NF EN 60749-5 : 2003
Withdrawn
A Withdrawn Standard is one, which is removed from sale, and its unique number can no longer be used. The Standard can be withdrawn and not replaced, or it can be withdrawn and replaced by a Standard with a different number.
View Superseded by
SEMICONDUCTOR DEVICES - MECHANICAL AND CLIMATIC TEST METHODS - PART 5: STEADY-STATE TEMPERATURE HUMIDITY BIAS LIFE TEST
04-10-2021
12-01-2013
Foreword
1 Scope
2 Normative references
3 General
4 Equipment
5 Test conditions
6 Procedures
7 Failure criteria
8 Safety
9 Summary
Annex ZA (normative) Normative references to international
publications with their corresponding European
Publications
Covers a steady-state temperature and humidity bias life test for the purpose of evaluating the reliability of non-hermetic packaged solid-state devices in humid environments.
| DevelopmentNote |
Indice de Classement: C96-022-5 PR NF EN 60749-5 April 2002. (03/2002) Supersedes NF EN 60749. (06/2007)
|
| DocumentType |
Standard
|
| PublisherName |
Association Francaise de Normalisation
|
| Status |
Withdrawn
|
| SupersededBy |
| Standards | Relationship |
| IEC 60749-5:2017 | Identical |
| UNE-EN 60749-5:2003 | Identical |
| NBN EN 60749-5 : 2004 | Identical |
| SN EN 60749-5 : 2003 | Identical |
| BS EN 60749-5:2017 | Identical |
| EN 60749-5:2017 | Identical |
| I.S. EN 60749-5:2017 | Identical |
| DIN EN 60749-5:2003-09 | Identical |
| NF EN 60749-30 : 2005 AMD 1 2011 | SEMICONDUCTOR DEVICES - MECHANICAL AND CLIMATIC TEST METHODS - PART 30: PRECONDITIONING OF NON-HERMETIC SURFACE MOUNT DEVICES PRIOR TO RELIABILITY TESTING |
| IEC 60749-4:2017 | Semiconductor devices - Mechanical and climatic test methods - Part 4: Damp heat, steady state, highly accelerated stress test (HAST) |
| NF EN 60749-4 : 2002 | SEMICONDUCTOR DEVICES - MECHANICAL AND CLIMATIC TEST METHODS - PART 4: DAMP HEAT, STEADY STATE, HIGHLY ACCELERATED STRESS TEST (HAST) |
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