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SEMI M45 : 2010(R2017)

SEMI M45 : 2010(R2017)

Current

Current

The latest, up-to-date edition.

SPECIFICATION FOR 300 MM WAFER SHIPPING SYSTEM

Published date

12-01-2013

Publisher

Semiconductor Equipment & Materials Institute

Specifies materials relating to transport of 300 mm wafers using Shipping Boxes (FOSB) regulated by SEMI M31, and includes wafer shipping boxes, bags, labels, cushions, secondary containers, pallets, and shipping documentation.

DevelopmentNote
Not available for sale from ILI, customer to contact SEMI. (05/2001)
DocumentType
Standard
PublisherName
Semiconductor Equipment & Materials Institute
Status
Current

SEMI M8 : 2012 SPECIFICATION FOR POLISHED MONOCRYSTALLINE SILICON TEST WAFERS
SEMI M38 : 2012(R2018) SPECIFICATION FOR POLISHED RECLAIMED SILICON WAFERS
SEMI T3 : 2013 SPECIFICATION FOR WAFER BOX LABELS
SEMI M24 : 2007 SPECIFICATION FOR POLISHED MONOCRYSTALLINE SILICON PREMIUM WAFERS
SEMI 3D10 : 2014 GUIDE TO DESCRIBING MATERIALS PROPERTIES FOR INTERMEDIATE WAFERS FOR USE IN A 300 MM 3DS-IC WAFER STACK
SEMI M1 : 2017 SPECIFICATION FOR POLISHED SINGLE CRYSTAL SILICON WAFERS
SEMI 3D9 : 2014 GUIDE FOR DESCRIBING MATERIALS PROPERTIES FOR A 300 MM 3DS-IC WAFER STACK
SEMI 3D16 : 2016 SPECIFICATION FOR GLASS BASE MATERIAL FOR SEMICONDUCTOR PACKAGING
SEMI 3D8 : 2014 GUIDE FOR DESCRIBING SILICON WAFERS FOR USE AS 300 MM CARRIER WAFERS IN A 3DS-IC TEMPORARY BOND-DEBOND (TBDB) PROCESS
SEMI M62 : 2017 SPECIFICATIONS FOR SILICON EPITAXIAL WAFERS
SEMI M31 : 2008 MECHANICAL SPECIFICATION FOR FRONT-OPENING SHIPPING BOX USED TO TRANSPORT AND SHIP 300 MM WAFERS
SEMI 3D2 : 2016 SPECIFICATION FOR GLASS CARRIER WAFERS FOR 3DS-IC APPLICATIONS
SEMI M57 : 2016 SPECIFICATION FOR SILICON ANNEALED WAFERS
SEMI M26 : 2004(R2010) GUIDE FOR THE RE-USE OF 100, 125, 150, AND 200 MM WAFER SHIPPING BOXES USED TO TRANSPORT WAFERS

SEMI T3 : 2013 SPECIFICATION FOR WAFER BOX LABELS
SEMI M31 : 2008 MECHANICAL SPECIFICATION FOR FRONT-OPENING SHIPPING BOX USED TO TRANSPORT AND SHIP 300 MM WAFERS

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