PD IEC/TS 62239-2:2017
Current
The latest, up-to-date edition.
Process management for avionics. Management plan Preparation and maintenance of an electronic COTS assembly management plan
Hardcopy , PDF
English
31-03-2017
FOREWORD
INTRODUCTION
1 Scope
2 Normative references
3 Terms, definitions and abbreviated terms
4 Technical requirements
5 Plan administration
Annex A (informative) - Template for tailoring the
requirements of IEC TS 62239-2
Annex B (informative) - Cross-reference between
IEC TS 62239-2 and SAE EIA-933B
Annex C (informative) - Electronic COTS assembly
design guidelines and COTS assembly
manufacturer's risk assessment
Annex D (informative) - Typical electronic COTS
assembly mitigation methods and techniques
Annex E (informative) - Requirements matrix for
IEC TS 62239-2
Bibliography
Pertains to the development of COTS assembly management plans (CAMPs) for the integration and management of electronic COTS assemblies in electronic systems used in the ADHP markets where reliability is generally critical.
Committee |
GEL/107
|
DocumentType |
Standard
|
Pages |
68
|
PublisherName |
British Standards Institution
|
Status |
Current
|
This part of IEC 62239, which is a technical specification, applies to the development of COTS assembly management plans (CAMPs) for the integration and management of electronic COTS assemblies (see 3.1.13 and 3.1.20) in electronic systems used in the ADHP markets where reliability is generally critical.
NOTE 1 Best practices for managing the electronic components within the electronic assemblies are described in IEC TS 62239-1 and SAE EIA-STD-4899 which describe the electronic component management program (ECMP). In cases where the electronic components can be identified and managed at the component level, ECMP can be considered as an option to manage the components.
NOTE 2 The distinction between an electronic component and an electronic assembly is provided by the definitions in Clause 3. This distinction between an electronic component and an electronic assembly is not always recognized by industry: for example, filters, contactors, power supply modules, relays, magnetic assemblies, etc., can be considered as either components or assemblies. In each application it is considered a best practice for the user of this document to clarify this distinction.
Depending on program or product line requirements and/or the technical characteristics of the electronic COTS assemblies and in agreement with the customer, the electronic COTS assembly management plans (CAMPs) could consider tailoring the requirements of this document. See Annex A.
Although developed for the avionics industry, this document can be applied by other high performance and high reliability industries at their discretion.
Standards | Relationship |
IEC TS 62239-2:2017 | Identical |
EN 9100:2009 | Quality Management Systems - Requirements for Aviation, Space and Defense Organizations |
SAE AS 5553B : 2016 | COUNTERFEIT ELECTRICAL, ELECTRONIC, AND ELECTROMECHANICAL (EEE) PARTS; AVOIDANCE, DETECTION, MITIGATION, AND DISPOSITION |
VITA 47 : 2005(R2007) | ENVIRONMENTS, DESIGN AND CONSTRUCTION, SAFETY, AND QUALITY FOR PLUG-IN UNITS STANDARD |
SAE AS 6174 : 2014 | COUNTERFEIT MATERIEL - ASSURING ACQUISITION OF AUTHENTIC AND CONFORMING MATERIEL |
MIL-STD-883 Revision K:2016 | TEST METHOD STANDARD - MICROCIRCUITS |
ASTM E 1678 : 2015 : REDLINE | Standard Test Method for Measuring Smoke Toxicity for Use in Fire Hazard Analysis |
DEFSTAN 05-135/1(2014) : 2014 | AVOIDANCE OF COUNTERFEIT MATERIEL |
MIL-STD-810 Revision G:2008 | ENVIRONMENTAL ENGINEERING CONSIDERATIONS AND LABORATORY TESTS |
IEC 61340-5-1:2016 | Electrostatics - Part 5-1: Protection of electronic devices from electrostatic phenomena - General requirements |
GEIA GEB 1 : 2000 | DIMINISHING MANUFACTURING SOURCES AND MATERIAL SHORTAGES (DMSMS) MANAGEMENT PRACTICES |
IEC/ISO 31010:2009 | Risk management - Risk assessment techniques |
ISO 31000:2009 | Risk management Principles and guidelines |
ISO/TS 16949:2009 | Quality management systems Particular requirements for the application of ISO 9001:2008 for automotive production and relevant service part organizations |
MIL-STD-1521 Revision B:1985 | TECHNICAL REVIEWS AND AUDITS FOR SYSTEMS, EQUIPMENTS, AND COMPUTER SOFTWARE |
IEC TR 61340-5-2:2007 | Electrostatics - Part 5-2: Protection of electronic devices from electrostatic phenomena - User guide |
IEC TS 62668-1:2016 | Process management for avionics - Counterfeit prevention - Part 1: Avoiding the use of counterfeit, fraudulent and recycled electronic components |
VITA 53.0 : 2010 | STANDARD FOR COMMERCIAL TECHNOLOGY MARKET SURVEILLANCE |
RTCA DO 254 : 2000 | DESIGN ASSURANCE GUIDANCE FOR AIRBORNE ELECTRONIC HARDWARE |
IEC TR 62240-1:2013 | Process management for avionics - Electronic components capability in operation - Part 1: Temperature uprating |
IEC TS 62239-1:2015 | Process management for avionics - Management plan - Part 1: Preparation and maintenance of an electronic components management plan |
IPC J STD 033C-1:2014 | HANDLING, PACKING, SHIPPING AND USE OF MOISTURE, REFLOW, AND PROCESS SENSITIVE DEVICES |
SAE ARP 4761 : 1996 | GUIDELINES AND METHODS FOR CONDUCTION THE SAFETY ASSESSMENT PROCESS ON CIVIL AIRBORNE SYSTEMS AND EQUIPMENT |
SAE ARP 6338 : 2015 | PROCESS FOR ASSESSMENT AND MITIGATION OF EARLY WEAROUT OF LIFE-LIMITED MICROCIRCUITS |
GEIA SSB 1 : 2000 | GUIDELINES FOR USING PLASTIC ENCAPSULATED MICROCIRCUITS AND SEMICONDUCTORS IN MILITARY, AEROSPACE AND OTHER RUGGED APPLICATIONS |
MIL-HDBK-217 Revision F:1991 | RELIABILITY PREDICTION OF ELECTRONIC EQUIPMENT |
MIL-HDBK-263 Revision B:1994 | ELECTROSTATIC DISCHARGE CONTROL HANDBOOK FOR PROTECTION OF ELECTRICAL & ELECTRONIC PARTS, ASSEMBLIES & EQUIPMENT |
MIL-STD-882 Revision E:2012 | System Safety |
IEC 62402:2007 | Obsolescence management - Application guide |
IEC 60300-1:2014 | Dependability management - Part 1: Guidance for management and application |
GEIA STD 0016 : 2012 | PREPARING A DMSMS MANAGEMENT PLAN |
IEC 62396-3:2013 | Process management for avionics - Atmospheric radiation effects - Part 3: System design optimization to accommodate the single event effects (SEE) of atmospheric radiation |
GEIA STD 0010 : 2008 | BEST PRACTICES FOR SYSTEM SAFETY PROGRAM DEVELOPMENT AND EXECUTION |
ISO 9001:2015 | Quality management systems — Requirements |
SAE ARP 5890 : 2011 | GUIDELINES FOR PREPARING RELIABILITY ASSESSMENT PLANS FOR ELECTRONIC ENGINE CONTROLS |
GEIA STD 0005-1 : 2012 | PERFORMANCE STANDARD FOR AEROSPACE AND HIGH PERFORMANCE ELECTRONIC SYSTEMS CONTAINING LEAD-FREE SOLDER |
IEC TS 62647-1:2012 | Process management for avionics - Aerospace and defence electronic systems containing lead-free solder - Part 1: Preparation for a lead-free control plan |
SAE AS 6496 : 2014 | FRAUDULENT/COUNTERFEIT ELECTRONIC PARTS: AVOIDANCE, DETECTION, MITIGATION, AND DISPOSITION - AUTHORIZED/FRANCHISED DISTRIBUTION |
GEIA STD 0008 : 2011 | DERATING OF ELECTRONIC COMPONENTS |
IEC 62396-1:2016 | Process management for avionics - Atmospheric radiation effects - Part 1: Accommodation of atmospheric radiation effects via single event effects within avionics electronic equipment |
IEC 62435-2:2017 | Electronic components - Long-term storage of electronic semiconductor devices - Part 2: Deterioration mechanisms |
ISO 10007:2017 | Quality management — Guidelines for configuration management |
GEIA STD 0003 : 2006 | LONG TERM STORAGE OF ELECTRONIC DEVICES |
IEC 62435-5:2017 | Electronic components - Long-term storage of electronic semiconductor devices - Part 5: Die and wafer devices |
EN 9120:2010 | Quality Management Systems - Requirements for Aviation, Space and Defence Distributors |
ISO Guide 73:2009 | Risk management — Vocabulary |
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