Development Note
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Indice de classement: C20-783. PR NF EN 60068-2-83 April 2010. (04/2010) |
Document Type
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Standard |
ISBN
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Pages
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Published
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Publisher
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Association Francaise de Normalisation
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Status
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Current |
IEC 60068-1:2013
|
Environmental testing - Part 1: General and guidance |
IEC 60068-2-58:2015+AMD1:2017 CSV
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Environmental testing - Part 2-58: Tests - Test Td: Test methods for solderability, resistance to dissolution of metallization and to soldering heat of surface mounting devices (SMD) |
IEC 60068-2-20:2008
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Environmental testing - Part 2-20: Tests - Test T: Test methods for solderability and resistance to soldering heat of devices with leads |
IEC 60194:2015
|
Printed board design, manufacture and assembly - Terms and definitions |
IEC 61190-1-3:2007+AMD1:2010 CSV
|
Attachment materials for electronic assembly - Part 1-3: Requirements for electronic grade solder alloys and fluxed and non-fluxed solid solders for electronic soldering applications |
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