SEMI G74 : 1999(R2015)
Superseded
Superseded
A superseded Standard is one, which is fully replaced by another Standard, which is a new edition of the same Standard.
View Superseded by
SPECIFICATION FOR TAPE FRAME FOR 300 MM WAFERS
Superseded date
08-02-2021
Superseded by
Published date
12-01-2013
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Describes the specifications for 300 mm wafer tape frames used between the dicing process and the die-bonding process.
| DevelopmentNote |
Not available for sale from ILI, customer to contact SEMI. (05/2001)
|
| DocumentType |
Standard
|
| PublisherName |
Semiconductor Equipment & Materials Institute
|
| Status |
Superseded
|
| SupersededBy |
| SEMI G94:2013 | SPECIFICATION FOR COIN-STACK TYPE TAPE FRAME SHIPPING CONTAINER FOR 300 MM WAFER |
| SEMI G77 : 1999(R2015) | SPECIFICATION FOR FRAME CASSETTE FOR 300 MM WAFERS |
| SEMI E106 : 2004 | OVERVIEW GUIDE TO SEMI STANDARDS FOR PHYSICAL INTERFACES AND CARRIERS FOR 300 MM WAFERS |
| SEMI 3D3:2013 | GUIDE FOR MULTIWAFER TRANSPORT AND STORAGE CONTAINERS FOR 300 MM, THIN SILICON WAFERS ON TAPE FRAMES |
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