SEMI 3D2 : 2016
Current
Current
The latest, up-to-date edition.
SPECIFICATION FOR GLASS CARRIER WAFERS FOR 3DS-IC APPLICATIONS
Published date
07-02-2013
Pertains to address the needs of the 3D Stacked IC (3DS-IC) industry by providing the tools needed to procure glass carrier wafers to be used in a 3DS-IC process.
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