Comment Closes On
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Committee
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EPL/501 |
Document Type
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Draft |
ISBN
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Pages
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Published
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Publisher
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British Standards Institution
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Status
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Superseded |
Superseded By
|
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IEC 60068-1:2013
|
Environmental testing - Part 1: General and guidance |
IEC 60068-2-58:2015+AMD1:2017 CSV
|
Environmental testing - Part 2-58: Tests - Test Td: Test methods for solderability, resistance to dissolution of metallization and to soldering heat of surface mounting devices (SMD) |
IEC 60068-2-20:2008
|
Environmental testing - Part 2-20: Tests - Test T: Test methods for solderability and resistance to soldering heat of devices with leads |
IEC 61190-1-2:2014
|
Attachment materials for electronic assembly - Part 1-2: Requirements for soldering pastes for high-quality interconnects in electronics assembly |
IEC 61189-5:2006
|
Test methods for electrical materials, interconnection structures and assemblies - Part 5: Test methods for printed board assemblies |
IEC 60068-2-54:2006
|
Environmental testing - Part 2-54: Tests - Test Ta: Solderability testing of electronic components by the wetting balance method |
IEC 61190-1-1:2002
|
Attachment materials for electronic assembly - Part 1-1: Requirements for soldering fluxes for high-quality interconnections in electronics assembly |
IEC 60194:2015
|
Printed board design, manufacture and assembly - Terms and definitions |
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