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    I.S. EN 61188-5-4:2007

    Current The latest, up-to-date edition.

    PRINTED BOARDS AND PRINTED BOARD ASSEMBLIES - DESIGN AND USE - PART 5-4: ATTACHMENT (LAND/JOINT) CONSIDERATIONS - COMPONENTS WITH J LEADS ON TWO SIDES

    Available format(s):  Hardcopy, PDF

    Language(s):  English

    Published date:  01-01-2007

    Publisher:  National Standards Authority of Ireland

    For Harmonized Standards, check the EU site to confirm that the Standard is cited in the Official Journal.
    Only cited Standards give presumption of conformance to New Approach Directives/Regulations.

    Dates of withdrawal of national standards are available from NSAI.

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    Table of Contents - (Show below) - (Hide below)

    FOREWORD
    INTRODUCTION
    1 Scope
    2 Normative references
    3 General information
      3.1 General component description
      3.2 Marking
      3.3 Packaging
      3.4 Process considerations
    4 Small outlined J packages (SOJ)
      4.1 Component description
      4.2 Component dimensions
      4.3 Solder joint fillet design
      4.4 Land pattern dimensions
    Annex ZA (normative) - Normative references to international
                           publications with their corresponding
                           European publications
    Bibliography

    Abstract - (Show below) - (Hide below)

    Describes the component and land pattern dimensions for small outline integrated circuits with 'J' leads on two sides (SOJ components) used in the reflow soldering process.

    General Product Information - (Show below) - (Hide below)

    Development Note For CENELEC adoptions of IEC publications, please check www.iec.ch to be sure that you have any corrigenda that may apply. (01/2017)
    Document Type Standard
    Publisher National Standards Authority of Ireland
    Status Current

    Standards Referencing This Book - (Show below) - (Hide below)

    EN 60286-5:2004/A1:2009 PACKAGING OF COMPONENTS FOR AUTOMATIC HANDLING - PART 5: MATRIX TRAYS
    IEC 60068-2-58:2015+AMD1:2017 CSV Environmental testing - Part 2-58: Tests - Test Td: Test methods for solderability, resistance to dissolution of metallization and to soldering heat of surface mounting devices (SMD)
    EN 61760-1:2006 SURFACE MOUNTING TECHNOLOGY - PART 1: STANDARD METHOD FOR THE SPECIFICATION OF SURFACE MOUNTING COMPONENTS (SMDS)
    IEC 61760-1:2006 Surface mounting technology - Part 1: Standard method for the specification of surface mounting components (SMDs)
    IEC 60286-5:2003+AMD1:2009 CSV Packaging of components for automatic handling - Part 5: Matrixtrays
    EN 60286-3:2013/AC:2013 PACKAGING OF COMPONENTS FOR AUTOMATIC HANDLING - PART 3: PACKAGING OF SURFACE MOUNT COMPONENTS ON CONTINUOUS TAPES (IEC 60286-3:2013)
    IEC 61191-1:2013 Printed board assemblies - Part 1: Generic specification - Requirements for soldered electrical and electronic assemblies using surface mount and related assembly technologies
    IEC 61188-5-1:2002 Printed boards and printed board assemblies - Design and use - Part 5-1: Attachment (land/joint) considerations - Generic requirements
    IEC 61191-2:2017 Printed board assemblies - Part 2: Sectional specification - Requirements for surface mount soldered assemblies
    IEC 60286-3:2013 Packaging of components for automatic handling - Part 3: Packaging of surface mount components on continuous tapes
    EN 60286-4:2013 Packaging of components for automatic handling - Part 4: Stick magazines for electronic components encapsulated in packages of different forms
    IEC 60286-4:2013 Packaging of components for automatic handling - Part 4: Stick magazines for electronic components encapsulated in packages of different forms
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