PD CLC/TR 62258-3:2007

INTRODUCTION
1 Scope and object
2 Normative references
3 Terms and definitions
4 Handling - Good practice
   4.1 General
   4.2 Working environmental controls
   4.3 General handling precautions
   4.4 Cleanroom good practice
5 Process handling issues
   5.1 Wafer sawing
   5.2 Die sorting
6 Die and wafer transport and storage media
   6.1 Wafer carriers and cassettes
   6.2 In-process carriers and transport systems
   6.3 Packing for shipment of unsawn wafers
   6.4 Packing for shipment of sawn wafers
   6.5 Packing for shipment of single wafers
   6.6 Packing for shipment of die using trays
   6.7 Packing for shipment of die using tape-and-reel
   6.8 Secondary packing for shipment
7 Storage good practice
   7.1 Die and wafer storage
   7.2 Short-term storage environment and conditions
   7.3 Storage time limitations
   7.4 Sawn wafer on wafer frame or ring
   7.5 Die products in the production area
   7.6 Die in tape-and-reel
   7.7 Dry-packed die products
8 Traceability good practice
   8.1 General
   8.2 Wafer traceability
   8.3 Die products traceability
   8.4 Wafer and die back side marking
9 Guidelines for long-term storage (die banking) of bare die
   and wafers
   9.1 General
   9.2 Preparing for storage
   9.3 Damage to die products during long-term storage
   9.4 Long-term storage environment
   9.5 Recommended inert atmosphere purity
   9.6 Chemical contamination
   9.7 Electrical effects
   9.8 Protection from radiation
   9.9 Periodic qualification of stored die products
10 Good practice for automated handling during assembly
   10.1 Removal of die from shipping media
   10.2 Equipment out of service
Annex A (informative) - Planning checklist
Annex B (informative) - Material specifications
Annex ZA (normative) - Normative references to international
                      publications with their corresponding
                      European publications
Bibliography

Facilitates the production, supply and use of semiconductor die products, including: - wafers, - singulated bare die, - die and wafers with attached connection structures, and - minimally or partially encapsulated die and wafers.

IEC 60855-1:2016 is applicable to insulating foam-filled tubes and solid rods, of a circular cross-section, made of synthetic materials with reinforced fibreglass and intended to be used in the manufacture and construction of tools, devices and equipment for carrying out live working on electrical systems operating at voltages above 1 kV. This second edition cancels and replaces the first edition published in 2009. This edition constitutes a technical revision.