Name: SEMI E119 : JUL 2006(R2012)
Brand: SEMI

MECHANICAL SPECIFICATION FOR REDUCED-PITCH FRONT-OPENING BOX FOR INTERFACTORY TRANSPORT OF 300 MM WAFERS

Published date

12-01-2013

Publisher

Semiconductor Equipment & Materials Institute

Describes a reduced-pitch front-opening box for interfactory transport of 300 mm wafers (FOBIT).

DevelopmentNote	Not available for sale from ILI, customer to contact SEMI. (12/2002) Also available in CD-ROM. (07/2006)
DocumentType	Standard
PublisherName	Semiconductor Equipment & Materials Institute
Status	Current

SEMI 3D16 : 2016	SPECIFICATION FOR GLASS BASE MATERIAL FOR SEMICONDUCTOR PACKAGING
SEMI M31 : 2008	MECHANICAL SPECIFICATION FOR FRONT-OPENING SHIPPING BOX USED TO TRANSPORT AND SHIP 300 MM WAFERS
SEMI 3D2 : 2016	SPECIFICATION FOR GLASS CARRIER WAFERS FOR 3DS-IC APPLICATIONS

SEMI E1-9 : NOV 2006E	MECHANICAL SPECIFICATION FOR CASSETTES USED TO TRANSPORT AND STORE 300 MM WAFERS
SEMI E62 : NOV 2006(R2012)	SPECIFICATION FOR 300 MM FRONT-OPENING INTERFACE MECHANICAL STANDARD (FIMS)
SEMI E15-1 : 2005(R2010)	SPECIFICATION FOR 300 MM TOOL LOAD PORT
SEMI E57 : 2000E2(R2010)	SPECIFICATION FOR KINEMATIC COUPLINGS USED TO ALIGN AND SUPPORT 300 MM WAFER CARRIERS
SEMI M31 : 2008	MECHANICAL SPECIFICATION FOR FRONT-OPENING SHIPPING BOX USED TO TRANSPORT AND SHIP 300 MM WAFERS
SEMI E15 : 1998E2(R2016)	SPECIFICATION FOR TOOL LOAD PORT
SEMI E47.1 : NOV 2006	MECHANICAL SPECIFICATION FOR FOUPS USED TO TRANSPORT AND STORE 300 MM WAFERS

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SEMI E119 : JUL 2006(R2012)