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  • 14/30309696 DC : 0

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    Superseded A superseded Standard is one, which is fully replaced by another Standard, which is a new edition of the same Standard.
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    BS EN 60068-2-69 ED 3.0 - ENVIRONMENTAL TESTING - PART 2-69: TESTS - TEST TE: SOLDERABILITY TESTING OF ELECTRONIC COMPONENTS AND BOARDS BY THE WETTING BALANCE (FORCE MEASUREMENT) METHOD

    Available format(s):  Hardcopy, PDF

    Superseded date:  31-07-2017

    Language(s):  English

    Published date: 

    Publisher:  British Standards Institution

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    Table of Contents - (Show below) - (Hide below)

    1 Scope
    2 Normative references
    3 Terms and definitions
    4 General description of the method
    5 Description of the test apparatus
    6 Preparation of specimens
    7 Materials
    8 Procedures
    9 Presentation of results
    10 Information to be given in the relevant specification
    Annex A (normative) - Equipment specification
    Annex B (informative) - Use of the wetting balance for
            SMD solderability testing
    Annex C (Informative) - Test methods for ultra-miniature
            sized components
    Bibliography

    General Product Information - (Show below) - (Hide below)

    Comment Closes On
    Committee EPL/501
    Document Type Draft
    Publisher British Standards Institution
    Status Superseded
    Superseded By

    Standards Referencing This Book - (Show below) - (Hide below)

    IEC 60068-1:2013 Environmental testing - Part 1: General and guidance
    IEC 60068-2-20:2008 Environmental testing - Part 2-20: Tests - Test T: Test methods for solderability and resistance to soldering heat of devices with leads
    ISO 9454-1:2016 Soft soldering fluxes Classification and requirements Part 1: Classification, labelling and packaging
    IPC J STD 002 : D SOLDERABILITY TESTS FOR COMPONENT LEADS, TERMINATIONS, LUGS, TERMINALS AND WIRES
    IEC 61190-1-1:2002 Attachment materials for electronic assembly - Part 1-1: Requirements for soldering fluxes for high-quality interconnections in electronics assembly
    ISO 9453:2014 Soft solder alloys Chemical compositions and forms
    IPC J STD 003 : C SOLDERABILITY TESTS FOR PRINTED BOARDS
    IEC 60068-2-44:1995 Environmental testing - Part 2-44: Tests - Guidance on test T: Soldering
    IEC 61190-1-3:2007+AMD1:2010 CSV Attachment materials for electronic assembly - Part 1-3: Requirements for electronic grade solder alloys and fluxed and non-fluxed solid solders for electronic soldering applications
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