.7 Printed wiring
    4.8 Solder mask
    4.9 Conformal coating of all assemblies
    4.10 Interference spacing
    4.11 Eyelets
    4.12 Detailed part mounting
    4.13 Component misregistration
    4.14 Coefficient of Thermal Expansion (CTE) mismatch
            compensation
    4.15 Lead bends
    4.16 Stress relief
    4.17 Devices mounted over circuitry
    4.18 Stacking (piggybacking)
    4.19 Adhesive coverage limits
    4.20 General solder connection characteristics
    4.21 General printed wiring requirements
    4.22 Through-hole solder connections
    4.23 Surface mount solder connections
    4.24 Attachment of leads and wires
    4.25 Terminal and connector configuration
    4.26 Part markings and reference designations
    5. DETAIL REQUIREMENTS
    5.1 Latent failure prevention
    5.2 Defect prevention
    5.3 Process controls and defect reduction
    6. NOTES
    6.1 Manufacture of devices incorporating magnetic
            windings
    6.2 Guidance on requirement flowdown
    6.3 Guidance on inspection power selection and
            defect identification
    6.4 Supersession note
    6.5 Subject term (key word) listing
    6.6 Use of metric units
    6.7 Changes from previous issue
    Figures
    1. Flat bodied terminal
    2. Lead bends
    3. Typical stress relief bends
    4. Plated-through hole interfacial and interlayer
          connections
    5. Solder in the lead bend radius
    6. Chip resistor
    7. Mounting of chips
    8. Chip side overhang
    9. Minimum lap of chip on terminal area
    10. Solder fillet - chip devices
    11. Excessive solder - parts encased
    12. Mounting of MELFs
    13. MELF solder fillet
    14. Leadless chip carrier solder fillet
    15. Parallelism of chip devices
    16. Surface mounted device lead forming
    17. Lead overhang
    18. Surface mounted device lead toe overhang
    19. Surface mounted device lead heel clearance
    20. Surface mounted device lead height off land
    21. Surface mounted device round or coined lead
          solder fillet
    22. J-lead and V-lead solder fillet
    23. Maximum chip canting
    24. Wire and lead wrap/continuous runs
    25. Wire and lead soldering to small slotted terminal
    26. Wire and lead soldering to contacts
    27. Wire and lead soldering to solder cups
    28. Internal connector lead configurations
    Tables
    I. Defects
    II. Conductor spacing (uncoated printed wiring boards)
          (sea level to 10,000 feet)
    III. Conductor spacing (uncoated printed wiring boards)
          (over 10,000 feet)
    IV. Contamination limits
    Appendix A
    10. Scope
    20. Applicable documents
    30. Terms and definitions
    40. General requirements
    Appendix B
    10. Scope
    20. Applicable documents
    30. Terms and definitions
    40. General requirements
    Figures
    B-1. Lead termination (clinched leads)
    B-2. Blocked plated-through holes
    B-3. Clinched wire interfacial connections
    B-4. Meniscus clearance
    B-5. Mounting of freestanding nonaxial-leaded
          components
    B-6. Typical standoff devices (footed)
    B-7. Mounting components using standoffs
    B-8. Typical standoff devices (internal cavities)
    B-9. Rolled flange terminals
    B-10. Flare and extension of funnel flanges
    B-11. Dual hole configuration for interfacial and inter-
          layer terminal mountings
    B-12. Standoff terminal interfacial connection
    B-13. Stress relief for lead wiring
    B-15. Lead dress
    B-16. Side route connections and wrap on bifurcated
          terminals
    B-17. Typical pierced or perforated terminal wire wrap
    B-18. Body positioning of part with coined lead
    Appendix C
    10. Scope
    20. Applicable documents
    30. Terms and definitions
    40. General requirements
    Tables
    C-I. Cleanliness test values
    C-II. Equivalence factors for testing ionic contamination

    Abstract - (Show below) - (Hide below)

    Specifies materials and methods for creating soldered electrical and electronic connections. Coverage includes applicable documents, interrelation of applicable documents, specialised technologies, disposition of defects, process variances, materials, solder, flux, use of nonrosin fluxes, workmanship, visual aids, conductor finish, partial hole fill, stacking of chips, and wire and strand condition. Also gives terms and definitions.

    General Product Information - (Show below) - (Hide below)

    Development Note Supersedes DOD STD 2000/2 and DOD STD 2000/4 (11/2003) Supersedes MIL S 50826 (B) (08/2004)
    Document Type Standard
    Publisher US Military Specs/Standards/Handbooks
    Status Withdrawn
    Supersedes

    Standards Referenced By This Book - (Show below) - (Hide below)

    MIL-E-16400 Revision H:1987 ELECTRONIC, INTERIOR COMMUNICATIONS AND NAVIGATION EQUIPMENT, NAVAL SHIP AND SHORE, GENERAL SPECIFICATION FOR
    MIL-R-29583 Base Document:1992 RADIO SET
    GEIA TA HB 0009 : 2013 RELIABILITY PROGRAM HANDBOOK
    MIL-A-48607 Revision B:1991 AMPLIFIER, DOPPLER, ASSEMBLY: 11740261
    MIL-I-85071 Revision A:1992 INVERTERS, AIRCRAFT, DC TO AC, GENERAL SPECIFICATION FOR
    MIL-HDBK-11991 Base Document:1996 DESIGN OF ELECTRICAL, ELECTRONIC, AND ELECTRO-MECHANICAL EQUIPMENT, GUIDED MISSILE AND ASSOCIATED WEAPONS SYSTEMS
    MIL-I-29589 Base Document:1991 INTERROGATOR SET, AN/UPX-24(V)
    MIL-I-49394 Revision A:1991 Interrogator Set AN/TPX-46A (V) 7 (No S/S Document)
    MIL-HDBK-1587 Base Document:1996 MATERIALS AND PROCESS REQUIREMENTS FOR AIR FORCE WEAPON SYSTEM
    QQ-S-571 Revision F:1994 SOLDER, ELECTRONIC (96 TO 485 DEGREES C)
    MIL-F-14256 Revision F:1993 FLUX, SOLDERING, LIQUID (ROSIN BASE)
    MIL T 28800 : E TEST EQUIPMENT FOR USE WITH ELECTRICAL AND ELECTRONIC EQUIPMENT GENERAL SPECIFICATION FOR
    API TR 18TR4 : 2017 EVALUATION OF WELDING REQUIREMENTS AS APPLICABLE TO API PRODUCT SPECIFICATIONS
    MIL-C-48481 Revision C:1995 CIRCUIT CARD ASSEMBLY - FTS INPUT SIMULATER AND DL TEST
    MIL-D-64022 Base Document:1991 DISTRIBUTION BOX ASSEMBLY: 8438325
    MIL-E-45782 Revision C:1993 ELECTRICAL WIRING, PROCEDURES FOR
    MIL-STD-1250 Revision A:1992 CORROSION PREVENTION AND DETERIORATION CONTROL IN ELECTRONIC COMPONENTS AND ASSEMBLIES
    MIL-A-24233 Revision B:1989 ANTENNA, AS-1735( )/SRC
    MIL-HDBK-1250 Revision A:1995 CORROSION PREVENTION AND DETERIORATION CONTROL IN ELECTRONIC COMPONENTS AND ASSEMBLIES
    MIL-HDBK-344 Revision A:1993 ENVIRONMENTAL STRESS SCREENING (ESS) OF ELECTRONIC EQUIPMENT
    MIL E 917 : E ELECTRIC POWER EQUIPMENT, BASIC REQUIREMENTS (NAVAL SHIPBOARD USE)
    MIL-A-70702 Revision B:1991 AZIMUTH DRIVE ASSEMBLE: 9360802
    MIL-F-70823 Revision A:1994 FUZE, ELECTRONIC TIME, M762 LOADING, ASSEMBLING, PACKING AND FUZE, ELECTRONIC TIME, M767 LESS BOOSTER
    MIL-F-13926 Revision B:1984 FIRE CONTROL MATERIAL MANUFACTURE AND INSPECTION, GENERAL SPECIFICATION FOR
    04/302050 DC : DRAFT JAN 2004 ISO 13628-6 - PETROLEUM AND NATURAL GAS INDUSTRIES - DESIGN AND OPERATION OF SUBSEA PRODUCTION SYSTEMS - PART 6: SUBSEA PRODUCTION CONTROL SYSTEMS
    MIL-C-71044 Base Document:1992 CIRCUIT BOARD, BATTERY TEST 11784531
    PREN ISO 13628-6 : DRAFT 2012 PETROLEUM AND NATURAL GAS INDUSTRIES - DESIGN AND OPERATION OF SUBSEA PRODUCTION SYSTEMS - PART 6: SUBSEA PRODUCTION CONTROL SYSTEMS (ISO/DIS 13628-6:2012)
    MIL-T-70835 Revision A:1991 TRANSMITTER, ASSEMBLY: 11784701
    MIL-P-70995 Base Document:1991 PANEL, CONTROL, ARMAMENT SUBSYSTEM; M21
    MIL A 29563 : 0 ANTENNA SYSTEM, AIMS SHIPBOARD, ELECTRONICALLY STEERED OE-120/UPX
    NASA KSC STD E 0010 : 1994 SOLDERING OF ELECTRICAL CONNECTIONS (HAND OR MACHINE), STANDARD FOR
    JSSG-2006 Base Document:1998 JOINT SERVICE SPECIFICATION GUIDE - AIRCRAFT STRUCTURES
    MIL P 62736 : 1992 PRINTED WIRING ASSEMBLY
    MIL-M-71074 Revision A:1995 MODEM, VEHICLE MOTION SENSOR: 12561737
    MIL-C-50344 Revision B:1990 COUNTER ELECTRONIC
    MIL-F-85400 Base Document:1980 FUSE, GUIDED MISSILE, DUMMY FMU-138(D-1)/B
    MIL-F-85815 Revision A:1993 FUSE, BOMB, ELECTRONIC FMU-139A/B
    MIL-C-48480 Revision C:1995 CIRCUIT CARD ASSEMBLY - LOGIC AND REFERENCE
    MIL-F-85744 Base Document:1987 FUSE, PROXIMITY, DISPENSER FMU-140/B
    MIL-A-52879 Revision C:1992 Alarm, Audible, BZ-204/FSS-9(V) (No S/S Document)
    MIL-C-71043 Base Document:1991 CIRCUIT CARD ASSEMBLY, AMPLIFIER 11784526
    MIL-P-48189 Revision D:1992 PROJECTILE, 155MM, HE, M692 AND M731 HOUSING, TIMING AND FUZING FOR
    MIL B 29595 : 0 BATTERIES AND CELLS, LITHIUM, AIRCRAFT, GENERAL SPECIFICATION FOR
    API 17F REDLINE : 2006 SPECIFICATION FOR SUBSEA PRODUCTION CONTROL SYSTEMS
    ISO 13628-6:2006 Petroleum and natural gas industries Design and operation of subsea production systems Part 6: Subsea production control systems
    BS EN ISO 13628-6:2006 Petroleum and natural gas industries. Design and operation of subsea production systems Subsea production control systems
    EN ISO 13628-6:2006 Petroleum and natural gas industries - Design and operation of subsea production systems - Part 6: Subsea production control systems (ISO 13628-6:2006)
    MIL-E-29581 Base Document:1991 EARCUP, UNIT ACTIVE NOISE REDUCTION SYSTEM
    12/30250727 DC BS EN ISO 13628-6 - PETROLEUM AND NATURAL GAS INDUSTRIES - DESIGN AND OPERATION OF SUBSEA PRODUCTION SYSTEMS - PART 6: SUBSEA PRODUCTION CONTROL SYSTEMS
    MIL P 7788 : F PANEL, INFORMATION INTEGRALLY ILLUMINATED
    MIL-B-71003 Base Document:1991 BATTERY ELIMINATOR ASSEMBLY
    MIL-A-53129 Base Document:1992 ALARM-MONITOR GROUP OA-9431/FSS-9(V)
    MIL-S-47314 Base Document:1990 SWITCH, MOMENTARY, ACCELERATION-SENSITIVE
    MIL-T-81490 Revision A:1991 TRANSMISSION LINES, TRANSVERSE ELECTROMAGNETIC MODE
    MIL-I-2220 Revision C:1991 INSTRUMENT, ELECTRICAL MEASURING, HYDROGEN GAS INDICATING, NONPORTABLE,[SUBMARINE USE]
    MIL C 7115 : F CONVERTER, AIRCRAFT, GENERAL SPECIFICATION FOR
    MIL-P-24764 Base Document:1991 POWER SUPPLIES, SHIPBOARD, ELECTRONIC, GENERAL SPECIFICATION FOR
    MIL-P-48494 Revision A:1995
    MIL-A-70833 Revision A:1991 AUTOMATIC TANK TARGET: 11784501
    MIL P 62738 : 1992 PRINTED WIRING ASSEMBLY, IGNITION INTERRUPT DRIVER
    SAE AS 83519 : 2015 SHIELD TERMINATION, SOLDER STYLE, INSULATED, HEAT-SHRINKABLE, ENVIRONMENT RESISTANT GENERAL SPECIFICATION FOR

    Standards Referencing This Book - (Show below) - (Hide below)

    MIL-STD-2118 Base Document:1984 FLEXIBLE AND RIGID FLEX PRINTED WIRING FOR ELECTRONIC EQUIPMENT DESIGN REQUIREMENTS FOR
    IPC T 50 : M TERMS AND DEFINITIONS FOR INTERCONNECTING AND PACKAGING ELECTRONIC CIRCUITS
    MIL-STD-2119 Revision A:1990 DESIGN REQUIREMENTS FOR PRINTED WIRING ELECTRICAL BACKPLANE ASSEMBLIES
    MIL-STD-883 Revision K:2016 TEST METHOD STANDARD - MICROCIRCUITS
    DOD-STD-1866 Base Document:1968 SOLDERING PROCESS GENERAL (NON ELECTRICAL)
    MIL-C-28859 Revision B:1990 CONNECTOR COMPONENT PART, ELECTRICAL BACK PLANE, PRINTED WIRING, GENERAL SPECIFICATION FOR
    MIL-STD-275 Revision E:1984 PRINTED WIRING - ELECTRONIC EQUIPMENT
    MIL-I-46058 Revision C:1972 Insulating Compound, Electrical (for Coating Printed Circuit Assemblies)
    MIL-STD-1686 Revision C:1995 ELECTROSTATIC DISCHARGE CONTROL PROGRAM FOR PROTECTION OF ELECTRICAL AND ELECTRONIC PARTS, ASSEMBLIES AND EQUIPMENT (EXCLUDING ELECTRICALLY INITIATED EXPLOSIVE DEVICES)
    IPC DW 425 : A DESIGN AND END PRODUCT REQUIREMENTS FOR DISCRETE WIRING BOARDS
    MIL-STD-750 Revision F:2011 TEST METHODS FOR SEMICONDUCTOR DEVICES
    MIL-E-22118 Revision B:1974 ENAMEL, ELECTRICAL INSULATING
    IPC SM 840 : E QUALIFICATION AND PERFORMANCE SPECIFICATION OF PERMANENT SOLDER MASK AND FLEXIBLE COVER MATERIALS
    IPC A 610 : F ACCEPTABILITY OF ELECTRONIC ASSEMBLIES
    MIL T 27 : E TRANSFORMERS AND INDUCTORS (AUDIO POWER AND HIGH POWER PULSE) GENERAL SPECIFICATION FOR
    MIL-A-28870 Revision A:1990 ASSEMBLIES, ELECTRICAL BACKPLANE, PRINTED WIRING, GENERAL SPECIFICATION FOR
    QQ-S-571 Revision F:1994 SOLDER, ELECTRONIC (96 TO 485 DEGREES C)
    MIL-S-83519 Revision A:1984 SPLICE, SHIELD TERMINATION, SOLDER STYLE, INSULATION, HEAT SHRINKABLE, ENVIRONMENT RESISTANT, GENERAL SPECIFICATION FOR
    MIL-F-14256 Revision F:1993 FLUX, SOLDERING, LIQUID (ROSIN BASE)
    MIL-P-81728 Revision A:1973 PLATING, TIN LEAD, (ELECTRODEPOSITED)
    IPC HM 860 : 0 SPECIFICATION FOR MULTILAYER HYBRID CIRCUITS
    MIL-STD-202 Revision H:2015 ELECTRONIC AND ELECTRICAL COMPONENT PARTS
    MIL-STD-2166 Base Document:1984 CONNECTION, ELECTRICAL COMPLAINT PIN
    MIL P 55110 : LATEST PRINTED WIRING BOARD, RIGID GENERAL SPECIFICATION FOR
    MIL P 28809 : A PRINTED WIRING ASSEMBLIES
    QQ-N-290 Revision A:1971 NICKEL PLATING (ELECTRODEPOSITED)
    MIL P 50884 : E PRINTED WIRING BOARD, FLEXIBLE OR RIGID-FLEX, GENERAL SPECIFICATION FOR
    View more information

    • Access your standards online with a subscription

      Features

      • Simple online access to standards, technical information and regulations
      • Critical updates of standards and customisable alerts and notifications
      • Multi - user online standards collection: secure, flexibile and cost effective