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  • 12/30274796 DC : 0

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    BS IEC 61189-5-2 ED.1 - TEST METHODS FOR ELECTRICAL MATERIALS, INTERCONNECTION STRUCTURES AND ASSEMBLIES - PART 5-2: TEST METHODS FOR PRINTED BOARD ASSEMBLIES: SOLDERING FLUX

    Available format(s):  Hardcopy, PDF

    Superseded date:  31-01-2015

    Language(s):  English

    Published date: 

    Publisher:  British Standards Institution

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    Table of Contents - (Show below) - (Hide below)

    FOREWORD
    INTRODUCTION
    1 Scope
    2 Normative references
    3 Accuracy, precision and resolution
    4 Test methods for Soldering flux
    5 C: Chemical test methods
    Bibliography

    General Product Information - (Show below) - (Hide below)

    Comment Closes On
    Committee EPL/501
    Document Type Draft
    Publisher British Standards Institution
    Status Superseded
    Superseded By

    Standards Referencing This Book - (Show below) - (Hide below)

    IEC 60068-1:2013 Environmental testing - Part 1: General and guidance
    IEC 60068-2-20:2008 Environmental testing - Part 2-20: Tests - Test T: Test methods for solderability and resistance to soldering heat of devices with leads
    IEC 61190-1-2:2014 Attachment materials for electronic assembly - Part 1-2: Requirements for soldering pastes for high-quality interconnects in electronics assembly
    IEC 61249-2-7:2002 Materials for printed boards and other interconnecting structures - Part 2-7: Reinforced base materials clad and unclad - Epoxide woven E-glass laminated sheet of defined flammability (vertical burning test), copper-clad
    ISO 9455-2:1993 Soft soldering fluxes Test methods Part 2: Determination of non-volatile matter, ebulliometric method
    IEC 61189-1:1997+AMD1:2001 CSV Test methods for electrical materials, interconnection structures and assemblies - Part 1: General test methods and methodology
    IEC 61189-6:2006 Test methods for electrical materials, interconnection structures and assemblies - Part 6: Test methods for materials used in manufacturing electronic assemblies
    IEC 62137:2004 Environmental and endurance testing - Test methods for surface-mount boards of area array type packages FBGA, BGA, FLGA, LGA, SON and QFN
    ISO 9455-1:1990 Soft soldering fluxes — Test methods — Part 1: Determination of non-volatile matter, gravimetric method
    IEC 61190-1-1:2002 Attachment materials for electronic assembly - Part 1-1: Requirements for soldering fluxes for high-quality interconnections in electronics assembly
    IEC 61189-3:2007 Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 3: Test methods for interconnection structures (printed boards)
    ISO 5725-2:1994 Accuracy (trueness and precision) of measurement methods and results Part 2: Basic method for the determination of repeatability and reproducibility of a standard measurement method
    ISO 9001:2015 Quality management systems — Requirements
    IPC 9201 : A SURFACE INSULATION RESISTANCE HANDBOOK
    IPC TR 467 : 0 SUPPORTING DATA AND NUMERICAL EXAMPLES FOR J-STD-001 (CONTROL OF FLUXES)
    IEC 61190-1-3:2007+AMD1:2010 CSV Attachment materials for electronic assembly - Part 1-3: Requirements for electronic grade solder alloys and fluxed and non-fluxed solid solders for electronic soldering applications
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